Abstract: A gate driving circuit is provided. The gate driving circuit includes multistage driving modules, where an Nth stage driving module includes a setting circuit, a first driving circuit, an isolating switch circuit, a second driving circuit and an anti-noise circuit. The setting circuit generates a first precharge signal according to a gate driving signal of an (N?2)th scan line or a start signal. The isolating switch circuit coupled between the first driving circuit and the second driving circuit provides a second precharge signal, so as to effectively avoid a flickering problem of a display image caused by a surge of the gate driving signal due to a coupling effect of a parasitic capacitance of the transistor and a bootstrap capacitor, and meanwhile the bootstrap capacitor is not used, so as to effectively reduce a bezel area.

Abstract: A method includes inspecting a mask to locate a defect region for a defect of the mask. A phase distribution of an aerial image of the defect region is acquired. A point spread function of an imaging system is determined. One or more repair regions of the mask are identified based on the phase distribution of the aerial image of the defect region and the point spread function. A repair process is performed to the one or more repair regions of the mask to form one or more repair features.

Abstract: A method includes inspecting a mask to locate a defect region for a defect of the mask. A phase distribution of an aerial image of the defect region is acquired. A point spread function of an imaging system is determined. One or more repair regions of the mask are identified based on the phase distribution of the aerial image of the defect region and the point spread function. A repair process is performed to the one or more repair regions of the mask to form one or more repair features.

Abstract: The present disclosure provides a lithography system comprising a radiation source and an exposure tool including a plurality of exposure columns densely packed in a first direction. Each exposure column includes an exposure area configured to pass the radiation source. The system also includes a wafer carrier configured to secure and move one or more wafers along a second direction that is perpendicular to the first direction, so that the one or more wafers are exposed by the exposure tool to form patterns along the second direction. The one or more wafers are covered with resist layer and aligned in the second direction on the wafer carrier.

Abstract: A display panel includes a substrate, and a pixel array and a gate driving circuit. The gate driving circuit provides gate driving signals to the pixel array, and includes shift registers, wherein each shift register includes a voltage providing unit, a first driving transistor, a voltage transmitting unit and a second driving transistor. The voltage providing unit receives a setting signal and a system high voltage to provide a first terminal voltage. The first driving transistor receives a first clock signal and the first terminal voltage to provide a first gate driving signal. The voltage transmitting unit receives the first gate driving signal to provide a second terminal voltage. The second driving transistor receives a second clock signal and the second terminal voltage to provide a second gate driving signal. Therefore, the influence caused by large difference of driving capabilities of the first and the second driving transistor is avoided.

Abstract: A display panel includes a substrate, and a pixel array and a gate driving circuit. The gate driving circuit provides gate driving signals to the pixel array, and includes shift registers, wherein each shift register includes a voltage providing unit, a first driving transistor, a voltage transmitting unit and a second driving transistor. The voltage providing unit receives a setting signal and a system high voltage to provide a first terminal voltage. The first driving transistor receives a first clock signal and the first terminal voltage to provide a first gate driving signal. The voltage transmitting unit receives the first gate driving signal to provide a second terminal voltage. The second driving transistor receives a second clock signal and the second terminal voltage to provide a second gate driving signal. Therefore, the influence caused by large difference of driving capabilities of the first and the second driving transistor is avoided.

Abstract: A system and method for maskless direct write lithography are disclosed. The method includes receiving a plurality of pixels that represent an integrated circuit (IC) layout; identifying a first subset of the pixels that are suitable for a first compression method; and identifying a second subset of the pixels that are suitable for a second compression method. The method further includes compressing the first and second subset using the first and second compression method respectively, resulting in compressed data. The method further includes delivering the compressed data to a maskless direct writer for manufacturing a substrate. In embodiments, the first compression method uses a run-length encoding and the second compression method uses a dictionary-based encoding. Due to the hybrid compression method, the compressed data can be decompressed with a data rate expansion ratio sufficient for high-volume IC manufacturing.

Abstract: A verification apparatus and a verification method are provided in this disclosure. The verification apparatus is suitable for touch display panel which comprises multiple partitions. The verification apparatus includes signal generating circuit and verification switch circuit. The signal generating circuit is configured to generate verification voltage. The verification switch circuit comprises multiple switch units which is separately coupled to the partitions and the signal generating circuit, and is configured to deliver verification voltage simultaneously to a least two of multiple partitions.

Abstract: A driving circuit in this disclosure includes plural stages of shift register circuits. Every stage in the shift register circuits includes an enabling control circuit, a first output circuit, a second output circuit and a disabling control circuit. The enabling circuit is configured to control the voltage of the first operation node according to enabling signal. The first output unit is configured to generate the first driving signal according to the voltage of the first operation node and the first clock signal. The second output unit is configured to generate the second driving signal according to the voltage of the first operation node and the second clock signal. The disabling control unit is used to pull low the voltage of the first operation node and output terminal of the first and second output unit to the reference voltage according to the first, third, and fourth clock signals.

