Patents by Inventor Wen-Chun Wang
Wen-Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240404259Abstract: A system and a method for presenting three-dimensional content and a three-dimensional content calculation apparatus are provided. In the method, the calculation apparatus receives a request for presentation content including one or more images from a client device, receives the presentation content from a content delivery network according to the request, processes the images using a first machine-learning model to generate a first predicted result, processes the images using multiple machine-learning models to generate at least a second predicted result and a third predicted result, selects a second machine-learning model from the machine-learning models based on a comparison of the first predicted result with the at least the second predicted result and the third predicted result, processes the images using the second machine-learning model and sends a processing result to the client device. Accordingly, the client device generates a three-dimensional presentation of the presentation content.Type: ApplicationFiled: August 22, 2023Publication date: December 5, 2024Applicant: Acer IncorporatedInventors: Kai-Hsiang Lin, Hung-Chun Chou, Tung-Chan Tsai, Chieh-Sheng Wang, Shih-Hao Lin, Wen-Cheng Hsu
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Publication number: 20240404260Abstract: A distributed data processing system and a distributed data processing method are provided. The distributed data processing system includes a computing device and at least one additional computing device.Type: ApplicationFiled: October 4, 2023Publication date: December 5, 2024Applicant: Acer IncorporatedInventors: Kai-Hsiang Lin, Hung-Chun Chou, Tung-Chan Tsai, Chieh-Sheng Wang, Shih-Hao Lin, Wen-Cheng Hsu
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Patent number: 12159092Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: GrantFiled: July 26, 2023Date of Patent: December 3, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
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Publication number: 20240394605Abstract: The invention provides a system and a method thereof for establishing an extubation prediction using a machine learning model capable of obtaining an extubation prediction model and key features used by the extubation prediction model through training and/or verification of a machine learning model, and analyzing key feature data of a patient in real time through the extubation prediction model in order to obtain a possibility of extubation of the patient and its related explanation. Accordingly, the system and the method thereof for establishing the extubation prediction using the machine learning model disclosed in the invention are used as a tool for clinical caregivers to evaluate extubation in order to reduce a possibility of reintubation due to inability to breathe spontaneously after extubation.Type: ApplicationFiled: June 21, 2023Publication date: November 28, 2024Inventors: WEN-CHENG CHAO, KAI-CHIH PAI, MING-CHENG CHAN, CHIEH-LIANG WU, MIN-SHIAN WANG, CHIEN-LUN LIAO, TA-CHUN HUNG, YAN-NAN LIN, HUI-CHIAO YANG, RUEY-KAI SHEU, LUN-CHI CHEN
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Publication number: 20240396103Abstract: An energy storage device capable of suppressing battery spread of battery fire includes a control module and a plurality of battery modules, and the battery modules respectively include an accommodation space, a plurality of battery packs, a plurality of temperature sensors and a controller. The controller provides a first control signal to notify the control module based on an ambient temperature detected by one of the temperature sensors being greater than or equal to a first specific temperature range. The control module is used to transfer a battery capacity of an abnormal battery module of the battery modules providing the first control signal to a backup energy storage module, and the backup energy storage module includes the battery modules except the abnormal battery module or a next-stage device.Type: ApplicationFiled: May 26, 2023Publication date: November 28, 2024Inventors: Chung-Hsing CHANG, Wen-Yi CHEN, Way-Lung WU, Teng-Chi HUANG, Shi-Cheng TONG, Yong-Han CHEN, Yu-Chun WANG
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Publication number: 20240385463Abstract: An optical engine module including a display panel, a transflective layer, a polarizing reflective layer, a first bifocal lens, a first and second electrically controlled half waveplate is provided. The transflective layer is disposed between the display panel and the polarizing reflective layer. The polarizing reflective layer is configured to allow the light beam having a first polarization state to pass through, and reflect the light beam having a second polarization state. The first and second electrically controlled half waveplate are disposed between the transflective layer and the polarizing reflective layer. The first bifocal lens disposed between the first and second electrically controlled half waveplate has a first focal length for the light beam with the first polarization state, and has a second focal length for the light beam with the second polarization state.Type: ApplicationFiled: May 15, 2024Publication date: November 21, 2024Applicant: Coretronic CorporationInventors: Tzu-Hung Lin, Chung-Yang Fang, Wen-Chun Wang, Ching-Chuan Wei, Bo-Han Cheng, Wei-Ting Wu
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Publication number: 20240387380Abstract: Semiconductor structures and method of forming the same are provided. A semiconductor structure according to the present disclosure includes a contact feature in a dielectric layer, a passivation structure over the dielectric layer, a conductive feature over the passivation structure, a seed layer disposed between the conductive feature and the passivation structure, a protecting layer disposed along sidewalls of the conductive feature, and a passivation layer over the conductive feature and the protecting layer.Type: ApplicationFiled: July 26, 2024Publication date: November 21, 2024Inventors: Wen-Chun Wang, Tzy-Kuang Lee, Chih-Hsien Lin, Ching-Hung Kao, Yen-Yu Chen
