Abstract: An optical device for rearranging wavelength channels in an optical network is disclosed. The optical device has a wavelength selective coupler having one input port and a plurality of output ports coupled to a plurality of input ports of an optical grating demultiplexor such as an arrayed waveguide grating. The wavelength channels in each of the input ports are dispersed by the demultiplexor and are directed to a plurality of output ports of the optical grating demultiplexor. As a result, at least one wavelength channel at each of the input ports of the optical grating demultiplexor is coupled into a common output port. The optical device is useful in passive optical networks wherein a same demultiplexor is used for simultaneous multiplexing and demultiplexing of wavelength channels.

Abstract: The invention discloses an electrostatic discharge circuit. The spirit of the invention is that the electrostatic common portion in the conventional integrated circuit is divided into at least two sets corresponding to at least two internal common voltages, separately. In addition, the electrostatic common portions use serily connected diode rings. Therefore, the number of diodes of the diode rings coupling to the higher common voltage and the electrostatic common portion, coupling to the higher common voltage, can be reduced.

Abstract: An improved apparatus and method for testing experiment is disclosed. The apparatus includes a motherboard and a stress module. The motherboard includes a component under test. A stress module connects the component and contacts the component directly. The stress module can provide the component with various rages of temperature and voltage for test. Besides, the stress module also can provide an anti-electrostatic device to prevent electrostatic disturbance.

Abstract: An improved apparatus and method for testing experiment is disclosed. The apparatus includes a motherboard and a stress module. The motherboard includes a component under test. A stress module connects the component and contacts the component directly. The stress module can provide the component with various rages of temperature and voltage for test. Besides, the stress module also can provide an anti-electrostatic device to prevent electrostatic disturbance.

Abstract: A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of first pads, and the second wiring layer includes a plurality of second pads. The interconnection-wiring layer is set between the first and second wiring layer. In this case, at least one of the second pads that does not electrically connect to anyone of the first pads electrically connects to the interconnection-wiring layer. In another case, a shielding portion, which electrically connects the interconnection-wiring layer, is provided around the second pad that doesn't electrically connect to anyone of the first pads. Furthermore, this invention also discloses a semiconductor device including the substrate.

Abstract: This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

Abstract: Reagents, methods, and kits are described that are useful for fertility testing and that in many cases provides much faster, convenient and rapid determination of male infertility. The reagents described include properly glycosylated human ZP3, ZP2, ZP1, glycosylated peptides thereof, fusion proteins such as green fluorescent protein—ZP3, non-covalent complexes of ZP2 with ZP3, fusion protein of ZP2–ZP3, solid phase materials such as agarose beads coated with binding agents such as ZP3, and other artificial zona. Methods are provided that, in many cases convert a complex biological event into a well defined biochemical binding event based on one or more of the reagents. Such methods are much easier to set up and monitor, allowing more convenient and inexpensive diagnostic testing for male fertility. The acrosome reaction is detected in other embodiments by virtue of quantitating one or more released substances.

Abstract: The present invention provides a method to determine sperm activity comprising the steps of: (a) contacting an appropriate concentration of human zona pellucida protein 3 with an appropriate amount of sperm under conditions permitting the formation of a complex between the human zona pellucida protein 3 and the sperm; and (b) determining the complex formed. The invention further provides a method to determine sperm activity comprising the steps of (a) contacting an appropriate concentration of human zona pellucida protein 3 with an appropriate amount of sperm under conditions permitting an acrosome reaction to occur; and (b) determining the extent of the acrosome reaction.

Abstract: The invention relates to methods for producing recombinant human zona pellucida protein (“rhZP3”) and glycosylated peptide having biological activity of binding to human spermatozoa. A human ovarian cell line is used to produce rhZP3 having a glycosylation pattern required for full biological activity. Methods of determining useful peptides with binding activity for human sperm and their syntheses, as well as using such peptides and proteins in therapeutics and diagnostics are discussed.

Abstract: The present invention provides a write element for use in magnetic data recording system such as a computer disk drive. The write head utilizes the advantageous properties of high magnetic moments while overcoming the corrosion problems engendered by such materials. The write element includes a magnetic yoke constructed of first and second magnetic poles joined to one another at a back gap. While the majority of the poles are constructed of a high magnetic moment material a layer of relatively low magnetic moment material is provided on the first pole at the back gap portion of the first pole. The relatively low magnetic moment material prevents corrosion of the first pole during subsequent manufacturing of the write head. An electrically conductive coil passes through the magnetic yoke and is insulated there from. By passing an electrical current through the electrical coil, a magnetic flux is generated in the yoke. This magnetic flux then generates a magnetic fringing field in at a write gap of the yoke.