Abstract: The present disclosure provides one embodiment of an IC method. First pattern densities (PDs) of a plurality of templates of an IC design layout are received. Then a high PD outlier template and a low PD outlier template from the plurality of templates are identified. The high PD outlier template is split into multiple subsets of template and each subset of template carries a portion of PD of the high PD outlier template. A PD uniformity (PDU) optimization is performed to the low PD outlier template and multiple individual exposure processes are applied by using respective subset of templates.

Abstract: The present disclosure provides one embodiment of an IC method that includes receiving an IC design layout, which has a plurality of main features and a plurality of space blocks. The IC method also includes calculating an optimized block dummy density ratio r0 to optimize a uniformity of pattern density (UPD), determining a target block dummy density ratio R, determining size, pitch and type of a non-printable dummy feature, generating a pattern for dummy features and adding the dummy features in the IC design layout.

Abstract: Lithography methods disclosed herein accommodate shrinking pattern dimensions. An exemplary method includes receiving a pattern to be transferred to a workpiece by a pattern generator. The pattern generator is divided into a first segment set and a second segment set based on the pattern, such that a collective exposure dose from the first segment set and the second segment set satisfies an exposure dose specified by the pattern. The first segment set is offset from the second segment set in a first direction, and segments in the first segment set and segments in the second segment set are offset from each other in a second direction different than the first direction. The method further includes exposing the workpiece according to the first segment set and the second segment set.

Abstract: A technique for converting design shapes into pixel values is provided. The technique may be used to control a direct-write or other lithographic process performed on a workpiece. In an exemplary embodiment, the method includes receiving, at a computing system, a design database specifying a feature having more than four vertices. The computing system also receives a pixel grid. A set of rectangles corresponding to the feature is determined, and the computing system determines an area of a pixel of the pixel grid overlapped by the feature based on the set of rectangles. In some such embodiments, a lithographic exposure intensity is determined for the pixel based on the area overlapped by the feature, and the lithographic exposure intensity is provided for patterning of a workpiece.

Abstract: Lithography methods disclosed herein accommodate shrinking pattern dimensions. An exemplary method includes receiving a pattern to be transferred to a workpiece by a pattern generator. The pattern generator is divided into a first segment set and a second segment set based on the pattern, such that a collective exposure dose from the first segment set and the second segment set satisfies an exposure dose specified by the pattern. The first segment set is offset from the second segment set in a first direction, and segments in the first segment set and segments in the second segment set are offset from each other in a second direction different than the first direction. The method further includes exposing the workpiece according to the first segment set and the second segment set.

Abstract: The present disclosure provides a lithography system comprising a radiation source and an exposure tool including a plurality of exposure columns densely packed in a first direction. Each exposure column includes an exposure area configured to pass the radiation source. The system also includes a wafer carrier configured to secure and move one or more wafers along a second direction that is perpendicular to the first direction, so that the one or more wafers are exposed by the exposure tool to form patterns along the second direction. The one or more wafers are covered with resist layer and aligned in the second direction on the wafer carrier.

Abstract: The present disclosure provides one embodiment of an IC method that includes receiving an IC design layout, which has a plurality of main features and a plurality of space blocks. The IC method also includes calculating an optimized block dummy density ratio r0 to optimize an uniformity of pattern density (UPD), determining a target block dummy density ratio R, determining size, pitch and type of a non-printable dummy feature, generating a pattern for non-printable dummy features and adding the non-printable dummy features in the IC design layout.

Abstract: The present disclosure provides methods of electron-beam (e-beam) lithography process. The method includes loading a substrate to an electron-beam (e-beam) system such that a first subset of fields defined on the substrate is arrayed on the substrate along a first direction. The method also includes positioning a plurality of e-beam columns having a first subset of e-beam columns arrayed along the first direction. The e-beam columns of the first subset of e-beam columns are directed to different ones of the first subset of fields. The method also includes performing a first exposing process in a scan mode such that the plurality of e-beam columns scans the substrate along the first direction.

Abstract: The present disclosure provides one embodiment of an IC method. First pattern densities (PDs) of a plurality of templates of an IC design layout are received. Then a high PD outlier template and a low PD outlier template from the plurality of templates are identified. The high PD outlier template is split into multiple subsets of template and each subset of template carries a portion of PD of the high PD outlier template. A PD uniformity (PDU) optimization is performed to the low PD outlier template and multiple individual exposure processes are applied by using respective subset of templates.

Abstract: The present disclosure provides an embodiment of a method, for a lithography process for reducing a critical dimension (CD) by a factor n wherein n<1. The method includes providing a pattern generator having a first pixel size S1 to generate an alternating data grid having a second pixel size S2 that is <S1, wherein the pattern generator includes multiple grid segments configured to offset from each other in a first direction; and scanning the pattern generator in a second direction perpendicular to the first direction during the lithography process such that each subsequent segment of the grid segments is controlled to have a time delay relative to a preceding segment of the grid segments.

Abstract: The present disclosure provides a lithography system comprising a radiation source and an exposure tool including a plurality of exposure columns densely packed in a first direction. Each exposure column includes an exposure area configured to pass the radiation source. The system also includes a wafer carrier configured to secure and move one or more wafers along a second direction that is perpendicular to the first direction, so that the one or more wafers are exposed by the exposure tool to form patterns along the second direction. The one or more wafers are covered with resist layer and aligned in the second direction on the wafer carrier.