Abstract: A light emitting device includes a micro-reflection structure carrier, which is formed by performing etching process on a carrier, a reflection layer, a light emitting layer, and a transparent adhesive layer, wherein the reflection layer is formed over the micro-reflection structure carrier and adheres to the light emitting layer through the transparent adhesive layer.

Abstract: A method for forming a light emitting diode includes forming a first stack, forming a second reaction layer over the first stack, forming a second stack, forming a first reaction layer over the second stack, and holding together the first reaction layer and the second reaction layer by means of a transparent adhesive layer. The transparent adhesive layer is formed between the first and second reaction layer, therefore the second reaction layer of the first stack will not come off the first reaction layer of the second stack.

Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.