Abstract: A dual-effect heat dissipating fan comprising an axial flow fan and an eccentric fan is disclosed. The top of the eccentric fan is a dome. The upper end of blades of the eccentric flow fan are aligned with the blade at the lower end in the same axial line so that the two are overlapped and thus. The airflow guided therein will concentrate in this area and then is blown out in an eccentric way; and therefore, the efficiency of heat dissipating is improved.

Abstract: Pre-windshield wiper auxiliary device which is detachably parallelly mounted on the arched arm of the windshield wiper. The auxiliary device includes an auxiliary unit and connecting members. The auxiliary unit includes a seat body provided with a wiping member and brush hairs. Each connecting member includes an upper bracket one end of which is resiliently connected with the seat body of the auxiliary unit. The wiping member of the seat body is section by section connected with several arched arms which are pivotally connected with the seat body, whereby the wiping member can more resiliently snugly attach to the arched surface of the windshield.

Abstract: A high performance radiator fan includes an axial fan and a centrifugal fan. The axial fan has a plurality of arched-shaped blades located between a protrusive circular hub and a closed motor shell for drawing airflow from the upper end of the axial fan through the curved blades into the centrifugal fan. The airflow is converged and spun out at high speed and great volume by centrifugal force to enhance heat dissipation efficiency.

Abstract: A method for removing chemisorbed halogens from the surface of a silicon wafer after a plasm etching process is described. The removal takes place before the wafer is unloaded from the etching chamber in order to avoid exposure to atmospheric moisture. Exposure to moisture would cause the discharge of the chemisorbed halogen into the ambient causing corrosion of metal surfaces, particulate formation which reduces product yield, and unsafe halogen levels near the etching tool. The method is particularly useful during silicon etching with HBr where considerable amounts of bromine are chemisorbed onto wafer surfaces. After the etching process is complete, and without breaking vacuum, a carrier gas containing water vapor is flowed over the wafer for a brief time period. The chemisorbed bromine reacts with the water vapor and is converted to HBr which is then purged from the chamber.

Abstract: A distributive web page management system for managing web page editing data of a website so that an editor can finish web page edition from any end user computer on the network. When a web page management system procedure is initiated, the user is registered in the system. The management system then downloads user assigned web page data to the end user computer according to predetermined privileges. The user edits web pages using the downloaded data and sends the edited web page data back to the server host. The management system replace the original data by the received web page data edited by the user according to his privilege so as to update the web page contents, thus completing the web page editing procedure.

Abstract: A goggles assembly has a one-piece molded frame which includes a pair of lens rims, a bridge interconnecting the lens rims, and a pair of looped protective pads connected to and lining the lens rims. The lens rims have a stiffness sufficient to resist deformation caused by a pulling force. The bridge has a stiffness different from that of the lens rims. The protective pads have flexibility and softness sufficient to flex so as to conform to the profile of a wearer's face. The molded frame is fabricated from at least two different molding compositions, one of which has high stiffness to impart rigidity to the lens rims, and the other one of which imparts good flexibility to the protective pads.

Abstract: A heat sink with a multi-layer dispersion space is directly molded to form an upper and a lower flowing layer. A twin fan design is incorporated into the main body of the heat whereby a pair of centered circular recesses respectively formed for the reception of the cooling fans in the main body of the heat sink. In addition, fan supporters are fixed within the respective circular recesses in order to anchor said cooling fans to the main body of the heat sink; wherein each fan supporter comprises a stopping plate for diverting flow from the lower flowing layer tangentially from the respective fan recess.

Abstract: A key pad includes a membrane circuit, a flat frame mounted on the membrane circuit to hold a set of key switches in respective openings on the flat frame, each key switch having a key body molded in one opening on the flat frame, a key cap integral with the key body at the top and carrying a respective sign, a rubber cone integral with the key body at the bottom, and an electrically conductive element integral with the rubber cone on the inside for triggering a respective contact at the membrane circuit upon each down stroke of the respective key switch.

Abstract: Method and apparatus reduce the memory capacity needed to store control codes used to obtain specified frequency values that represent musical tones with a predetermined relationship. The predetermined relationship of the musical tones allows a dual-tone melody generating music box to play melodies two notes at a time. A six-bit code is used to instruct a frequency divider how to divide a master frequency into each desired musical tone.

Abstract: A bushing for combining a fan and heat sink avoids a rack usually required in a conventional combination of fan and heat sink for CPU cooling, and thereby minimizes assembly height and forms a super-thin heat dispersion mechanism. A honeycomb heat sink is designed to increase heat dispersion area for a better heat dispersion efficacy, and a fan body can be fixed at the heat sink directly in virtue of the bushing construction.

Abstract: A bonding pad structure in accordance with the present invention is formed on a semiconductor substrate. The bonding pad structure comprises a buffer layer, a planarization layer, a conducting pad, and a passivation layer. The buffer layer is formed over the semiconductor substrate, and the planarization layer is thereafter formed on the buffer layer. The buffer layer is patterned and etched to shape a plurality of contact holes. The conducting pad is formed on the planarization layer and filled in the contact holes in order to mechanically interlock with the planarization layer. The passivation layer overlies peripherals of the conducting pad forming an overhang region therebetween. Moreover, the width of a portion of the overhang region close to a drawing direction may be enlarged so that the adhesion between the conducting pad and the passivation layer can be increased.

Abstract: New optically active phosphinite compounds which are useful in asymmetric catalysis have been synthesized and have been used in the preparation of rhodium catalysts. Such catalysts are particularly useful in enantioselective catalytic hydrogenation reactions.

Abstract: A fan blade mold is disclosed having a center shaft molding unit and a blade molding unit disposed around the center shaft molding unit and defining with the fan blade mold a plurality of blade molding cavities around the center shaft molding unit for molding the blades of the fan blade, the center shaft molding unit having a longitudinal center cavity for molding the center shaft of the integral fan blade to be molded, a plurality of knock-out pins spaced around the center cavity for knocking out the fan blade and for molding a respective circular dent on a hub of the fan blade, and a reference line raised from the top side and aligned with one lateral side of one blade molding cavity, the knock-out pins being respectively disposed at the radial lines which pass through the point at 1/3 of the radial width of each blade molding cavity measured from the left lateral side of each blade molding cavity.