Abstract: Capacitors for use in semiconductor devices including a plurality of first trenches in a first region of a substrate, the first trenches extending in a first direction, a plurality of second trenches in the first region of the substrate, the second trenches extending in a second direction other than the first direction, with the adjacent second trenches and first trenches cooperating to define protruding structures and island structures having an upper surface that is at or below a plane defined by a portion of an upper surface of a substrate surrounding the first region with a series of film pairs including a dielectric layer and a conductive layer formed in the first and second trenches and the protruding and island structures.

Abstract: Various embodiments of the teachings herein include a method for controlling a plurality of execution mechanisms. The method may include: determining a dependency relationship of synchronous motions among the plurality of execution mechanisms, wherein the dependency relationship represents motions of a second group of execution mechanisms in the plurality of execution mechanisms depending on motions of a first group of execution mechanisms in the plurality of execution mechanisms; determining an execution order of the first group of execution mechanisms and the second group of execution mechanisms according to the dependency relationship; determining rotation angles of joints coupled to corresponding execution mechanisms; and sequentially controlling the joints to respectively rotate by the determined rotation angles according to the determined execution order.

Abstract: A pyrazole metal complex for absorption of carbon dioxide, a method for preparing the pyrazole metal complex, and a method for absorbing carbon dioxide are provided; wherein the product produced by reacting pyrazole metal complex and carbon dioxide may be transformed into several economically valuable compounds.

Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board, a testing socket, a conductive fastener, a cover, and a conductive element assembly. The printed circuit board includes a first metal layer formed on the bottom surface thereof. The testing socket is disposed above the printed circuit board. The conductive fastener is configured to secure the testing socket to the printed circuit board, wherein the conductive fastener is electrically connected to the first metal layer and the testing socket. The cover is disposed above the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket, wherein the cover makes electrical contact with the integrated circuit package. The conductive element assembly is disposed between and electrically connected to the cover and the testing socket.

Abstract: A backlight module is provided. The backlight module includes a substrate; a plurality of light-emitting elements, disposed on the substrate along a first direction and a second direction; and at least one optical film, including: a first surface, having a plurality of cone structures, top points of the cone structures being arranged to form a plurality of first ridges. In addition, an angle is between the first ridge and the first direction; and a second surface, corresponding to the first surface and toward the substrate, the plurality of light-emitting elements being between the substrate and the second surface.

Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board having a first surface, a second surface, and multiple conductive layers between the first and second surfaces. A metal layer is formed on the second surface and is electrically connected to one of the conductive layers that is grounded. A testing socket is disposed over the first surface. A conductive fastener secures the testing socket to the printed circuit board and is electrically connected to the metal layer. A cover is disposed over the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket. The cover has a conductive surface in contact with the integrated circuit package. A conductive element assembly is disposed between the cover and the testing socket and is electrically connected to the conductive surface and the conductive fastener.

Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board having a first surface, a second surface, and multiple conductive layers between the first and second surfaces. A metal layer is formed on the second surface and is electrically connected to one of the conductive layers that is grounded. A testing socket is disposed over the first surface. A conductive fastener secures the testing socket to the printed circuit board and is electrically connected to the metal layer. A cover is disposed over the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket. The cover has a conductive surface in contact with the integrated circuit package. A conductive element assembly is disposed between the cover and the testing socket and is electrically connected to the conductive surface and the conductive fastener.

Abstract: The present disclosure provides a bioprinting system (100) for printing a liquid directly onto a subject. The bioprinting system (100) comprises a bioprinting assembly (102). Optionally, a robotic arm (104) and a control system (150) are provided. The bioprinting assembly (102) may be coupled to the robotic arm (104) to be positionable relative to the subject. The bioprinting assembly (102) is configured to dispense the liquid onto the subject and comprises a reservoir (120) for holding the liquid and a loading mechanism (134) to prime the reservoir (120) with the liquid directly prior to printing. The loading mechanism (134) has a one way inlet to permit liquid to be loaded into the reservoir (120) and prevent fluid from exiting the reservoir via the one way inlet. There is also provided associated methods.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.

Abstract: A pyrazole metal complex for absorption of carbon dioxide, a method for preparing the pyrazole metal complex, and a method for absorbing carbon dioxide are provided; wherein the product produced by reacting pyrazole metal complex and carbon dioxide may be transformed into several economically valuable compounds.

