Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: A system-in-package chip of printer driver system applicable in a printer includes a first chip, a second chip, and a third chip. The first chip, the second chip, and the third chip are arranged in a common package. The first chip and the second chip are arranged side-by-side on a carrier in the common package. The third chip is arranged on a top portion of the first chip in the common package. A wire carrier structure is formed on the top portion of the first chip before the third chip is disposed on the first chip.

Abstract: A helmet includes a helmet body and a gas detection and purification device. The gas detection and purification device in includes a body, a purification module, a gas-guiding unit, a gas detection module, and a power module. The gas detection module calculates the gas detection data obtained by the gas detection module so as to control the gas-guiding unit to start or stop operation based on the gas detection data. When the gas-guiding unit is in operation, the gas-guiding unit guides the gas into the body and to pass through the purification module for being filtered and purified to become a purified gas, and the gas-guiding unit discharges the purified gas out of the body to the nose portion, or the mouth portion, or both the nose portion and the mouth portion of the wearer for providing the wearer with the purified gas to breath.

Abstract: A centrifugal heat dissipation fan including a hub, a frame, and double-layer fan blade sets is provided. The double-layer fan blade sets surround the hub and are arranged along a radial direction at an inner layer and an outer layer. A gap is maintained along the radial direction between the fan blade set located at the inner layer and the fan blade set located at the outer layer. The frame is connected to the hub and the fan blade set located at the outer layer.

Abstract: The present invention relates to a semiconductor chemical mechanical polishing sludge recycling method, which comprises the following steps: (1) drying out the CMP sludge into a condition of solid; (2) putting the solid sludge obtained in step (1) into a high-temperature furnace for roasting; (3) putting the solid sludge obtained in step (2) into a reaction tank and adding a impregnating liquid for soaking, (4) performing a solid-liquid separation in step (3) to obtain a solid and a liquid, (5) performing a concentration reaction on the liquid separated in step (4) to obtain a copper sulfate aqueous solution by-product; (6) taking out the solid sludge obtained in step (4) and adding water for washing; (7) dehydrating a product obtained in step (6); (8) obtaining the solid dehydrated is the goods, and a sum of silicon dioxide and aluminum oxide on a dry basis is greater than 94%.

Abstract: The present invention relates to a semiconductor chemical mechanical polishing sludge recycling device, which includes a roasting device, a soaking and stirring device, a first centrifugal dehydration device, a cleaning device and a second centrifugal dehydration device arranged thereon. The roasting device heat-treats the semiconductor chemical mechanical polishing sludge to remove the impurities. The soaking and stirring device is connected with the roasting device. The roasted semiconductor chemical mechanical polishing sludge is placed in the soaking and stirring device. The first centrifugal dehydration device is connected with the soaking and stirring device. A product obtained by the soaking and stirring device is solidified and concentrated through the first centrifugal dehydration device. The cleaning device is connected with the first centrifugal dehydration device. The second centrifugal dehydration device is connected with the cleaning device.

Abstract: A gate dielectric structure is formed over a channel structure. One or more work function (WF) metal layers of a metal gate are formed over the gate dielectric structure. The one or more WF metal layers are treated with a fluorine-containing material. One or more processes are performed to cause fluorine from the fluorine-containing material to diffuse at least partially into the gate dielectric structure.

Abstract: A method against coronavirus infection includes administering to a subject in need thereof a pharmaceutical composition containing a water-extracted product of Melastoma malabathricum root.

Abstract: In some implementations, one or more semiconductor processing tools may form a via within a substrate of a semiconductor device. The one or more semiconductor processing tools may deposit a ruthenium-based liner within the via. The one or more semiconductor processing tools may deposit, after depositing the ruthenium-based liner, a copper plug within the via.

Abstract: A wireless earpiece having no venting port extending from the interior of the earpiece housing to external to the housing on the side of the housing towards the earpiece wearer's ear. The earpiece has a housing defining a front cavity and a back cavity, the front cavity proximate a wearer's ear when the earpiece is positioned in the wearer's ear during use and the back cavity away from the wearer's ear when the earpiece is positioned in the wearer's ear. The earpiece has an audio output nozzle extending from the front cavity configured to extend at least partially within the wearer's ear. In some designs, the earpiece has no vent extending through the housing toward the wearer's ear when the earpiece is positioned in the wearer's ear, but may have a vent extending through the housing away from the wearer's ear when the earpiece is positioned in the wearer's ear.

