Abstract: The present disclosure provides a wearable display device that relates to the field of virtual reality technology. Because the wearable display device has a high efficiency in processing electric signals transmitted via each of the photoelectric sensor assemblies, the wearable display device can quickly determine a gaze position of eyes of a user on the display panel based on an electric signals transmitted via each of the photoelectric sensor assemblies. In this way, the efficiency of the display panel in displaying images is improved, and the refresh rate of the display panel is higher.

Abstract: The disclosure provides a three-dimensional (3D) memory, a method of fabricating a 3D memory and a memory system. The 3D memory can include a stack including alternately stacked first dielectric layers and conductive layers, and a channel structure extending through the stack and including a second dielectric layer and a blocking layer disposed in this order from outside to inside. The second dielectric layer can have a dielectric constant greater than or equal to 3.9.

Abstract: Semiconductor fabrication component preparation methods are described. In embodiments, the methods include forming a first layer on a surface of the semiconductor fabrication component. The first layer is characterized by a porosity of greater than or about 0.01 vol. %. The methods further include depositing a second layer on the first layer, where the second layer is characterized by a porosity of less than or about 20 vol. %. Treated semiconductor fabrication components are also described. In embodiments, the treated components include a first layer formed in the surface of the semiconductor fabrication component, where the first layer is characterized by a porosity of greater than or about 0.01 vol. %., and a second layer positioned on the first layer, where the second layer is characterized by a porosity of less than or about 20 vol. %.

Abstract: A light emitting device includes an epitaxial structure and first and second electrodes on a side of the epitaxial structure. The epitaxial structure includes a first-type semiconductor layer, an active layer, and a second-type semiconductor layer. The active layer is disposed between the first-type semiconductor layer and the second-type semiconductor layer. The first electrode is disposed on the epitaxial structure to be electrically connected with the first-type semiconductor layer. The second electrode is disposed on the epitaxial structure to be electrically connected with the second-type semiconductor layer. The second electrode is in ohmic contact with a second-type window sublayer of the second-type semiconductor layer.

Abstract: In some embodiments, a method sends a set of first requests for a set of first segments of a video in a playback session. A first protocol from a plurality of protocols is specified in at least one of the set of first requests. The set of first segments is received. The method determines whether to switch from using the first protocol to a second protocol in the playback session based on receiving the set of first segments. When switching to the second protocol, the method sends a second request in the playback session, wherein the second request indicates the second protocol is to be used to send a second segment of the video.

Abstract: Various embodiments disclosed relate to a method of forming a composite including a carbon composite structure. The method includes disposing a precursor composition on a substrate. The composition includes a porogen component, a carbon component, and a catalyst component. The method further includes irradiating the precursor composition to form the carbon composite structure.

Abstract: A method and an apparatus for detecting a relative location between devices is disclosed. The detection method includes: obtaining a first target audio signal obtained by a first microphone of a device B; determining a first audio segment and a second audio segment based on a first target moment and the first target audio signal, where the first target moment is a moment determined in the first target audio signal based on a target amplitude; separately searching for the first audio segment and the second audio segment to obtain a first arrival moment and a second arrival moment; and determining a relative location between a device A and the device B based on the first arrival moment and the second arrival moment.

Abstract: An electronic device such as a voice-controlled speaker may have an array of strain gauges and light-emitting diodes. The light-emitting diodes may be configured to display dynamically adjustable button icons overlapping the strain gauges. Force measurements from the strain gauges may be used to adjust speaker output and other device operations.

Abstract: Disclosed in the present invention is a nonlinear optical crystal. The chemical formula of the nonlinear optical crystal is MHgGeSe4, M being selected from Ba or Sr. The nonlinear optical crystal has no symmetrical center, belongs to an orthorhombic crystal system, and has a space group Ama2. The nonlinear optical crystal is an infrared nonlinear optical crystal, and has the advantages of great nonlinear optical effect, wide light transmitting band, high hardness, good mechanical properties, breakage resistance, deliquescence resistance, easiness in processing and preserving, etc. Also disclosed in the present invention are a method for preparing the nonlinear optical crystal and application thereof.

Abstract: An energy Internet system, an energy routing conversion device, and an energy control method, relating to a field of energy information. An alternating-current (AC) side energy routing conversion device of the energy Internet system includes a plurality of first route ports, and a direct-current (DC) side energy routing conversion device includes a plurality of second route ports, where each second route port is connected to a corresponding first route port by means of a corresponding DC busbar. A plurality of energy devices are connected to a DC busbar by means of corresponding first AC/DC converters or first DC converters. The AC side energy routing conversion device and the DC side energy routing conversion device collect energy information of the energy devices and adjust energy of the energy devices on a basis of energy balance constraint conditions.

Abstract: A method and apparatus for controlling stratum deformation in a shield construction process, a non-volatile storage medium, and a processor are disclosed. The method includes: monitoring settlement characteristic parameters in a shield construction process; predicting a settlement proportion according to the settlement characteristic parameters, the settlement proportion being a ratio between a predicted settlement value and a corresponding settlement threshold; and determining construction parameters in the shield construction process according to the settlement proportion.

Abstract: An inverter and a heat radiation structure thereof are provided. The heat radiation structure of the inverter includes a heat radiator for radiating heat from a heating element of the inverter, and a heat radiation fan for air-cooling the heat radiator. The heat radiator includes multiple heat radiation fins able to be air-cooled. The number of the heat radiator is at least two, and two adjacent heat radiators are a first heat radiator and a second heat radiator respectively. The heat radiation fan is provided between the first heat radiator and the second heat radiator, and the heat radiation fan is located on the tops of the heat radiation fins. In the heat radiation structure of the inverter, the heat radiation fan is capable of cooling the first heat radiator and the second heat radiator at the same time.

Abstract: A child carrier includes: a seat portion; a buckle movably provided on the seat portion; a backrest portion connected to the seat portion and extending upward, the backrest portion having a plurality of adjustment holes formed therein from bottom to top; and a shoulder strap having a fixed end and a free end, the fixed end being fixed on a rear side of the backrest portion, the free end passing through one of the plurality of adjustment holes and being removably connected to the seat portion.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include an interconnect die in a first layer surrounded by a dielectric material; a processor integrated circuit (processor IC) and an integrated circuit (IC) in a second layer, the second layer on the first layer, wherein the interconnect die is electrically coupled to the processor IC and the IC by first interconnects having a pitch of less than 10 microns between adjacent first interconnects; a photonic integrated circuit (PIC) and a substrate in a third layer, the third layer on the second layer, wherein the PIC has an active surface, and wherein the active surface of the PIC is coupled to the IC by second interconnects having a pitch of less than 10 microns between adjacent second interconnects; and a fiber connector optically coupled to the active surface of the PIC.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die having a surface; a template structure having a first surface and an opposing second surface, wherein the first surface of the template structure is coupled to the surface of the first die, and wherein the template structure includes a cavity at the first surface and a through-template opening extending from a top surface of the cavity to the second surface of the template structure; and a second die within the cavity of the template structure and electrically coupled to the surface of the first die by interconnects having a pitch of less than 10 microns between adjacent interconnects.

Abstract: Multi-die packages including IC die crack mitigation features. Prior to the bonding of IC dies to a host substrate, the IC dies may be shaped, for example with a corner radius or chamfer. After bonding the shaped IC dies, a fill comprising at least one inorganic material may be deposited over the IC dies, for example to backfill a space between adjacent IC dies. With the benefit of a greater IC die sidewall slope and/or smoother surface topology associated with the shaping process, occurrences of stress cracking within the fill and concomitant damage to the IC dies may be reduced. Prior to depositing a fill, a barrier layer may be deposited over the IC die to prevent cracks that might form in the fill material from propagating into the IC die.

Abstract: Microelectronic devices, assemblies, and systems include a multichip composite device having one or more integrated circuit dies bonded to a base die and an inorganic dielectric material adjacent the integrated circuit dies and over the base die. The multichip composite device includes a dummy die, dummy vias, or integrated fluidic cooling channels laterally adjacent the integrated circuit dies to conduct heat from the base die.

Abstract: Techniques and mechanisms to mitigate warping of a composite chiplet. In an embodiment, multiple via structures each extend through an insulator material in one of multiple levels of a composite chiplet. The insulator material extends around an integrated circuit (IC) component in the level. For a given one of the multiple via structures, a respective annular structure extends around the via structure to mitigate a compressive (or tensile) stress due to expansion (or contraction) of the via structure. In another embodiment, the composite chiplet additionally or alternatively comprises a structural support layer on the multiple levels, wherein the structural support layer has formed therein or thereon dummy via structures or a warpage compensation film.

Abstract: Microelectronic devices, assemblies, and systems include a multichip composite device having one or more chiplets bonded to a base die and an inorganic dielectric material adjacent the chiplets and over the base die. The multichip composite device is coupled to a structural member that is made of or includes a heat conducting material, or has integrated fluidic cooling channels to conduct heat from the chiplets and the base die.

Abstract: A heterodyne one-dimensional grating measuring device and measuring method thereof, including a light source, a reading head, a photoelectric receiving module, and a signal processing system. The light source is configured to generate two linearly polarized lights having characteristics of overlapping, polarization orthogonal, and fixed frequency difference. The reading head is configured to receive two beams of polarized lights and be respectively incident on a surface of a moving measuring grating to generate a +1-order diffracted light and a ?1-order diffracted light. The photoelectric receiving module is configured to receive the +1-order diffracted light and the ?1-order diffracted light to form two paths of beat frequency signals. The signal processing system is configured to perform differential calculation on the two paths of the beat frequency signals to realize a displacement measurement of single diffraction of the measuring grating for four-fold optical subdivision.