Patents by Inventor Wen-Hsien Huang
Wen-Hsien Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955536Abstract: A semiconductor transistor structure includes a substrate with a first conductivity type, a fin structure grown on the substrate, and a gate on the fin structure. The fin structure includes a first epitaxial layer having a second conductivity type opposite to the first conductivity type, a second epitaxial layer on the first epitaxial layer, and a third epitaxial layer having the second conductivity type on the second epitaxial layer.Type: GrantFiled: July 15, 2021Date of Patent: April 9, 2024Assignee: United Semiconductor (Xiamen) Co., Ltd.Inventors: Sheng-Hsu Liu, Shih-Hsien Huang, Wen Yi Tan
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Publication number: 20240105846Abstract: A transistor structure and a formation method thereof are provided. The transistor structure includes a transistor device, formed on an active region of a semiconductor substrate, and including: a gate structure, disposed on the active region; gate spacers, formed along opposite sidewalls of the gate structure; source/drain structures, formed in recesses of the active region at opposite sides of the gate structure; and buried isolation structures, separately extending along bottom sides of the source/drain structures. Further, a channel portion of the active region between the source/drain structures is strained as a result of a strained etching stop layer lying above or dislocation stressors formed in the source/drain structures.Type: ApplicationFiled: September 22, 2023Publication date: March 28, 2024Applicant: Invention And Collaboration Laboratory Pte. Ltd.Inventors: Chao-Chun Lu, Li-Ping HUANG, Wen-Hsien Tu
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Publication number: 20240107746Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes an access transistor defined within an active region of a semiconductor substrate and a storage capacitor disposed on the access transistor. A recessed gate structure of the access transistor extends into the active region from above the active region. Source/drain contacts of the access transistor are disposed on the active region at opposite sides of the recessed gate structure. The storage capacitor includes: a composite bottom electrode, formed by alternately stacked first conductive layers and second conductive layers, wherein each second conductive layer is sandwiched between a pair of the first conductive layers, and tunnels laterally extend through the second conductive layers, respectively; a capacitor dielectric layer, covering inner and outer surfaces of the composite bottom electrode; and a top electrode, in contact with the composite bottom electrode through the capacitor dielectric layer.Type: ApplicationFiled: September 22, 2023Publication date: March 28, 2024Applicant: Invention And Collaboration Laboratory Pte. Ltd.Inventors: Chao-Chun Lu, Li-Ping HUANG, Wen-Hsien Tu
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Publication number: 20240088182Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
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Patent number: 11913733Abstract: The present disclosure provides a heat transferring device and a heat transferring component thereof. The heat transferring device includes a heat transferring component, a lower plate and a positioning component. The heat transferring component is in a shape of pouch and includes at least one input end and at least one output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on an exterior of the heat transferring component. An end of the positioning component is connected to the lower plate.Type: GrantFiled: June 10, 2021Date of Patent: February 27, 2024Assignee: ASIA PACIFIC FUEL CELL TECHNOLOGIES, LTD.Inventors: Wei-Pin Lo, Wen-Yen Huang, Chin-Hsien Cheng
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Publication number: 20240054256Abstract: A processor of a computer-aided design system reads and executes a software stored in a memory to input first digital data of a first component of the composite object, input second digital data of a second component of the composite object, analyze the first digital data and the second digital data with first criterion to obtain a plurality of first surfaces and a plurality of second surfaces respectively, calculate a distance between one of the plurality of the first surfaces and one of the plurality of the second surfaces, and output a first result when the distance is greater than or equal to the first threshold; otherwise, output a second result.Type: ApplicationFiled: July 7, 2023Publication date: February 15, 2024Applicant: InnoLux CorporationInventors: Yi-Hung Hsueh, Wen-Hsien Huang, Hung-Kuo Chu, Kai-Wen Hsiao
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Publication number: 20220367334Abstract: One or more implementations of the subject technology may enable a bond-on-pad (BoP) substrate technology that can eliminate the need to utilize a solder-on-pad (SoP) process. Unlike an SoP process, a BoP Process does not require a solder bump to be formed on a bump pad to attach a joint to a bump pad. The size of an opening on a bump pad for a BoP process may be larger than that of an SoP process. A BoP process may use a solder mask having multiple thicknesses and may be thinner near the bump pads. A BoP process may use a joint having a copper pillar and a solder cap. A BoP process can be used with an underfill or a molding compound technology.Type: ApplicationFiled: May 5, 2022Publication date: November 17, 2022Inventors: Wen-Hsien HUANG, Kwok Cheung TSANG
