Abstract: A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die and a surface of a substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hydrophobic structures include non-vertical inward sloping sidewalls or similar features to contain a liquid droplet that is applied to the die or substrate hybrid bonding region. After the hybrid bonding regions are brought together, capillary forces cause the die to self-align, and a hybrid bond is formed by evaporating the liquid and subsequent anneal. IC structures including the IC die and portions of the substrate are segmented and assembled.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. One or both of an integrated circuit (IC) die hybrid bonding region and a base substrate hybrid bonding region surrounded by hydrophobic structures that include a cross-linked material. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet and a subsequent anneal. The cross-linked material hydrophobic structures contain the liquid droplet for alignment and are resistant to plasma treatment prior to bonding.

Abstract: Hybrid bonded multi-level die stacks, related apparatuses, systems, and methods of fabrication are disclosed. First-level integrated circuit (IC) dies and a base substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet followed by anneal. Hybrid bonding regions of second-level IC dies are similarly bonded to hybrid bonding regions on backsides of the first-level IC dies. This is repeated for any number of subsequent levels of IC dies. IC structures including the bonded IC dies and portions of the base substrate are segmented and assembled.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die backside surface and a surface of a structural substrate each include bonding regions surrounded by hydrophobic structures. A liquid droplet is applied to the die or structural substrate bonding region and the die is placed on the bonding region of the structural substrate. Capillary forces cause the die to self-align to the bonding region, and a bond is formed by evaporating the liquid and subsequent anneal. A hybrid bond is then formed between the opposing active surface of the die and a base substrate using wafer-to-wafer bonding. IC structures including the IC die and portions of the structural substrate and base substrate are segmented from the bonded wafers and assembled.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. One or both of an integrated circuit (IC) die hybrid bonding region and a base substrate hybrid bonding region are surrounded by a protective layer and hydrophobic structures on the protective layer. The protective layer is formed prior to pre-bond processing to protect the hybrid bonding region during plasma activation, clean test, high temperature processing, or the like. Immediately prior to bonding, the hydrophobic structures are selectively applied to the protective layer. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet and a subsequent anneal. The hydrophobic structures contain the liquid droplet for alignment during bonding.

Abstract: A surface of at least one of an integrated circuit (IC) die structure or a substrate structure to which the IC die structure is to be bonded include a biphilic region suitable for liquid droplet confinement and droplet-based fine alignment of the IC die structure to the substrate structure. A biphilic region may include an inner region surrounded by bonding regions, or between an adjacent pair of bonding regions. The inner region may improve fine alignment, particularly if there is a significant amount of tilt between a bonding surface of the IC die structure and a bonding surface of the substrate structure during placement. The inner region may, for example, facilitate the confinement of two or more droplets on the bonding regions. Inner or outer regions of a biphilic structure may be segmented or contiguous and intersecting IC die edges may also be non-orthogonal.

Abstract: A child carrier includes: a seat portion; a buckle movably provided on the seat portion; a backrest portion connected to the seat portion and extending upward, the backrest portion having a plurality of adjustment holes formed therein from bottom to top; and a shoulder strap having a fixed end and a free end, the fixed end being fixed on a rear side of the backrest portion, the free end passing through one of the plurality of adjustment holes and being removably connected to the seat portion.

Abstract: Magnetic inductors for microelectronics packages are provided. Magnetic inductive structures include a magnetic region, a magnetic region base region, and a conductive region that forms a channel within the magnetic region. The magnetic region has a different chemical composition than the base region. Additional structures are provided in which the magnetic region is recessed into a package substrate core. Further inductor structures are provided in which the conductive region includes through-core vias and the conductive region at least partially encircles a portion of a package substrate core. Additionally, methods of manufacture are provided for semiconductor packages that include magnetic inductors.

Abstract: A bidirectional Littrow two-degree-of-freedom grating interference measurement device based on double gratings includes a transmission two-dimensional grating and a reflection two-dimensional grating. A dual-frequency laser emitted by a light source passes through the transmission two-dimensional grating with a specific grating pitch to form four beams in X direction and Y direction, the four beams are incident on the reflection two-dimensional grating at a Littrow angle, and the four beams diffracted by the reflection two-dimensional grating return to the transmission two-dimensional grating in an incidence direction along the same path; different orders of transmission light of the four beams of light in different directions may form stable interference signals carrying displacement information, and the stable interference signals are received by a detector.

Abstract: A method and a device for compensating a surface error of a holographic grating substrate based on scanning and exposure technology relates to a technical field of grating development. The method and the device adopt surface error compensation technology based on phase modulation of interference fringes of a scanning beam interference lithography system. The method and the device solve a poor grating diffraction wavefront quality caused by a surface processing error in a field of holographic grating research and improves full-aperture diffraction wavefront quality of a grating.

Abstract: The embodiments of the disclosure provide a method, apparatus, device and storage medium for presenting information, which relate to the technical field of computers. The method includes: obtaining object search information, in response to the object search information being object category information, determining a target object category corresponding to the object search information, and presenting object information of a plurality of target objects corresponding to the target object category in a search result presentation page; where all the plurality of target objects are different, and object information of a target object includes object attribute information and image resource information of the target object. By employing the above technical solution, when the user is searching the object category, object information of a plurality of target objects different from each other corresponding to the target object category is presented in the search result page.

Abstract: Disclosed are a passive triggered-power electronic tap-changer device and a contact device. The power electronic tap-changer device comprises: two taps, a main contact, two auxiliary contacts, two trigger contacts, an output terminal, two thyristors, and four voltage divider resistors, which can achieve the passive triggering of a power electronic switch by means of controlling the auxiliary contacts and the trigger contacts. Provided in the present invention is a contact device for the passive triggered-power electronic tap-changer, comprising: at least two stationary contacts, a main contact, two thyristor trigger contacts, two thyristor auxiliary contacts, and a drive shaft, wherein the main contact, the thyristor trigger contacts, and the thyristor auxiliary contacts are fixed to the drive shaft, the contact device can switch the power electronic switch to different stationary contacts by means of controlling the rotation of the drive shaft, and maintains the switching time sequence of passive triggering.

Abstract: Disclosed are a grating displacement measurement device and a grating displacement measurement method using a double-layer floating reading head, a medium, and an apparatus. A first measurement grating group is arranged on two first side edges of a substrate working surface, and a second measurement grating group is symmetrically arranged on both sides of a first reference line and close to a light-through member. A reading component is provided between a first measurement grating and a second measurement grating arranged on the same side, and each reading component is used to collect a first position information of the first measurement grating and a second position information of the second measurement grating. In the technical solutions, by using multi-channel position information output by two reading components in combination with a displacement solution algorithm.

Abstract: A heterodyne two-dimensional grating measuring device and measuring method thereof includes a light source, a reading head, a photoelectric receiving module, and a processor. The light source is configured to generate two beams of linearly polarized light having characteristics of overlapping, polarization orthogonal, and fixed frequency difference. The reading head is configured to receive the two beams of the linearly polarized light, the two beams of the linearly polarized light are respectively incident on a surface of a moving two-dimensional measuring grating to generate ±1-order diffracted lights of two dimensions, and the ±1-order diffracted lights are respectively incident to the photoelectric receiving module through the reading head.

Abstract: A child carrier includes: a seat portion; a buckle movably provided on the seat portion; a backrest portion connected to the seat portion and extending upward, the backrest portion having a plurality of adjustment holes formed therein from bottom to top; and a shoulder strap having a fixed end and a free end, the fixed end being fixed on a rear side of the backrest portion, the free end passing through one of the plurality of adjustment holes and being removably connected to the seat portion.

Abstract: Disclosed are a power device and a photovoltaic power generation device. The power device comprises a case, a first power board, and a second power board, the first power board is arranged in the case, and a first boosting module and an inverter module are arranged on the first power board; the second power board is arranged in the case, the second power board is electrically connected to the first power board, and a second boosting module is arranged on the second power board. According to the technical solution of the present invention, the rated power generation power of the photovoltaic power generation device can be increased, and the flexibility for clients is improved.

Abstract: The present invention relates to a flavor nanoemulsion comprising a surfactant system comprising a polyoxyethylene sorbitan fatty acid ester and a polyglycerol ester of fatty acids (PGE), a non-polar phase comprising a flavor oil, and a polar phase. The invention further relates to a flavored beverage comprising the flavor nanoemulsion according to the invention.

Abstract: A threading sealing box includes a box body and a threading assembly, and an opening is formed in the box body, a mounting groove is formed in a side wall of the box body, the threading assembly comprises a threading plate assembly and a threading body, the threading plate assembly is slidably arranged in the mounting groove so as to slide into or slide out of the mounting groove, a penetrating hole is formed in the threading plate assembly, the threading body is arranged on the threading plate assembly, and the threading body communicates with the penetrating hole. A cable penetrating through the threading body can be circumferentially sealed by the threading body, thereby effectively reducing the water leakage risk; the cable does not need to be locked by using accessories such as a waterproof terminal, such that the operation is simple.