Abstract: The present invention discloses a hybrid (mixed) formulation composition for 3D additive manufacturing and a manufacturing process. The hybrid formulation composition possesses capability of UV radiation curing and thermal curing. The hybrid formulation composition is designed to be cured by UV radiation in the 3D printing/additive manufacturing process and then post cure by heat to get its final properties. The hybrid formulation composition consists of acrylates (oligomer, monomer, and diluent), photoinitiators, and isocyanate-containing prepolymers which comprises polyols (di-ol, tri-ol) and isocyanates. The hybrid formulation composition may also include reaction accelerator, dye, pigment, and fillers. The finished products of the hybrid formulation composition possess rubber-like properties and can be used in the applications such as shoe sole, toys, medical, and wearables goods . . . etc.

Abstract: The present invention discloses a hybrid (mixed) formulation composition for 3D additive manufacturing and a manufacturing process. The hybrid formulation composition possesses capability of UV radiation curing and thermal curing. The hybrid formulation composition is designed to be cured by UV radiation in the 3D printing/additive manufacturing process and then post cure by heat to get its final properties. The hybrid formulation composition consists of acrylates (oligomer, monomer, and diluent), photoinitiators, and isocyanate-containing prepolymers which comprises polyols (di-ol, tri-ol) and isocyanates. The hybrid formulation composition may also include reaction accelerator, dye, pigment, and fillers. The finished products of the hybrid formulation composition possess rubber-like properties and can be used in the applications such as shoe sole, toys, medical, and wearables goods . . . etc.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.

Abstract: A method of manufacturing a capacitor including the operations of etching a plurality of primary trenches into a first region of a substrate, the primary trenches extending in a first direction, etching a plurality of secondary trenches into the first region of the substrate, the secondary trenches extending in a second direction other than the first direction, with the adjacent secondary trenches and adjacent primary trenches jointly defining an island structure having an upper surface that is recessed relative to an upper surface a surrounding substrate, and depositing a series of film pairs including a dielectric layer and a conductive layer.

Abstract: A backlight module is provided. The backlight module includes a substrate; a plurality of light-emitting elements, disposed on the substrate along a first direction and a second direction; and at least one optical film, including: a first surface, having a plurality of cone structures, top points of the cone structures being arranged to form a plurality of first ridges. In addition, an angle is between the first ridge and the first direction; and a second surface, corresponding to the first surface and toward the substrate, the plurality of light-emitting elements being between the substrate and the second surface.

Abstract: A coupling including a main body, a first hub at a first end of the main body and a second hub at a second end of the main body opposite the first end is provided. The first hub includes a first inner bore configured to receive a first shaft and a pair of aligned first and second through holes extending through opposite walls of the first hub. The first through hole and the second through hole are in optical communication with the first inner bore.

Abstract: An oxygen supply apparatus is configured to directly supply oxygen-containing gas to an user for inhalation while facilitating blood circulation of a specific portion of the user. The oxygen supply apparatus includes a power supply; an oxygen-containing gas source for providing the oxygen-containing gas; a gas catheter having one end thereof connected to the oxygen-containing gas source; an inhalator connected to the other end of the gas catheter; and a circulation facilitating device at least partially attached to the specific portion of the user. The circulation facilitating device includes a sonic oscillation circuit and a housing.

Abstract: A backlight module includes that of: a substrate; a plurality of light-emitting elements, disposed on the substrate along a first direction and a second direction; and at least one optical film, comprising: a first surface, having a plurality of microstructures, the microstructures being parallel to each other, every microstructure having a first ridge, and an angle being between the first ridge and the first direction; and a second surface, corresponding to the first surface and toward the substrate, the plurality of light-emitting elements being between the substrate and the second surface; wherein a distance X is between the light-emitting element and the other light-emitting element that is adjacent to the light-emitting element along the first direction, and a distance Y is between the light-emitting element and the other light-emitting element that is adjacent to the light-emitting element along the second direction, hence a range of the angle is: ( tan - 1 ? Y X ) - 10 ? ° ? ? ? (

Abstract: An optical film and a backlight module are provided. The optical film includes a first surface and a second surface. The first surface includes a plurality of triangular pyramid structures, the triangular pyramid structure has a vertex, and the vertex extends toward a second surface. The second surface includes a plurality of orthogonal curved structures.