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Patent number: 12144595Abstract: The present invention provides a wearable device for monitoring blood-pressure.Type: GrantFiled: August 10, 2020Date of Patent: November 19, 2024Assignee: Cardio Ring Technologies, Inc.Inventors: Kuang-Fu Chang, Yu-Chi Wang, Leng-Chun Chen, Jun-Ming Chen, Wen-Pin Shih
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Patent number: 12148675Abstract: The present invention includes a chip, a plastic film layer, and an electroplated layer. A front side and a back side of the chip each comprises a signal contact. The plastic film layer covers the chip and includes a first via and a second via. The first via is formed adjacent to the chip, and the second via is formed extending to the signal contact of the front side. A conductive layer is added in the first and the second via. The conductive layer in the second via is electrically connected to the signal contact of the front side. Through the electroplated layer, the signal contact on the back side is electrically connected to the conductive layer in the first via. The conductive layer protrudes from the plastic film layer as conductive terminals. The present invention achieves electrical connection of the chip without using expensive die bonding materials.Type: GrantFiled: December 7, 2021Date of Patent: November 19, 2024Assignee: Panjit International Inc.Inventors: Chung-Hsiung Ho, Wei-Ming Hung, Wen-Liang Huang, Shun-Chi Shen, Chien-Chun Wang, Chi-Hsueh Li
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Publication number: 20240379407Abstract: A method includes forming a first protruding fin and a second protruding fin over a base structure, with a trench located between the first protruding fin and the second protruding fin, depositing a trench-filling material extending into the trench, and performing a laser reflow process on the trench-filling material. In the reflow process, the trench-filling material has a temperature higher than a first melting point of the trench-filling material, and lower than a second melting point of the first protruding fin and the second protruding fin. After the laser reflow process, the trench-filling material is solidified. The method further includes patterning the trench-filling material, with a remaining portion of the trench-filling material forming a part of a gate stack, and forming a source/drain region on a side of the gate stack.Type: ApplicationFiled: July 25, 2024Publication date: November 14, 2024Inventors: Wen-Yen Chen, Li-Ting Wang, Wan-Chen Hsieh, Bo-Cyuan Lu, Tai-Chun Huang, Huicheng Chang, Yee-Chia Yeo
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Publication number: 20240374944Abstract: A battery module capable of suppressing spread of battery fire including a case, a plurality of battery packs, a plurality of temperature sensors, an energy consumption module and a controller. The case forms an accommodation space, and the battery packs is accommodated in the accommodation space. The temperature sensors are dispersedly configured to the accommodation space, and the temperature sensors respectively detect an ambient temperature around configure locations. The controller is coupled to the temperature sensors, and when the ambient temperature detected by one of the temperature sensors is greater than or equal to a first specific temperature range, the controller controls the energy consumption module to consume a battery capacity of at least one battery pack around the one of the temperature sensors.Type: ApplicationFiled: May 12, 2023Publication date: November 14, 2024Inventors: Chung-Hsing CHANG, Wen-Yi CHEN, Way-Lung WU, Teng-Chi HUANG, Shi-Cheng TONG, Yong-Han CHEN, Yu-Chun WANG
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Publication number: 20240361681Abstract: A projection device including an imaging module, a freeform-surface reflective mirror, and a projection lens assembly is provided. The imaging module is configured to provide imaging beams and includes a display panel and a light-source module. The imaging beams are transmitted toward the projection lens assembly by the freeform-surface reflective mirror. The projection lens assembly includes a first optical axis and a second optical axis. The first optical axis passes through the projection lens assembly. The imaging beams emitted by the projection device form an imaging-beam region, in which the first optical axis does not pass through a geometric center of the imaging-beam region, and the second optical axis passes through a geometric center region of the display panel. The geometric center region is a region having a distance less than or equal to 40% of a minimum width of the display panel from a geometric center of the display panel.Type: ApplicationFiled: April 24, 2024Publication date: October 31, 2024Applicant: Coretronic CorporationInventors: Wei-Ting Wu, Wen-Chun Wang, Ching-Chuan Wei, You-Da Chen, Chun-An Wei, Yi-En Hsu
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Publication number: 20240363419Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a first fin structure, a second fin structure, and a third fin structure over the substrate. Tops of the second fin structure and the third fin structure are at different height levels. The semiconductor device structure also includes a first epitaxial structure extending across sidewalls of the first fin structure and the second fin structure and a second epitaxial structure on the third fin structure. The first epitaxial structure is closer to the substrate than the second epitaxial structure.Type: ApplicationFiled: July 9, 2024Publication date: October 31, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Chun KENG, Yu-Kuan LIN, Chang-Ta YANG, Ping-Wei WANG
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Publication number: 20240339144Abstract: An exemplary magnetoresistive random-access memory (MRAM) cell is configured to store more than one bit. The MRAM cell includes a first magnetic tunneling junction (MTJ) and a second MTJ connected in parallel. The first MTJ has a first diameter, the second MTJ has a second diameter, and the second diameter is less than the first diameter. The MRAM cell further includes a transistor connected to the first MTJ and the second MTJ, a bit line connected to the first MTJ and the second MTJ, a word line connected to the transistor, and a source line connected to the transistor. A method of writing to the MRAM cell can include supplying one or more write voltages to the MRAM cell (e.g., having different levels) depending on an initial memory state and a desired memory state of the MRAM cell.Type: ApplicationFiled: August 3, 2023Publication date: October 10, 2024Inventors: Harry-Hak-Lay Chuang, Ching-Huang Wang, Hung Cho Wang, Tien-Wei Chiang, Wen-Chun You
