Patents by Inventor Wen-hung Hsu

Wen-hung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10924649
    Abstract: A photographing module includes a metal cover, a base, a lens portion and a leaf spring. The lens portion is displaceably disposed in an inner space. The leaf spring is assembled with the lens portion and includes an inner fixing portion, an outer fixing portion and an elastic portion. The inner fixing portion is assembled with the lens portion. The outer fixing portion contacts and is fixedly disposed with the metal cover. The elastic portion connects the inner fixing portion and the outer fixing portion. The leaf spring further includes a plurality of contact portions and a plurality of auxiliary elastic portions. Each of the auxiliary elastic portions connects the outer fixing portion and one of the contact portions. For the leaf spring, only the contact portions thereof contact side plates of the metal cover.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: February 16, 2021
    Assignee: LARGAN DIGITAL CO., LTD.
    Inventors: Te-Sheng Tseng, Wen-Hung Hsu, Ming-Ta Chou
  • Patent number: 10877370
    Abstract: A method for mitigating extreme ultraviolet (EUV) mask defects is disclosed. The method includes the steps of providing a wafer blank, identifying a first plurality of defects on the wafer blank, providing an EUV mask design on top of the wafer blank, identifying non-critical blocks with corresponding stretchable zones on the EUV mask design, overlapping the EUV blank with the EUV mask design, identifying a second plurality of defects, the second plurality of defects are solved, identifying a third plurality of defects, the third plurality of defects are not solved, adjusting the relative locations of the EUV mask design and the EUV blank to solve at least one of the third plurality of defects, and adjusting the locations of at least one of the non-critical blocks within corresponding stretchable zones to solve at least one of the third plurality of defects.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsing-Lin Yang, Chin-Chang Hsu, Yen-Hung Lin, Chung-Hsing Wang, Wen-Ju Yang
  • Publication number: 20200400917
    Abstract: A lens assembly driving module includes a holder, a metal yoke, a lens unit, a magnet set, a coil, at least one elastic element and at least one damper agent. The metal yoke is coupled with the holder and includes a through hole and at least one extending structure. The extending structure is disposed around the through hole and extends along a direction from the through hole to the holder. The lens unit is movably disposed in the metal yoke. The lens unit includes an optical axis and at least one notch structure. The notch structure is disposed in an outer peripheral area of the lens unit and is corresponding to the extending structure. The damper agent is disposed between the extending structure of the metal yoke and the notch structure of the lens unit. The damper agent is applied to damp a movement of the lens unit.
    Type: Application
    Filed: September 9, 2020
    Publication date: December 24, 2020
    Inventors: Chun-Yi LU, Te-Sheng TSENG, Wen-Hung HSU, Ming-Ta CHOU
  • Publication number: 20200388552
    Abstract: A semiconductor package carrier board, a method for fabricating the same, and an electronic package having the same are provided. The method includes forming on a circuit structure a graphene layer that acts as an insulation heat dissipating layer. Since the heat conductivity of the graphene layer is far greater than the heat conductivity of ink (about 0.4 W/m·k), which is used as solder resist, the heat of the semiconductor package carrier board can be conducted quickly, and thus can avoid the problem that the heat will be accumulated on the semiconductor package carrier board.
    Type: Application
    Filed: June 5, 2020
    Publication date: December 10, 2020
    Inventors: Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu, Wen-Chang Chen
  • Publication number: 20200386969
    Abstract: A lens driving apparatus is for driving a lens assembly and includes a base, a metal cover, a carrier, a first coil, at least one first magnet, at least one second magnet, a frame and a spring set. At least one lower leaf spring of the spring set includes a frame connecting section, a carrier connecting section and a resilient section. The carrier connecting section and the second magnet are arranged along the first direction. The carrier connecting section includes an opening portion and a shielding portion, and the opening portion and the shielding portion both corresponding to the second magnet along the first direction are respectively for a part of the second magnet to be exposed through the opening portion and another part of the second magnet to be shielded by the shielding portion.
