Patents by Inventor Wen Ho

Wen Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220052489
    Abstract: A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a pair of first contacts and eight second contacts. The pair of first contacts is a pair of differential signal contacts. The second contacts are arranged around the pair of first contacts. Two of the second contacts are arranged along a straight line perpendicular to a connecting line of the pair of first contacts. The position distribution and electrical properties of the other six of the second contacts are symmetrical to each other relative to the straight line.
    Type: Application
    Filed: September 22, 2020
    Publication date: February 17, 2022
    Applicant: Shanghai Zhaoxin Semiconductor Co., Ltd.
    Inventors: Nai-Shung Chang, Yun-Han Chen, Hsiu-Wen Ho, Tsai-Sheng Chen, Chang-Li Tan, Chun-Yen Kang, Hsin-Kuan Wu
  • Publication number: 20210406034
    Abstract: Methods and apparatus for boot time reduction in a processor and programmable logic device environment are disclosed. An example apparatus includes a multicore processor including a first core and a second core. A bootstrap processor is to initialize the first core into a standby mode and initialize the second core into a non-standby mode. A programmable logic device is to be programmed with instructions to be executed by the programmable logic device by the second core via a first connection initialized by the second core. The bootstrap processor is to, upon completion of the programming of the programmable logic device, initialize a data connection between the programmable logic device and the second core.
    Type: Application
    Filed: June 30, 2021
    Publication date: December 30, 2021
    Inventors: Yah Wen Ho, Vincent Zimmer, Tung Lun Loo
  • Patent number: 11118927
    Abstract: Disclosed is a computer-implemented method for recommending booths-to-visit to a user, comprising the following steps: accessing a user record, wherein the user record includes data indicative of booths which a user corresponding to the user record has visited in an exhibition; determining similarity level between records in a history database and the user record, the records in the history database including data indicative of the booths visited by previous visitors in the exhibition; selecting several of the records according to the determined similarity level; determining the booths in the all of the selected records not yet visited by the user; adding the determined booths to a candidate list; and presenting at least one of the booths in the candidate list to the user.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: September 14, 2021
    Assignees: International Business Machines Corporation, Industry Technology Research Institute (ITRI)
    Inventors: Hung-Yang Chang, Li-Ju Chen, Chia-Wen Ho, Kuo-shu Luo, Yi-Chang Molly Wang
  • Patent number: 11118926
    Abstract: Disclosed is a computer-implemented method for recommending booths-to-visit to a user, comprising the following steps: accessing a user record, wherein the user record includes data indicative of booths which a user corresponding to the user record has visited in an exhibition; determining similarity level between records in a history database and the user record, the records in the history database including data indicative of the booths visited by previous visitors in the exhibition; selecting several of the records according to the determined similarity level; identifying shared ones of the selected records; determining the booths in the shared ones of the selected records not yet visited by the user; adding the determined booths to a candidate list; and presenting at least one of the booths in the candidate list to the user.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: September 14, 2021
    Assignees: International Business Machines Corporation, Industry Technology Research Institute (ITRI)
    Inventors: Hung-Yang Chang, Li-Ju Chen, Chia-Wen Ho, Kuo-shu Luo, Yi-Chang Molly Wang
  • Patent number: 11074085
    Abstract: Methods and apparatus for boot time reduction in a processor and programmable logic device environment are disclosed. An example apparatus includes a multicore processor including a first core and a second core. A bootstrap processor is to initialize the first core into a standby mode and initialize the second core into a non-standby mode. A programmable logic device is to be programmed with instructions to be executed by the programmable logic device by the second core via a first connection initialized by the second core. The bootstrap processor is to, upon completion of the programming of the programmable logic device, initialize a data connection between the programmable logic device and the second core.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: July 27, 2021
    Assignee: Intel Corporation
    Inventors: Yah Wen Ho, Vincent Zimmer, Tung Lun Loo
  • Publication number: 20210206687
    Abstract: Disclosed herein is a glass composition that includes, based on the total weight of the composition, 52 wt % to 58 wt % of SiO2, 12 wt % to 16 wt. of Al2O3, 16 wt % to 26 wt % of B2O3, greater than 0 wt % and not greater than 2 wt % of MgO, 1 wt % to 6 wt % of CaO, greater than 1 wt % and lower than 5 wt % of TiO2, greater than 0 wt % and not greater than 0.6 wt % of Na2O, 0 wt % to 0.5 wt % of K2O, 0 wt % to 1 wt % of F2, 1 wt % to 5 wt % of ZnO, greater than 0 wt % and not greater than 1 wt % of Fe2O3; and 0.1 wt % to 0.6 wt % of SO3. Also disclosed herein is a glass fiber including the glass composition.