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Patent number: 12105562Abstract: A portable electronic device including a main display having a locking recess at a side edge and at least one external display detachable relative to the side edge of the main display is provided. The external display includes a body, and at least one latch pivoted to the body. The latch is pivoted to the body to be swiveled out of or into the body. An opening of the locking recess faces obliquely upward and faces away from a direction of gravity when the main display is standing, the at least one latch swiveled out of the body faces obliquely downward and faces forward the direction of gravity to be inserted into the locking recess, and the at least one external display is hung on at the side edge of the main display by a weight of the at least one external display.Type: GrantFiled: May 23, 2023Date of Patent: October 1, 2024Assignee: Acer IncorporatedInventors: Yu-Shih Wang, Yi-Ta Huang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai
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Patent number: 12100789Abstract: A display device, including a circuit substrate, a light-emitting layer, a quarter-wave plate, and a band-pass polarizing layer, is provided. The light-emitting layer is disposed on the circuit substrate and has light-emitting structures, which are electrically connected to the circuit substrate and include first light-emitting structures, which have a first main light-emitting wavelength. The quarter-wave plate is disposed in overlap with the light-emitting structures and is located between the band-pass polarizing layer and the light-emitting layer. The band-pass polarizing layer includes at least one first band-pass polarizing pattern, which have a first absorption axis. The first wavelength range is the first main light-emitting wavelength±10 nm. An average transmittance of the first band-pass polarizing patterns to light with a wavelength outside the first wavelength range and a polarization direction parallel to the first absorption axis is less than 20%.Type: GrantFiled: November 15, 2021Date of Patent: September 24, 2024Assignee: Coretronic CorporationInventors: Ping-Yen Chen, Wen-Chun Wang, Chung-Yang Fang, Yu-Fan Chen
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Publication number: 20240304657Abstract: A semiconductor device includes a substrate, a first gate, a plurality of second gates and a resistor. The substrate is defined with an active region and a resistor region. The first gate is disposed in the active region. The first gate has a first length extending along a first direction and a second length extending along a second direction. The plurality of second gates are disposed in the resistor region. Each of the second gates has a third length extending along the first direction and a fourth length extending along the second direction. The first length is equal to the third length, and the second length is equal to the fourth length. The resistor is disposed on the plurality of second gates.Type: ApplicationFiled: March 29, 2023Publication date: September 12, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Yi-Chun Teng, Ming-Che Tsai, Ping-Chia Shih, Yi-Chang Huang, Wen-Lin Wang, Yu-Fan Hu, Ssu-Yin Liu, Yu-Nong Chen, Pei-Tsen Shiu, Cheng-Tzung Tsai
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Patent number: 12080602Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a first fin structure and a second fin structure over the substrate. A top surface of the first fin structure and a top surface of the second fin structure are at different height levels. The semiconductor device structure also includes a first semiconductor element on the first fin structure and a second semiconductor element on the second fin structure. The first semiconductor element is wider than the second semiconductor element, and the first semiconductor element is closer to the substrate than the second semiconductor element.Type: GrantFiled: June 8, 2023Date of Patent: September 3, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wen-Chun Keng, Yu-Kuan Lin, Chang-Ta Yang, Ping-Wei Wang
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Patent number: 12058103Abstract: An IP address display device suitable for a power device is provided. The IP address display device comprises a communication interface, a display interface, and a control circuit. The control circuit is electrically coupled to the communication interface and the display interface, and is used to determine whether an IP address allocated by a DHCP server has been obtained through the communication interface. When the determination result is yes, the control circuit automatically displays the obtained IP address by the display interface for a preset time. In addition, a power distribution unit and an uninterruptible power system using the same are also provided.Type: GrantFiled: July 5, 2018Date of Patent: August 6, 2024Assignee: CYBER POWER SYSTEMS, INC.Inventors: Hung-Chun Chien, Wen-Yu Chuang, Kuan-Hung Wang
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Publication number: 20240258198Abstract: The invention provides an electronic package module including a chip, a heat-dissipation component, a carrying member, and a liquid metal. The carrying member is clamped between the chip and the heat-dissipation component. The carrying member has a porous structure. The liquid metal is filled in the porous structure to be in thermal contact with the chip and the heat-dissipation component. The liquid metal is constrained between the chip and the heat-dissipation component by the carrying member and does not flow outside of the chip and the heat-dissipation component.Type: ApplicationFiled: October 3, 2023Publication date: August 1, 2024Applicant: Acer IncorporatedInventors: Yu-Shih Wang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai