Abstract: Method for control protocol frame transmission and electronic device are provided. The method comprises following operations. By the electronic device operating in an advanced line encoding mode and having a first burst from the electronic device to the other electronic device, the first burst is closed and a second burst is opened from the electronic device to the other electronic device for request frame transmission, wherein the electronic device operating in the advanced line encoding mode is configured to transmit data by using an advanced line encoding having an effective data rate larger than an effective data rate of 8b/10b encoding. By the electronic device, a request frame is transmitted in the second burst.

Abstract: A method for verifying a low-density parity-check (LDPC) unit capable of being applied in a memory system can include receiving original data corresponding to a memory device, encoding the original data by the LDPC unit to be verified, injecting errors into the encoded original data by a data pattern for generating verifying data, and verifying a soft decode capability of the LDPC unit by utilizing the verifying data. The data pattern can include the errors generated by threshold voltage (Vth) distributions interlaced between two neighboring logic states of 2n logic states of the memory device. The method and system can provide an error injection to accurately and efficiently verify a LDPC soft decode capability of the LDPC unit, decrease errors, increase error correction accuracy and efficiency, more accurately model actual threshold voltage (Vth) distributions, increase flexibility, increase speed, increase performance, and reduce firmware overhead.

Abstract: In a method of coating a photo resist over a wafer, dispensing the photo resist from a nozzle over the wafer is started while rotating the wafer, and dispensing the photo resist is stopped while rotating the wafer. After starting and before stopping the dispensing the photo resist, a wafer rotation speed is changed at least 4 times. During dispensing, an arm holding the nozzle may move horizontally. A tip end of the nozzle may be located at a height of 2.5 mm to 3.5 mm from the wafer.

Abstract: Techniques and apparatuses directed to component shielding are described in this document. A first aspect relates to a system including a printed circuit board (PCB) oriented along a first plane, a device on the PCB, and a component shield having a wall structure oriented perpendicular to the first plane and a cover structure connected to the wall structure. The system includes a housing structure oriented along a second plane that is substantially parallel to the first plane. The first and second planes define a shielded space within which the component shield and the device reside. The system further includes a shielding layer residing at least partially between the cover and housing structures. The shielding layer has an irregular cross-section along a fourth plane perpendicular to at least one of the first or second planes and a third plane. The irregular cross-section includes a protrusion that extends from the third plane.

Abstract: The present disclosure provides an audio compression device, an audio compressing system and an audio compression method. The audio compression device comprises a first transceiver and a first processor. The first transceiver is connected to the first processor. The processor obtains an audio signal and an available bandwidth, and the processor performs an audio compression encoding on the audio signal to obtain a sample audio signal, and then compares with the audio signal and the sample audio signal to generate a residual signal, and the residual signal is transmitted according to the available bandwidth. The audio signal can be completely transmitted to an audio decompression device to reduce the distortion of the audio signal.

Abstract: A novel additive for recycling thermoset materials, its related recyclable thermoset composition and its application are disclosed. Specifically, the composition of the additive comprises at least one copolymer that has at least one carbamate group, at least one carbonate group and/or at least one urea group, and a number-average molecular weight of the copolymer is between 100 and 50,000 Da.

Abstract: A method of manufacturing a semiconductor device includes forming a first bonding layer over a substrate of a first wafer, the first wafer including a first semiconductor die and a second semiconductor die, performing a first dicing process to form two grooves that extend through the first bonding layer, the two grooves being disposed between the first semiconductor die and the second semiconductor die, performing a second dicing process to form a trench that extends through the first bonding layer and partially through the substrate of the first wafer, where the trench is disposed between the two grooves, and thinning a backside of the substrate of the first wafer until the first semiconductor die is singulated from the second semiconductor die.

Abstract: A method includes putting a first package component into contact with a second package component. The first package component comprises a first dielectric layer including a first dielectric material, and the first dielectric material is a silicon-oxide-based dielectric material. The second package component includes a second dielectric layer including a second dielectric material different from the first dielectric material. The second dielectric material comprises silicon and an element selected from the group consisting of carbon, nitrogen, and combinations thereof. An annealing process is performed to bond the first dielectric layer to the second dielectric layer.

