Patents by Inventor Wen Feng

Wen Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250140489
    Abstract: An automatic transfer switch is provided. A transfer module is arranged between two power switches and disposed on a displacement mechanism which is in linear motion. The transfer module is provided with a seat in which two corresponding levers are mounted and electrically connected with a controller. The two levers are locked or released under control of the controller. Thereby the power switch is pulled or pushed selectively by the levers being locked or released. In combination with the controller used for setting a time delay during transfer between power sources, the power switch can be turned on/off or switched at the time required.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 1, 2025
    Inventor: WEN-FENG LU
  • Patent number: 12179171
    Abstract: A pyrazole metal complex for absorption of carbon dioxide, a method for preparing the pyrazole metal complex, and a method for absorbing carbon dioxide are provided; wherein the product produced by reacting pyrazole metal complex and carbon dioxide may be transformed into several economically valuable compounds.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: December 31, 2024
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Yu-Ting Tseng, Tsai-Te Lu, Tsu-Chieh Yu, Wen-Feng Liaw
  • Publication number: 20240392840
    Abstract: A coupling including a main body, a first hub at a first end of the main body and a second hub at a second end of the main body opposite the first end is provided. The first hub includes a first inner bore configured to receive a first shaft and a pair of aligned first and second through holes extending through opposite walls of the first hub. The first through hole and the second through hole are in optical communication with the first inner bore.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Wen Feng TAI, Lung Chi YU, Po Chang WANG, Jui Pin CHANG
  • Patent number: 12152639
    Abstract: A coupling including a main body, a first hub at a first end of the main body and a second hub at a second end of the main body opposite the first end is provided. The first hub includes a first inner bore configured to receive a first shaft and a pair of aligned first and second through holes extending through opposite walls of the first hub. The first through hole and the second through hole are in optical communication with the first inner bore.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: November 26, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY, LIMITED
    Inventors: Wen Feng Tai, Lung Chi Yu, Po Chang Wang, Jui Pin Chang
  • Patent number: 12090588
    Abstract: An automatic locking device for assembling a part to a workpiece is provided. The device includes a feeding mechanism, a fixture mechanism, a loading and unloading mechanism, a lifting mechanism, a rotating mechanism, and a locking mechanism. The feeding mechanism feeds the part to the fixture mechanism. The loading and unloading mechanism places the workpiece on the part. The lifting mechanism lifts up the fixture mechanism together with the part and the workpiece. The rotating mechanism rotates the fixture mechanism. The locking mechanism locks the part to the workpiece after the part and the workpiece are rotated by the rotating mechanism. The automatic locking device integrates multiple functions in a single station, reduces the number of the work stations and operatives, lowers the cost, and improves accuracy of the assembly. An assembling apparatus including the automatic locking device is also provided.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: September 17, 2024
    Assignee: FULIAN TECHNOLOGY (SHANXI) CO., LTD.
    Inventors: Yun Zhao, Wang Wang, Zhan-He Su, Ming-Yu Guo, Jian Liu, Wen-Feng Zhao, Zhao-Chen Li, Dong-Bo Pei
  • Publication number: 20240227358
    Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.
    Type: Application
    Filed: May 4, 2023
    Publication date: July 11, 2024
    Inventors: KAI-WEI LO, WEN-FENG LEE, HSIANG-YUN YANG, KUO-HSUN CHEN
  • Publication number: 20240231145
    Abstract: An optical film, display module, and display screen, wherein the optical film comprises a main body, multiple microstructures, and an opaque layer. The microstructures are positioned on one side of the main body, and these microstructures are protruding arcuate structures. The opaque layer is affixed to the main body and is set opposite the microstructures on the other side of the main body, the opaque layer includes multiple apertures. Wherein, the center point of the apertures overlaps with the center point of the microstructures on a projection plane. Wherein, the equivalent diameter of the apertures divided by the equivalent diameter of the microstructures is less than or equal to 0.3, the equivalent diameter of the microstructures divided by the thickness of the main body is less than or equal to 1.3, and greater than or equal to 0.7. Wherein, the opaque layer is oriented towards the light source.
