Patents by Inventor Wen-Feng Liu
Wen-Feng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8882426Abstract: A coated fastener has a tip and a coating on the fastener, at least at the tip. The coating is formulated from a solvent-borne resin. The fastener includes one or both of a solids based additive in the solvent-borne acrylic resin and an overcoat on the solvent-borne acrylic resin. A strip of collated fasteners with the coating is also disclosed.Type: GrantFiled: August 25, 2011Date of Patent: November 11, 2014Assignee: Illinois Tool Works Inc.Inventors: Christopher A. Horst, Jyi-Jiin Luo, Wen-Feng Liu, Daniel V. Chin, Daniel P. Birr
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Publication number: 20140209662Abstract: A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed.Type: ApplicationFiled: September 30, 2013Publication date: July 31, 2014Applicant: Illinois Tool Works Inc.Inventors: Douglas Ngai, Joo Yong Tay, Wen-Feng Liu, Roberto P. Loera, Steven Dwade Cook
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Publication number: 20130256389Abstract: A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed.Type: ApplicationFiled: April 2, 2012Publication date: October 3, 2013Applicant: ILLINOIS TOOL WORKS INC.Inventors: Douglas Ngai, Joo Yong Tay, Wen-Feng Liu, Roberto P. Loera, Steven Dwade Cook
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Publication number: 20120057950Abstract: A coated fastener has a tip and a coating on the fastener, at least at the tip. The coating is formulated from a solvent-borne resin. The fastener includes one or both of a solids based additive in the solvent-borne acrylic resin and an overcoat on the solvent-borne acrylic resin. A strip of collated fasteners with the coating is also disclosed.Type: ApplicationFiled: August 25, 2011Publication date: March 8, 2012Applicant: ILLINOIS TOOL WORKS INC.Inventors: Christopher A. Horst, Jyi-Jiin Luo, Wen-Feng Liu, Daniel V. Chin, Daniel P. Birr
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Patent number: 8058345Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.Type: GrantFiled: May 8, 2009Date of Patent: November 15, 2011Assignee: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Chabut
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Patent number: 8026321Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.Type: GrantFiled: July 16, 2007Date of Patent: September 27, 2011Assignee: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Bucquet, Barbara Chabut
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Publication number: 20090215964Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.Type: ApplicationFiled: May 8, 2009Publication date: August 27, 2009Applicant: ILLINOIS TOOL WORKS INC.Inventors: Barbara Chabut, Wen-Feng Liu
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Patent number: 7544739Abstract: Disclosed are adhesive compositions including polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and reactive multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition polymerized resins. The adhesives in preferred embodiments exhibit enhanced bonding strength at high temperatures, such as at about 80° C., and enhanced the fire resistance.Type: GrantFiled: October 6, 2003Date of Patent: June 9, 2009Assignee: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Chabut
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Publication number: 20090131608Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.Type: ApplicationFiled: July 16, 2007Publication date: May 21, 2009Applicant: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Bucquet, Barbara Chabut
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Patent number: 7368170Abstract: A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000 centipoise. The chemical anchoring adhesive can be in the form of a slug or rope. The first and second parts are directly joined along an interface, which may extend the length of the slug or rope. The first part includes a resin and a particulate filler of a type and amount required to achieve the desired viscosity. The second part includes a curing agent and a particulate filler of a type and amount required to achieve the desired viscosity.Type: GrantFiled: July 1, 2004Date of Patent: May 6, 2008Assignee: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Eldridge Presnell, James E. Surjan
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Patent number: 7244793Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.Type: GrantFiled: September 21, 2004Date of Patent: July 17, 2007Assignee: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Bucquet, Barbara Chabut
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Patent number: 7226650Abstract: A film wrapper for use in storing slugs and ropes of chemical anchoring adhesive includes an outer metallized polymer layer and a heat seal layer. The metallized polymer layer protects the chemical anchoring adhesive from premature reaction by providing a barrier to oxygen and light. The heat seal layer may also act as a moisture barrier layer. The chemical anchoring adhesive is divided into slugs of appropriate size for insertion into boreholes and cementing of anchor pins in the boreholes.Type: GrantFiled: July 1, 2004Date of Patent: June 5, 2007Assignee: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Eldridge Presnell, James E. Surjan
