Abstract: A backlight module including a back cover, a reflector, a lamp supporter, and a number of lamps is provided. The back cover includes a number of holes, an inner face, and an outer face. The reflector is disposed on the inner face and has a number of openings. The openings expose parts of the holes. The lamp supporter has a base substrate and a number of carriers that are connected to the base substrate. The base substrate is assembled to the outer face of the back cover, and the carriers penetrate the holes of the back cover and the openings of the reflector. The lamps are disposed in the carriers, such that the lamps and the base substrate are located at two opposite sides of the back cover.

Abstract: A method for keying human voice audio frequency includes the steps of setting the human factor of the singer; recording the singing of the singer; calculating the audio frequency by an audio frequency counter; recording the maximum ground frequency by the recorder; estimating a maximum fundamental audio frequency thereof by the diapason estimator; and converting the maximum fundamental audio frequency into musical terminology, the best audio frequency of the singer being determined. The method for keying human voice audio frequency is very easy and fast.

Abstract: A method for keying human voice audio frequency includes the steps of setting the human factor of the singer; recording the singing of the singer; calculating the audio frequency by an audio frequency counter; recording the maximum ground frequency by the recorder; estimating a maximum fundamental audio frequency thereof by the diapason estimator; and converting the maximum fundamental audio frequency into musical terminology, the best audio frequency of the singer being determined. The method for keying human voice audio frequency is very easy and fast.

Abstract: A composition of a water-repellent agent has a solvent and a solute. The solvent is water. The solute is dissolved in water and has isocyanate-acryl, non-ionic fluoro-acryl, 4,4-dipheylmethane diisocyanate, zinc acetate and polyethylene wax. Isocyanate-acryl has a concentration in a range of 10˜40 gram in per liter of the water-repellent agent (i.e. 10˜40%). Non-ionic fluoroacryl has a concentration in a range of 80˜150% t. 4,4-dipheylmethane diisocyanate has a concentration in a range of 5˜12%. Zinc acetate has a concentration in a range of 1˜20%. Polyethylene wax emulsion has a concentration in a range of 1˜40%. Therefore, a fabric treated with the present invention has good waterproof ability, widely enhanced color fastness in light and improved tear-resistance strength at the same time.

Abstract: A lighting module comprises a bezel, a lamp and a fixing component. The lamp includes two straight portions and one bending portion therebetween. The two straight portions substantially being parallel to each other. A fixing component includes a main body fixed with the bezel and two C-ring structures individually having two ends connecting with the main body. The two straight portions are individually encircled by one of said two C-ring structures and in touch with the main body.

Abstract: A backlight module and wire mount assembly used therein. The assembly includes a base and a wire mount. The base includes a surface and a protrusion formed on the surface. A through hole is formed between the protrusion and the surface. The wire mount is disposed on the surface of the base in a manner such that it passes through the through hole. The wire mount serves to fix the wire.

Abstract: A supporting mechanism of a backlight module includes a first member, a second member, and a connector connecting the first and second members. The first member has an initial thickness and the second member also has an initial thickness. The initial thickness of the first member is greater than that of the second member and the first member is longer than the second member.

Abstract: A display and a backlight module thereof are provided. The backlight module comprises a substrate, a supporting element, and at least one U-shaped lamp installed over the substrate. The substrate has a bottom surface. The U-shaped lamp comprises two ends and a curved portion for forming a reference surface. The reference surface and the bottom surface form an included angle.

Abstract: A backlight module includes a substrate and at least a lamp. The substrate includes a high-voltage side, a low-voltage side and a bottom surface linking therebetween. The lamp includes two electrode ends respectively connecting to the high-voltage side and the low-voltage side. The lamp and the bottom surface form an acute angle to reduce leakage current percentage. A display includes the backlight module.

Abstract: A lighting module comprises a bezel, a lamp and a fixing component. The lamp includes two straight portions and one bending portion therebetween. The two straight portions substantially being parallel to each other. A fixing component includes a main body fixed with the bezel and two C-ring structures individually having two ends connecting with the main body. The two straight portions are individually encircled by one of said two C-ring structures and in touch with the main body.

Abstract: A liquid crystal display and backlight module thereof. The backlight module includes a light source and a light source holder, supporting and abutting the light source. The light source holder comprises an airflow passageway and a plurality of vent holes. Each vent hole communicates with the airflow passageway such that heat produced by the light source is dissipated through the vent holes and the airflow passageway to the exterior of the backlight module.

Abstract: A backlight module and wire mount assembly used therein. The assembly includes a base and a wire mount. The base includes a surface and a protrusion formed on the surface. A through hole is formed between the protrusion and the surface. The wire mount is disposed on the surface of the base in a manner such that it passes through the through hole. The wire mount serves to fix the wire.

Abstract: The present invention discloses an image sensing semiconductor package and manufacture method thereof utilizing the plastic leaded chip carrier (PLCC) manufacture process to produce image sensing chips with a cheaper plastic carrier, and it also seals dry high-pressure gas inside the image sensing chip in the manufacture process. Therefore, when the image sensing chip is used in a device, it can prevent moisture in the air from entering into the interior of the image sensing component due to pressure difference that will shorten the lifespan of the image sensing chip. The invention also provides a component rinsing procedure for the image sensing semiconductor package manufacture process, so that no environmental factor of the manufacture process such as humidity and dust particles will affect the sensitivity of the chip or the normal display of the screen, and hence lower the defective rate of the product.

Abstract: The present invention discloses an image sensing semiconductor package and manufacture method thereof utilizing the plastic leaded chip carrier (PLCC) manufacture process to produce image sensing chips with a cheaper plastic carrier, and it also seals dry high-pressure gas inside the image sensing chip in the manufacture process. Therefore, when the image sensing chip is used in a device, it can prevent moisture in the air from entering into the interior of the image sensing component due to pressure difference that will shorten the lifespan of the image sensing chip. The invention also provides a component rinsing procedure for the image sensing semiconductor package manufacture process, so that no environmental factor of the manufacture process such as humidity and dust particles will affect the sensitivity of the chip or the normal display of the screen, and hence lower the defective rate of the product.