    Type: Application
    Filed: October 23, 2023
    Publication date: July 11, 2024
    Applicants: Sunrise Optronics Co., Ltd
    Inventor: Wen-Feng Cheng
  • Patent number: 12023893
    Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: July 2, 2024
    Assignee: TCLAD TECHNOLOGY CORPORATION
    Inventors: Feng-Chun Yu, Kai-Wei Lo, Wen Feng Lee, Ru-Yi Cai
  • Publication number: 20240201340
    Abstract: A lidar module includes a laser transceiver assembly configured to transmit and receive at least one laser beam and a lens scanning assembly integrated with the laser transceiver assembly. The lens scanning assembly has a movable lens arranged on an optical path of the laser beam transmitted by the laser transceiver assembly. The movable lens is configured with a way of movement in which the movable lens moves in a plane perpendicular to an optical axis of the movable lens to adjust a deflection direction of the laser beam. The present invention is intended to provide a lidar module, which can resolve a defect of a small detection field of view (FOV) of a lidar and realize modularization and miniaturization of a lens scanning assembly and a lidar.
    Type: Application
    Filed: February 27, 2023
    Publication date: June 20, 2024
    Inventors: Xian Wen Feng, Chong Yang Qin
  • Publication number: 20240192322
    Abstract: The present disclosure provides a laser radar module, including a housing body; a laser transceiver assembly and a thermoelectric cooler temperature control assembly accommodated in the housing body, the laser transceiver assembly and the thermoelectric cooler temperature control assembly being stacked and in contact with each other; an upper cover of a sealed chamber accommodated in the housing body and fixedly connected on an inner wall of the housing body, the upper cover of the sealed chamber and the housing body together enclosing and sealing the laser transceiver assembly; and a first circuit board and a second circuit board that are stacked and electrically connected to each other for electrically controlling the laser transceiver assembly and the thermoelectric cooler temperature control assembly respectively. An object of the present disclosure is to provide a laser radar module to at least reduce the size of the laser radar module.
    Type: Application
    Filed: December 4, 2023
    Publication date: June 13, 2024
    Inventors: Chong Yang Qin, Xian Wen Feng
  • Patent number: 11996439
    Abstract: A method of manufacturing a capacitor including the operations of etching a plurality of primary trenches into a first region of a substrate, the primary trenches extending in a first direction, etching a plurality of secondary trenches into the first region of the substrate, the secondary trenches extending in a second direction other than the first direction, with the adjacent secondary trenches and adjacent primary trenches jointly defining an island structure having an upper surface that is recessed relative to an upper surface a surrounding substrate, and depositing a series of film pairs including a dielectric layer and a conductive layer.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Feng Kuo, Chung-Chuan Tseng, Chia-Ping Lai
  • Patent number: 11994534
    Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board, a testing socket, a conductive fastener, a cover, and a conductive element assembly. The printed circuit board includes a first metal layer formed on the bottom surface thereof. The testing socket is disposed above the printed circuit board. The conductive fastener is configured to secure the testing socket to the printed circuit board, wherein the conductive fastener is electrically connected to the first metal layer and the testing socket. The cover is disposed above the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket, wherein the cover makes electrical contact with the integrated circuit package. The conductive element assembly is disposed between and electrically connected to the cover and the testing socket.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shao-Chun Chiu, Wen-Feng Liao, Hao Chen, Chun-Hsing Chen
  • Publication number: 20240134225
    Abstract: An optical film, display module, and display screen, wherein the optical film comprises a main body, multiple microstructures, and an opaque layer. The microstructures are positioned on one side of the main body, and these microstructures are protruding arcuate structures. The opaque layer is affixed to the main body and is set opposite the microstructures on the other side of the main body, the opaque layer includes multiple apertures. Wherein, the center point of the apertures overlaps with the center point of the microstructures on a projection plane. Wherein, the equivalent diameter of the apertures divided by the equivalent diameter of the microstructures is less than or equal to 0.3, the equivalent diameter of the microstructures divided by the thickness of the main body is less than or equal to 1.3, and greater than or equal to 0.7. Wherein, the opaque layer is oriented towards the light source.
    Type: Application
    Filed: October 22, 2023
    Publication date: April 25, 2024
    Applicants: Sunrise Optronics Co., Ltd
    Inventor: Wen-Feng Cheng
  • Publication number: 20240131819
    Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.
    Type: Application
    Filed: May 3, 2023
    Publication date: April 25, 2024
    Inventors: KAI-WEI LO, WEN-FENG LEE, HSIANG-YUN YANG, KUO-HSUN CHEN
  • Publication number: 20240012184
    Abstract: An optical film comprising a first surface and a second surface is provided and the first surface and the second surface face in opposite directions. The first surface is disposed with a plurality of first microstructures and a plurality of second microstructures, which are closely adjacent to each other. The first microstructures are upwardly convex quadrangular pyramid structures or triangular pyramid structures, while the second microstructures are downwardly concave quadrangular pyramid structures or triangular pyramid structures.