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Publication number: 20060062955Abstract: A decorative laminate includes a laminate substrate coated with an adhesive layer. The adhesive layer is a layer of a physically setting, solvent-free adhesive material including an acrylic polymer. The adhesive layer is self-adhesive at room temperature. The adhesive-coated laminate substrate has a peeling-off force of at least 0.2 N/mm2, after application on a carrier. A method for the production of the adhesive-coated laminate substrate, its use as a coating material, and a composite of the adhesive-coated laminate substrate and a carrier material are also provided.Type: ApplicationFiled: November 14, 2005Publication date: March 23, 2006Inventors: Wen-Feng Liu, James Stone, Donald Schaefer, Lutz Reitzel
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Publication number: 20060004127Abstract: A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000 centipoise. The chemical anchoring adhesive can be in the form of a slug or rope. The first and second parts are directly joined along an interface, which may extend the length of the slug or rope. The first part includes a resin and a particulate filler of a type and amount required to achieve the desired viscosity. The second part includes a curing agent and a particulate filler of a type and amount required to achieve the desired viscosity.Type: ApplicationFiled: July 1, 2004Publication date: January 5, 2006Inventors: Wen-Feng Liu, Eldridge Presnell, James Surjan
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Publication number: 20060003128Abstract: A film wrapper for use in storing slugs and ropes of chemical anchoring adhesive includes an outer metallized polymer layer and a heat seal layer. The metallized polymer layer protects the chemical anchoring adhesive from premature reaction by providing a barrier to oxygen and light. The heat seal layer may also act as a moisture barrier layer. The chemical anchoring adhesive is divided into slugs of appropriate size for insertion into boreholes and cementing of anchor pins in the boreholes.Type: ApplicationFiled: July 1, 2004Publication date: January 5, 2006Inventors: Wen-Feng Liu, Eldrige Presnell, James Surjan
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Publication number: 20050090626Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.Type: ApplicationFiled: September 21, 2004Publication date: April 28, 2005Applicant: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Bucquet, Barbara Chabut
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Publication number: 20040157997Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.Type: ApplicationFiled: October 6, 2003Publication date: August 12, 2004Applicant: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Chabut
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Publication number: 20040127680Abstract: A composition capable of providing excellent bonding characteristics, including bond strength, even at relatively high temperatures and even without the use of styrene as a reactive diluent, comprising polymerizable vinyl ester compounds, preferably in combination with a select reactive diluent for the polymerizable vinyl ester compounds, wherein the polymerizable vinyl ester compounds are preferably present in the adhesive compositions in amounts of from about 10 wt % to about 30 wt %.Type: ApplicationFiled: October 6, 2003Publication date: July 1, 2004Applicant: Illinois Tool Works Inc.Inventors: Barbara Chabut, Wen-Feng Liu
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Patent number: 6462107Abstract: Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. The compositions are particularly useful in the manufacture of laminable films used to make printed wiring boards. Multilayer printed wiring boards made using such films, and methods for making and using the films and boards, also are disclosed.Type: GrantFiled: December 22, 1998Date of Patent: October 8, 2002Assignee: The Texas A&M University SystemInventors: David P. Sinclair, Douglas E. Fjare, John T. Hoback, Terre L. VanKirk, Donald E. Rubis, David A. Wargowski, Wen-Feng Liu, Paul A. Sanchez
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Patent number: 5330832Abstract: A water soluble pressure sensitive adhesive composition is disclosed wherein polyvinyl methyl ether is the major component and a styrenic block copolymer is the second component, the polyvinyl methyl ether and styrenic block copolymer present in a weight ratio of from about 95:5 to about 88:12, said styrenic block copolymer in said composition comprising less than about 14 percent by weight of the weight of the polyvinyl methyl ether. The pressure sensitive adhesive is useful for bonding polyethylene, polypropylene, ethylene-propylene copolymers, and paper.Type: GrantFiled: March 22, 1993Date of Patent: July 19, 1994Assignee: Amoco CorporationInventor: Wen-Feng Liu