    Type: Application
    Filed: November 20, 2020
    Publication date: July 8, 2021
    Inventors: Wen-Ho HSU, Bih-Cherng CHERN, Chih-Yuan CHANG, Yueh-Heng LEE, Wei-Chih LO
  • Publication number: 20210072130
    Abstract: A rubber detection system for rubber raw material includes a controller, a rubber sampling module, a rubber calender, a temperature control module, a mooney sensor, a power meter, an expansion ratio detection module, a rotation counter, and a specific gravity detection module. The rubber sampling module obtains a rubber to be tested consistent with a weight value. After the temperature control module determines that the rubber to be tested has reached a temperature value, the rubber calender outputs the rubber to be tested having a thickness value. The power meter records and obtains a power consumption value form the rubber calender. The expansion ratio detection module obtains an expansion ratio based on the thickness value and a roller spacing. The rotation counter obtains the number of rotations of the rubber calender. The specific gravity detection module obtains an actual specific gravity value of the rubber to be tested.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 11, 2021
    Inventor: Wen-Ho Chen
  • Publication number: 20210072132
    Abstract: A power consumption detection system includes a controller, a rubber sampling module, a rubber calender, a temperature control module, a mooney sensor, and a power meter. The rubber sampling module samples a rubber material according to a weight value and obtains a rubber to be tested. The rubber calender continuously calenders the rubber to be tested at least six times. The temperature control module maintains the rubber to be tested with a temperature value. The mooney sensor obtains an actual viscosity index and the controller controls the calendaring number of the rubber calender until the target viscosity index is consistent with the actual viscosity index. The power meter records a power consumed by the rubber calender and obtains a power consumption value.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 11, 2021
    Inventor: Wen-Ho CHEN
  • Publication number: 20210072218
    Abstract: An expansion ratio detection system for rubber, including a controller, a rubber sampling module, a rubber calender, a temperature control module, and an expansion ratio detection module. The rubber sampling module obtains a rubber to be tested consistent with a weight value. After the temperature control module determines that the rubber to be tested has reached a first temperature value, the rubber calender outputs the rubber to be tested having a thickness value. The expansion ratio detection module obtains an expansion ratio according to twice the thickness value and a roller pitch.
    Type: Application
    Filed: September 10, 2019
    Publication date: March 11, 2021
    Inventor: Wen-Ho CHEN
  • Publication number: 20210026652
    Abstract: Methods and apparatus for boot time reduction in a processor and programmable logic device environment are disclosed. An example apparatus includes a multicore processor including a first core and a second core. A bootstrap processor is to initialize the first core into a standby mode and initialize the second core into a non-standby mode. A programmable logic device is to be programmed with instructions to be executed by the programmable logic device by the second core via a first connection initialized by the second core. The bootstrap processor is to, upon completion of the programming of the programmable logic device, initialize a data connection between the programmable logic device and the second core.
    Type: Application
    Filed: September 26, 2017
    Publication date: January 28, 2021
    Inventors: Yah Wen Ho, Vincent Zimmer, Tung Lun Loo
  • Publication number: 20200264895
    Abstract: Various embodiments are generally directed to techniques for computing platform initialization, such as by utilizing a field programmable gate array (FPGA) to initialize one or more dependent bootable components (DPCs) of the computing platform, for instance. In one or more embodiments, the FPGA may be reconfigured to perform a runtime operation after initialization of the computing platform. In embodiments described herein, a DPC may include initialization of any hardware or software components of a computing platform, such as silicon components and platform components. In such embodiments, a boot sequence may include boot instructions to initialize a set of DPCs. In some such embodiments, the boot sequence may initialize the computing platform. In one or more embodiments, computing platform initialization may include preparing the computing platform to perform input/output (I/O) operations. In one or more such embodiments, the I/O operations may be performed via an operating system.
    Type: Application
    Filed: November 17, 2017
    Publication date: August 20, 2020
    Applicant: INTEL CORPORATION
    Inventors: Xiang MA, Tung Lun LOO, Yah Wen HO
  • Patent number: 10664600
    Abstract: Apparatus, systems, or methods for a programmable circuit to facilitate a processor to boot a computing device having the processor. A programmable circuit may include non-volatile storage and firmware stored in the non-volatile storage. The firmware may configure the programmable circuit as a memory controller of a memory device coupled to the programmable circuit, to facilitate the processor to boot the computing device having the processor, the programmable circuit, and the memory device, into operation. Other embodiments may also be described and claimed.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: May 26, 2020
    Assignee: Intel Corporation
    Inventors: Yah Wen Ho, Tung Lun Loo, Yan Fei Lee
  • Publication number: 20200152639
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a base and a plurality of protrusions extending from the base and spaced apart from each other; a first oxide layer substantially disposed between two adjacent protrusions and exposing an upper portion of the protrusion between portions of the first oxide layer; a bit line contact covering the upper portion of the protrusion; a bit line disposed over the bit line contact; a first nitride layer disposed on lateral surfaces of the bit line contact and the bit line and on an upper surface and a sidewall of the first oxide layer exposed to the bit line contact; and a second nitride layer at least formed over the first nitride layer disposed on the lateral surfaces with an interval and connected to the first nitride layer disposed on the sidewall, thereby forming an air gap between the first and second nitride layers.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 14, 2020
    Inventors: Jui-Wen HO, Hsu CHIANG, Szu-Han CHEN
  • Patent number: 10598857
    Abstract: A pin hole or aperture is located or formed adjacent to the end surface of one or more of the input ports or fibers, or adjacent to one or more of the output ports or fibers, of a fiberoptic component. The aperture allows light to enter (or exit) the core of the associated fiber, and the non-transparent layer that surrounds the aperture blocks light from entering or exiting the cladding layer of the associated fiber. This blocking of the evanescent field in the cladding layer serves to reduce the polarization, wavelength, and temperature dependencies of the light coupling to the output port(s) or fiber(s) of the optical component. It can also reduce the passband width of the selected wavelength in tunable optical filter applications. The non-transparent layer surrounding the aperture can be made reflective, and light that is reflected by the non-transparent layer can be used for optical power monitoring.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: March 24, 2020
    Assignee: DICON FIBEROPTICS, INC.
    Inventors: Ho-Shang Lee, Min Chieh Lu, Yu-Sheng Yang, Chen-Wen Ho
  • Patent number: 10568199
    Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: February 18, 2020
    Assignee: SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
    Inventors: Nai-Shung Chang, Tsai-Sheng Chen, Chang-Li Tan, Yun-Han Chen, Hsiu-Wen Ho
  • Patent number: 10568198
    Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: February 18, 2020
    Assignee: SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
    Inventors: Nai-Shung Chang, Tsai-Sheng Chen, Chang-Li Tan, Yun-Han Chen, Hsiu-Wen Ho
  • Patent number: 10568200
    Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: February 18, 2020
    Assignee: SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
    Inventors: Nai-Shung Chang, Tsai-Sheng Chen, Chang-Li Tan, Yun-Han Chen, Hsiu-Wen Ho
  • Publication number: 20190310098
    Abstract: Disclosed is a computer-implemented method for recommending booths-to-visit to a user, comprising the following steps: accessing a user record, wherein the user record includes data indicative of booths which a user corresponding to the user record has visited in an exhibition; determining similarity level between records in a history database and the user record, the records in the history database including data indicative of the booths visited by previous visitors in the exhibition; selecting several of the records according to the determined similarity level; determining the booths in the all of the selected records not yet visited by the user; adding the determined booths to a candidate list; and presenting at least one of the booths in the candidate list to the user.
    Type: Application
    Filed: June 17, 2019
    Publication date: October 10, 2019
    Inventors: Hung-Yang Chang, Li-Ju Chen, Chia-Wen Ho, Kuo-shu Luo, Yi-Chang Molly Wang
  • Publication number: 20190301884
    Abstract: Disclosed is a computer-implemented method for recommending booths-to-visit to a user, comprising the following steps: accessing a user record, wherein the user record includes data indicative of booths which a user corresponding to the user record has visited in an exhibition; determining similarity level between records in a history database and the user record, the records in the history database including data indicative of the booths visited by previous visitors in the exhibition; selecting several of the records according to the determined similarity level; identifying shared ones of the selected records; determining the booths in the shared ones of the selected records not yet visited by the user; adding the determined booths to a candidate list; and presenting at least one of the booths in the candidate list to the user.
    Type: Application
    Filed: June 17, 2019
    Publication date: October 3, 2019
    Inventors: Hung-Yang Chang, Li-Ju Chen, Chia-Wen Ho, Kuo-shu Luo, Yi-Chang Molly Wang
  • Patent number: 10393535
    Abstract: Disclosed is a computer-implemented method for recommending booths-to-visit to a user, comprising the following steps: accessing a user record, wherein the user record includes data indicative of booths which a user corresponding to the user record has visited in an exhibition; determining similarity level between records in a history database and the user record, the records in the history database including data indicative of the booths visited by previous visitors in the exhibition; selecting one of the records according to the determined similarity level; determining the booths in the selected record not yet visited by the user; obtaining the user's current location in the exhibition; determining a target booth, from the booths not yet visited by the user, by referring to the current location and a map database; and sending to the user a message indicative of the target booth.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: August 27, 2019
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, INDUSTRY TECHNOLOGY RESEARCH INSTITUTE (ITRI)
    Inventors: Hung-Yang Chang, Li-Ju Chen, Chia-Wen Ho, Kuo-shu Luo, Yi-Chang Molly Wang