    Type: Application
    Filed: June 5, 2023
    Publication date: January 11, 2024
    Applicant: Sunrise Optronics Co., Ltd.
    Inventor: Wen-Feng Cheng
  • Publication number: 20240001497
    Abstract: An automatic locking device for assembling a part to a workpiece is provided. The device includes a feeding mechanism, a fixture mechanism, a loading and unloading mechanism, a lifting mechanism, a rotating mechanism, and a locking mechanism. The feeding mechanism feeds the part to the fixture mechanism. The loading and unloading mechanism places the workpiece on the part. The lifting mechanism lifts up the fixture mechanism together with the part and the workpiece. The rotating mechanism rotates the fixture mechanism. The locking mechanism locks the part to the workpiece after the part and the workpiece are rotated by the rotating mechanism. The automatic locking device integrates multiple functions in a single station, reduces the number of the work stations and operatives, lowers the cost, and improves accuracy of the assembly. An assembling apparatus including the automatic locking device is also provided.
    Type: Application
    Filed: June 8, 2023
    Publication date: January 4, 2024
    Inventors: YUN ZHAO, WANG WANG, ZHAN-HE SU, MING-YU GUO, JIAN LIU, WEN-FENG ZHAO, ZHAO-CHEN LI, DONG-BO PEI
  • Patent number: 11860117
    Abstract: A pH sensor for detecting a pH of a sample includes a reference electrode and a glass electrode. The reference electrode includes a hollow tubular housing, and at least one water absorbing unit disposed in the housing and including a porous junction member configured to contact the sample, and a water absorbing member disposed on one side of the porous junction member that is opposite to the sample. The water absorbing member is made by soaking a superabsorbent polymer in potassium chloride solution. The glass electrode is inserted into the water absorbing member, and protrudes from the junction member toward the sample.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: January 2, 2024
    Assignee: LUH CHERNG ENTERPRISE CO., LTD.
    Inventors: Wen-Feng Tsai, Ke-Fu Lin
  • Publication number: 20230356345
    Abstract: A multi-type industrial robot control system may include: an automation controller; and a programmable logic controller (PLC)-robot bridge. The controller stores a general-purpose robot control function block generated using a unified design standard, calls a corresponding robot control function block for a robot and using robot state data and puts out corresponding first command data to the PLC-robot bridge. The PLC-robot bridge virtualizes robot interfaces of corresponding offline programming functions of different types of robot as a unified virtual interface, calls a corresponding offline programming function via the unified virtual interface according to the first command data, and generates second command data for output to a corresponding robot controller. The corresponding robot controller controls a corresponding robot. At the same time, robot state data from a corresponding type of robot is received via the unified virtual interface and the robot state data is fed back to the automation controller.
    Type: Application
    Filed: September 30, 2020
    Publication date: November 9, 2023
    Applicant: Siemens Aktiengesellschaft
    Inventors: Zhi Min Chen, Zi Jian Wang, Xu Zhao, Wen Feng Liu, Shun Jie Fan
  • Publication number: 20230273141
    Abstract: A pH sensor for detecting a pH of a sample includes a reference electrode and a glass electrode. The reference electrode includes a hollow tubular housing, and at least one water absorbing unit disposed in the housing and including a porous junction member configured to contact the sample, and a water absorbing member disposed on one side of the porous junction member that is opposite to the sample. The water absorbing member is made by soaking a superabsorbent polymer in potassium chloride solution. The glass electrode is inserted into the water absorbing member, and protrudes from the junction member toward the sample.
    Type: Application
    Filed: February 28, 2022
    Publication date: August 31, 2023
    Inventors: Wen-Feng TSAI, Ke-Fu LIN
  • Patent number: 11732149
    Abstract: The present invention discloses a hybrid (mixed) formulation composition for 3D additive manufacturing and a manufacturing process. The hybrid formulation composition possesses capability of UV radiation curing and thermal curing. The hybrid formulation composition is designed to be cured by UV radiation in the 3D printing/additive manufacturing process and then post cure by heat to get its final properties. The hybrid formulation composition consists of acrylates (oligomer, monomer, and diluent), photoinitiators, and isocyanate-containing prepolymers which comprises polyols (di-ol, tri-ol) and isocyanates. The hybrid formulation composition may also include reaction accelerator, dye, pigment, and fillers. The finished products of the hybrid formulation composition possess rubber-like properties and can be used in the applications such as shoe sole, toys, medical, and wearables goods . . . etc.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: August 22, 2023
    Assignee: VISTA APPLIED MATERIALS, INC.
    Inventors: Wen-Feng Liu, Wan-Sen Lu