Abstract: At least one computer processor can replace visual words of an unsupervised machine learning classification model with visual objects of an image. At least two co-occurring single visual objects adjacent to each other in pixels of the image can be combined to obtain a compound visual object. The unsupervised machine learning classification model can be augmented to model the image as a mixture of subjects, where each subject is represented through placements of the visual objects in a mixture of concentric spheres centering on a mixture of intersections on a mixture of horizontal layers. At least one processor can learn latent relationships between the placements of the visual objects in a three-dimensional space depicted in the image and image semantics. Learning the latent relationships trains the unsupervised machine learning classification model to perform image subject classification through the placements of the visual objects in a new image.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; removing the sacrificial layer to form a recess; forming a barrier layer and a free layer in the recess; forming a top electrode layer on the free layer; and patterning the top electrode layer and the free layer to form a second MTJ.

Abstract: A stacked wiring structure includes a first wiring substrate and a second wiring substrate. The first wiring substrate includes a first glass substrate, multiple first conductive through vias penetrating through the first glass substrate, and a first multi-layered redistribution wiring structure disposed on the first glass substrate. The second wiring substrate includes a second glass substrate, multiple second conductive through vias penetrating through the second glass substrate, and a second multi-layered redistribution wiring structure disposed on the second glass substrate. The first conductive through vias are electrically connected to the second conductive through vias. The first glass substrate is spaced apart from the second glass substrate. The first multi-layered redistribution wiring structure is spaced apart from the second multi-layered redistribution wiring structure by the first glass substrate and the second glass substrate.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; removing the sacrificial layer to form a recess; forming a barrier layer and a free layer in the recess; forming a top electrode layer on the free layer; and patterning the top electrode layer and the free layer to form a second MTJ.

Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.

Abstract: An enclosure for an electronic device has a staggered materials corner structure. The enclosure includes an integral metal frame defining exterior sides of the enclosure. The integral metal frame has a tab inset and not visible at a corner of the enclosure. The enclosure includes either or both of first and second materials molded around the tab. The tab of the integral metal frame and either or both of the first and second materials define the staggered materials corner structure of the enclosure.

Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.

Abstract: An optical film comprising a first surface and a second surface is provided and the first surface and the second surface face in opposite directions. The first surface is disposed with a plurality of first microstructures and a plurality of second microstructures, which are closely adjacent to each other. The first microstructures are upwardly convex quadrangular pyramid structures or triangular pyramid structures, while the second microstructures are downwardly concave quadrangular pyramid structures or triangular pyramid structures.

Abstract: An automatic locking device for assembling a part to a workpiece is provided. The device includes a feeding mechanism, a fixture mechanism, a loading and unloading mechanism, a lifting mechanism, a rotating mechanism, and a locking mechanism. The feeding mechanism feeds the part to the fixture mechanism. The loading and unloading mechanism places the workpiece on the part. The lifting mechanism lifts up the fixture mechanism together with the part and the workpiece. The rotating mechanism rotates the fixture mechanism. The locking mechanism locks the part to the workpiece after the part and the workpiece are rotated by the rotating mechanism. The automatic locking device integrates multiple functions in a single station, reduces the number of the work stations and operatives, lowers the cost, and improves accuracy of the assembly. An assembling apparatus including the automatic locking device is also provided.

Abstract: A pH sensor for detecting a pH of a sample includes a reference electrode and a glass electrode. The reference electrode includes a hollow tubular housing, and at least one water absorbing unit disposed in the housing and including a porous junction member configured to contact the sample, and a water absorbing member disposed on one side of the porous junction member that is opposite to the sample. The water absorbing member is made by soaking a superabsorbent polymer in potassium chloride solution. The glass electrode is inserted into the water absorbing member, and protrudes from the junction member toward the sample.

Abstract: A multi-type industrial robot control system may include: an automation controller; and a programmable logic controller (PLC)-robot bridge. The controller stores a general-purpose robot control function block generated using a unified design standard, calls a corresponding robot control function block for a robot and using robot state data and puts out corresponding first command data to the PLC-robot bridge. The PLC-robot bridge virtualizes robot interfaces of corresponding offline programming functions of different types of robot as a unified virtual interface, calls a corresponding offline programming function via the unified virtual interface according to the first command data, and generates second command data for output to a corresponding robot controller. The corresponding robot controller controls a corresponding robot. At the same time, robot state data from a corresponding type of robot is received via the unified virtual interface and the robot state data is fed back to the automation controller.

Abstract: A pH sensor for detecting a pH of a sample includes a reference electrode and a glass electrode. The reference electrode includes a hollow tubular housing, and at least one water absorbing unit disposed in the housing and including a porous junction member configured to contact the sample, and a water absorbing member disposed on one side of the porous junction member that is opposite to the sample. The water absorbing member is made by soaking a superabsorbent polymer in potassium chloride solution. The glass electrode is inserted into the water absorbing member, and protrudes from the junction member toward the sample.