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Patent number: 10600915Abstract: A flexible substrate structure including a flexible substrate, a first dielectric layer, a metal-containing layer and a second dielectric layer is provided. The first dielectric layer is located on the flexible substrate. The metal-containing layer has a reflectivity greater than 15% and a heat transfer coefficient greater than 2 W/m-K. The metal-containing layer is disposed between the first dielectric layer and the second dielectric layer, and the second dielectric layer is an inorganic material layer. A flexible transistor including the above-mentioned flexible substrate structure and a method for fabricating the same are also provided.Type: GrantFiled: February 26, 2018Date of Patent: March 24, 2020Assignee: National Applied Research LaboratoriesInventors: Wen-Hsien Huang, Jia-Min Shieh, Chang-Hong Shen
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Patent number: 10436671Abstract: A shock-resistance testing apparatus includes a support base, a first rotating component and a controller provided on the support base. A second rotating component is coupled to one side of the first rotating component. A testing board is placed on the first rotating component. A falling board is placed on the testing board. The controller controls the first rotating component to drive the second rotating component rotating from one side of the testing board to another side of the testing board. The controller controls the second rotating component to lift the testing board. The controller controls the second rotating component to move away from the testing board so that the testing board falls.Type: GrantFiled: March 1, 2017Date of Patent: October 8, 2019Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Kang-Xian Yang, Ke-Rui Zeng, Kun-Jia Hsieh, I-Cheng Huang, Wen-Hsien Huang
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Publication number: 20180248044Abstract: A flexible substrate structure including a flexible substrate, a first dielectric layer, a metal-containing layer and a second dielectric layer is provided. The first dielectric layer is located on the flexible substrate. The metal-containing layer has a reflectivity greater than 15% and a heat transfer coefficient greater than 2 W/m-K. The metal-containing layer is disposed between the first dielectric layer and the second dielectric layer, and the second dielectric layer is an inorganic material layer. A flexible transistor including the above-mentioned flexible substrate structure and a method for fabricating the same are also provided.Type: ApplicationFiled: February 26, 2018Publication date: August 30, 2018Inventors: WEN-HSIEN HUANG, JIA-MIN SHIEH, CHANG-HONG SHEN
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Patent number: 9905547Abstract: A chipset with light energy harvester, includes a substrate, a functional element layer, and a light energy harvesting layer, both are stacked vertically on the substrate, and an interconnects connected between the functional element layer and the light energy harvesting layer.Type: GrantFiled: October 14, 2015Date of Patent: February 27, 2018Assignee: NATIONAL APPLIED RESEARCH LABORATORIESInventors: Chang-Hong Shen, Jia-Min Shieh, Wen-Hsien Huang, Tsung-Ta Wu, Chih-Chao Yang, Tung-Ying Hsieh
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Publication number: 20170343604Abstract: A test device for testing an electronic device has a base, a first mounting plane, a first support element, a plurality of second support elements, a plurality of test elements, and a control unit. The first mounting plane is mounted on the base. The first support element is slidable on the first mounting plane, the second support elements are slidable on the first support element, and the test elements are slidable on the second support elements. The control unit electrically coupled to the test elements controls the test elements to provide impact force on the electronic device.Type: ApplicationFiled: April 1, 2017Publication date: November 30, 2017Inventors: KANG-XIAN YANG, WEN-HSIEN HUANG, I-CHENG HUANG, KUN-JIA HSIEH
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Publication number: 20170299461Abstract: A shock-resistance testing apparatus includes a support base, a first rotating component and a controller provided on the support base. A second rotating component is coupled to one side of the first rotating component. A testing board is placed on the first rotating component. A falling board is placed on the testing board. The controller controls the first rotating component to drive the second rotating component rotating from one side of the testing board to another side of the testing board. The controller controls the second rotating component to lift the testing board. The controller controls the second rotating component to move away from the testing board so that the testing board falls.Type: ApplicationFiled: March 1, 2017Publication date: October 19, 2017Inventors: KANG-XIAN YANG, KE-RUI ZENG, KUN-JIA HSIEH, I-CHENG HUANG, WEN-HSIEN HUANG
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Publication number: 20170110444Abstract: A chipset with light energy harvester, includes a substrate, a functional element layer, and a light energy harvesting layer, both are stacked vertically on the substrate, and an interconnects connected between the functional element layer and the light energy harvesting layer.Type: ApplicationFiled: October 14, 2015Publication date: April 20, 2017Inventors: CHANG-HONG SHEN, JIA-MIN SHIEH, WEN-HSIEN HUANG, TSUNG-TA WU, CHIH-CHAO YANG, TUNG-YING HSIEH