Abstract: There is provided a process for preparation of synthesis gas from feedstocks containing methane and/or higher hydrocarbons having from about 2 to about 12 carbon atoms by an initial catalytic treatment of feedstock to provide a methane-containing gaseous mixture substantially free of compounds having 2 or more carbon atoms, and reforming the gaseous mixture at elevated temperatures using nickel-containing catalytic materials that are unusually active under mild conditions of conversion and resistant to deactivation. The process consists fundamentally in converting the higher hydrocarbon compounds to form the methane-containing gaseous mixture in an initial conversion zone containing a catalyst while controlling temperatures within the initial conversion zone to temperatures in a range downward from about 500° C. to about 300° C., and reforming the methane-containing gaseous mixture in a subsequent zone to form synthesis gas.

Abstract: A planar lightwave circuit includes at least one optical waveguide core, and at least one feature proximate the core having a stress-engineered property to balance stress and therefore minimize birefringence affecting the core. A protective passivation layer is formed over the core and the feature to be substantially non-interfering with the balanced stress provided by the feature. The stress balancing feature may be an overcladding layer formed over the core, doped to have a coefficient of thermal expansion approximately matched to that of an underlying substrate, to symmetrically distribute stress in an undercladding between the overcladding and the substrate, away from the core. The protective passivation layer is formed to have a coefficient of thermal expansion approximately matched to that of the overcladding. In one exemplary embodiment, the passivation layer is formed from silicon nitride. Related concepts of stress release grooves, and core overetching, are also disclosed.

Abstract: The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidization of the molding compound by ambient air.

Abstract: A disk drive write head (10) having a bottom pole (60), a first insulation layer (64) formed on the bottom pole (60), a coil (38) formed on the first insulation layer (64), a second insulation layer (66) formed on the coil (38), a write gap layer (76) formed on the second insulation layer (66), and a top pole (12) formed on the write gap layer (76), where the top pole (12) is substantially flat. A second embodiment (100) is described which is produced by a damascene process.

Abstract: This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

Abstract: A method of patterning a substrate includes forming a liquid film on the substrate surface and directing laser energy from a laser through the film to etch the substrate surface. Etched material is carried away from the substrate surface via evaporation of the film during the etching. The liquid film may be formed on the substrate surface by jetting a liquid vapor onto the substrate.

Abstract: This invention relates to a method and apparatus for removing surface contamination on a flexible circuit 34 for an inkjet printer cartridge by pulsed laser irradiation in air. The contamination 3 around and inside the tiny inkjet nozzles 4 can be completely removed without any damage on the flexible circuit 34 by the laser irradiation. The cleaning mechanisms are laser-induced ablation of the contamination and fast momentum transferring from the laser beam to the contamination materials. Compared with chemical solution cleaning and plasma etching, this technique has high throughput and does not cause flexible circuit damage, due to the fact that there are no water and chemical solutions involved in the process. Meanwhile, the laser irradiation is only limited in a small area around the tiny inkjet nozzles 4. There is no laser interaction with the thin conductive circuit 34.

Abstract: A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of first pads, and the second wiring layer includes a plurality of second pads. The interconnection-wiring layer is set between the first and second wiring layer. In this case, at least one of the second pads that does not electrically connect to anyone of the first pads electrically connects to the interconnection-wiring layer. In another case, a shielding portion, which electrically connects the interconnection-wiring layer, is provided around the second pad that doesn't electrically connect to anyone of the first pads. Furthermore, this invention also discloses a semiconductor device including the substrate.

Abstract: The present invention provides a thin film read head having a lower shield pedestal with an adjacent lower extra gap layer. The pedestal may be formed from a lower shield layer with the lower extra gap layer being inset within the lower shield layer so that the top surfaces of the lower extra gap layer and the pedestal are generally planar. This allows for deposition of generally planar lower gap and sensor layers. A sensor element may be defined on the generally planar surface using a bilayer resist structure. The generally planar surface of the sensor layer inhibits resist pooling which could otherwise degrade resist structure and sensor element formation. In a typical embodiment, the read head of the present invention may have a spin valve type sensor element with leads electrically coupled to the sensor element, an upper gap layer extending between the sensor element and the upper shield layer, and an upper extra gap layer disposed between at least a portion of the leads and the upper shield layer.