Abstract: A package structure of chip and integrated heat spreader including a substrate, a chip disposed on the substrate, a thermal interface material disposed on the chip, and an integrated heat spreader disposed on the substrate is provided. The integrated heat spreader is a lid covering the chip and the thermal interface material, and the thermal interface material is abutted between the chip and the integrated heat spreader. The integrated heat spreader is composed of a graphite plate and at least one copper layer, wherein an exterior surface of the graphite plate is totally covered by the copper layer.

Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: A method of power control for wireless communication, a communication device, and a network element are provided. The method includes: determining an uplink transmission power for a cell in a first transmission occasion according to a parameter set, wherein the parameter set comprises a first nominal power, a downlink pathloss estimate, and a first power control adjustment.

Abstract: A method of communication operation and a user equipment using the same method are provided. The method includes: receiving a message including at least one configuration, wherein the at least one configuration is associated with at least one of a cell discontinuous transmission or a cell discontinuous reception; receiving a downlink control information for applying the at least one configuration for a serving cell; and performing a communication operation according to the downlink control information.

Abstract: A mobile gas detection and cleaning device including a main body, a purification module, a gas guider, a gas detection module a controlling module, a driving movement module and a position determining unit is disclosed. The gas detection module allows a user to carry for detecting gas in the environment around the user to obtain a gas detection datum, and a target position is wirelessly transmitted. The controller module receives the gas detection datum sent from the gas detection module and controls the gas guider according to the gas detection datum. The controller module receives the target position wirelessly sent from the gas detection module for estimating a target track from a remaining distance relative to the target position and the main body. The driving movement module is controlled to move the main body along the target track to reach an area nearby the user for purifying the gas.

Abstract: A filtration and purification device includes a main body and one or more filtration passage layer. A plurality of purification chambers is disposed in the filtration passage layer. Each of the purification chambers has a flow-guiding unit, a filtration unit, a gas sensor, and an outlet valve. The flow-guiding unit introduces the gas into the purification chamber, the filtration unit filters the gas, and the gas sensor determines that if the filtered gas reaches a threshold for breathing so as to determine to open the outlet valve to discharge the gas out of the filtration and purification device.

Abstract: An electronic package structure includes first and second package modules combined with each other. The first package module includes a substrate and a first electronic component disposed thereon, at least one second electronic component, and an insulation film. The first electronic component and the second electronic component are adjacent to each other. The insulation film includes a base material and a foam glue body, and the foam glue body is viscous and compressible. The second package module includes a heat dissipation plate and a liquid metal and an insulation protrusion portion disposed thereon. The liquid metal is pressed by the heat dissipation plate and the first electronic component. The insulation protrusion portion covers and abuts against the insulation film to press the foam glue body through the base material so as to deform the foam glue body and enable the foam glue body to cover the second electronic component.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: A heat dissipation system of portable electronic device includes a body, at least one fan and at least one spacing member. At least one heat source of the portable electronic device is arranged in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet located in the axial direction and at least one flow outlet located in the radial direction. The spacing member is disposed on at least one of the body or the fan to form a stratified air flow in the body along the axial direction. The stratified air flows into the fan through the flow inlet and out of the fan through the flow outlet respectively.

Abstract: A vapor chamber structure for heat dissipation of a heat source is provided. The vapor chamber structure includes a housing having a heat absorption side and a heat dissipation side, a first capillary structure disposed in the housing, and a working fluid filled in the housing. The first capillary structure is formed into cavities isolated from each other, and each of the cavities is connected between the heat absorption side and the heat dissipation side. Heat generated by the heat source is absorbed by the heat absorption side, thereby transforming the working fluid from liquid state to vapor state. The working fluid in the vapor state is transmitted to the heat dissipation side via the cavities, and is transformed to the liquid state while the heat is dissipated. The working fluid in the liquid state returns to the heat absorption side via the first capillary structure.