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Patent number: 9455350Abstract: A transistor device structure includes a substrate, a first polycrystalline semiconductor thin film and a first transistor unit. The first polycrystalline semiconductor thin film is disposed on the substrate. A grain diameter of the first polycrystalline semiconductor thin film is greater than 1 micrometer and a thickness of the first polycrystalline semiconductor thin film is less than three hundredths of the grain diameter. The first transistor unit is disposed on the first polycrystalline semiconductor thin film and includes a first gate dielectric layer and a first gate structure. The first gate dielectric layer is disposed on a surface of the first polycrystalline thin film semiconductor. The first gate structure is disposed on a surface of the first gate dielectric layer.Type: GrantFiled: March 25, 2014Date of Patent: September 27, 2016Assignee: NATIONAL APPLIED RESEARCH LABORATORIESInventors: Jia-Min Shieh, Wen-Hsien Huang, Chang-Hong Shen, Chih-Chao Yang, Tung-Ying Hsieh
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Patent number: 9281305Abstract: A transistor device structure includes a substrate, a first transistor layer and a second transistor layer. The second transistor layer is disposed between the substrate and the first transistor layer. The first transistor layer includes an insulating structure and a first transistor unit. The insulating structure is disposed on the second transistor layer and has a protruding portion. The first transistor unit includes a gate structure, a source/drain structure, an embedded source/drain structure and a channel. The source/drain structure is disposed beside the gate structure and over the insulating structure. The embedded source/drain structure is disposed underneath the source/drain structure and in the insulating structure. The channel is defined between the protruding portion and the gate structure.Type: GrantFiled: December 5, 2014Date of Patent: March 8, 2016Assignee: NATIONAL APPLIED RESEARCH LABORATORIESInventors: Chih-Chao Yang, Jia-Min Shieh, Wen-Hsien Huang, Tung-Ying Hsieh, Chang-Hong Shen, Szu-Hung Chen
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Publication number: 20150280010Abstract: A transistor device structure includes a substrate, a first polycrystalline semiconductor thin film and a first transistor unit. The first polycrystalline semiconductor thin film is disposed on the substrate. A grain diameter of the first polycrystalline semiconductor thin film is greater than 1 micrometer and a thickness of the first polycrystalline semiconductor thin film is less than three hundredths of the grain diameter. The first transistor unit is disposed on the first polycrystalline semiconductor thin film and includes a first gate dielectric layer and a first gate structure. The first gate dielectric layer is disposed on a surface of the first polycrystalline thin film semiconductor. The first gate structure is disposed on a surface of the first gate dielectric layer.Type: ApplicationFiled: March 25, 2014Publication date: October 1, 2015Applicant: National Applied Research LaboratoriesInventors: Jia-Min SHIEH, Wen-Hsien HUANG, Chang-Hong SHEN, Chih-Chao YANG, Tung-Ying HSIEH
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Patent number: 9040333Abstract: The invention discloses a method for fabricating power-generating module with solar cell. The method includes the steps of providing a flexible substrate; forming a solar cell unit on the flexible substrate by using a high density plasma at a temperature lower than about 150° C.; and forming a circuit unit on the flexible substrate; wherein the solar cell unit is coupled to the circuit unit, so as to provide the power needed for the operation of the circuit unit.Type: GrantFiled: November 8, 2013Date of Patent: May 26, 2015Assignee: National Applied Research LaboratoriesInventors: Jia-Min Shieh, Chang-Hong Shen, Wen-Hsien Huang, Bau-Tong Dai, Jung Y. Huang, Hao-Chung Kuo
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Publication number: 20140264271Abstract: A ferroelectric memory device includes a memory layer, made of a silicon-based ferroelectric memory material. The silicon-based ferroelectric memory material includes a mesoporous silica film with nanopores and atomic polar structures on inner walls of the nanopores. The atomic polar structures are formed by asymmetrically bonding metal ions to silicon-oxygen atoms on the inner walls, and the silicon-based ferroelectric memory material includes semiconductor quantum dots, metal quantum dots and metal-semiconductor alloy quantum dots.Type: ApplicationFiled: March 18, 2013Publication date: September 18, 2014Applicant: NATIONAL APPLIED RESEARCH LABORATORIESInventors: Jia-Min Shieh, Wen-Hsien Huang, Yu-Chung Lien, Chang-Hong Shen, Fu-Ming Pan, Hao-Chung Kuo
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Publication number: 20140131716Abstract: A memory device comprises a substrate, a tunnel oxide layer, a charge trapping layer, a block oxide layer, a plurality of conductive quantum dots, a metal gate and a source/drain structure. The tunnel oxide layer is disposed on the substrate and has a thickness substantially less than or equal to 2 nm. The charge trapping layer is disposed on the tunnel oxide layer. The quantum dots are embedded in the charge trapping layer. The block oxide layer is disposed on the charge trapping layer. The metal gate essentially consisting of aluminum (Al), copper (Cu), tantalum nitride (TiN), titanium nitride (TaN), aluminum-silicon-copper (Al—Si—Cu) alloys or the arbitrary combinations thereof is disposed on the block oxide layer. The source/drain structure is disposed in the substrate.Type: ApplicationFiled: January 18, 2013Publication date: May 15, 2014Applicant: NATIONAL APPLIED RESEARCH LABORATORIESInventors: Jia-Min Shieh, Yu-Chung Lien, Wen-Hsien Huang, Chang-Hong Shen, Min-Cheng Chen, Ci-Ling Pan