    Type: Application
    Filed: August 25, 2020
    Publication date: December 10, 2020
    Inventors: Te-Sheng TSENG, Wen-Hung HSU, Yung-Chun KANG
  • Publication number: 20200373267
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 26, 2020
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Publication number: 20200360287
    Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 19, 2020
    Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
  • Publication number: 20200341350
    Abstract: A camera driving module includes: a base including a central opening; a casing disposed on the base and including an opening hole corresponding to the central opening; a lens unit movably disposed on the casing; and a focus driving part. The focus driving part includes a carrier, an AF coil element, at least two permanent magnets and a Hall element. The carrier is disposed on the lens unit and movable in a direction parallel to an optical axis. The AF coil element is fixed to the base and faces toward the carrier. The permanent magnets are fixed on one side of the carrier facing toward the base and disposed opposite to each other about the optical axis. The Hall element faces toward a corresponding surface of one of the permanent magnets. The AF coil element and the corresponding surfaces are arranged in the direction parallel to the optical axis.
    Type: Application
    Filed: November 18, 2019
    Publication date: October 29, 2020
    Applicant: LARGAN DIGITAL CO.,LTD.
    Inventors: Te-Sheng TSENG, Ming-Ta CHOU, Wen-Hung HSU
  • Patent number: 10805510
    Abstract: A camera driving module includes a base, a casing, a lens unit, a magnetic element, a coil, a spring and a damper agent. The base includes an opening. The casing is disposed on the base and includes a through hole and a broadwise notch structure. The broadwise notch structure is located nearby a periphery of the through hole. The lens unit is movably disposed on the casing and includes a protruding structure. The protruding structure is located at a periphery of the lens unit. The magnetic element is fixed to the casing and located at an inside the casing. The coil is fixed to the lens unit and located at an outside of the lens unit. The coil faces toward the magnetic element. The spring is disposed on the lens unit. The damper agent is disposed between the broadwise notch structure and the protruding structure.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: October 13, 2020
    Assignee: LARGAN DIGITAL CO., LTD.
    Inventors: Te-Sheng Tseng, Ming-Ta Chou, Wen-Hung Hsu
  • Patent number: 10802243
    Abstract: A lens assembly driving module includes a holder, a metal yoke, a lens unit, a magnet set, a coil, at least one elastic element and at least one damper agent. The metal yoke is coupled with the holder and includes a through hole and at least one extending structure. The extending structure is disposed around the through hole and extends along a direction from the through hole to the holder. The lens unit is movably disposed in the metal yoke. The lens unit includes an optical axis and at least one notch structure. The notch structure is disposed in an outer peripheral area of the lens unit and is corresponding to the extending structure. The damper agent is disposed between the extending structure of the metal yoke and the notch structure of the lens unit. The damper agent is applied to damp a movement of the lens unit.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: October 13, 2020
    Assignee: LARGAN DIGITAL CO., LTD.
    Inventors: Chun-Yi Lu, Te-Sheng Tseng, Wen-Hung Hsu, Ming-Ta Chou
  • Publication number: 20200312732
    Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.
    Type: Application
    Filed: June 17, 2020
    Publication date: October 1, 2020
    Inventors: Yen-Yao CHI, Nai-Wei LIU, Ta-Jen YU, Tzu-Hung LIN, Wen-Sung HSU, Shih-Chin LIN
  • Patent number: 10788646
    Abstract: A lens driving apparatus is for driving a lens assembly and includes a base, a metal cover, a carrier, a first coil, at least one first magnet, at least one second magnet, a frame and a spring set. At least one lower leaf spring of the spring set includes a frame connecting section, a carrier connecting section and a resilient section. The carrier connecting section and the second magnet are arranged along the first direction. The carrier connecting section includes an opening portion and a shielding portion, and the opening portion and the shielding portion both corresponding to the second magnet along the first direction are respectively for a part of the second magnet to be exposed through the opening portion and another part of the second magnet to be shielded by the shielding portion.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: September 29, 2020
    Assignee: LARGAN DIGITAL CO., LTD.
    Inventors: Te-Sheng Tseng, Wen-Hung Hsu, Yung-Chun Kang
  • Publication number: 20200303377
    Abstract: A method of making a semiconductor device includes: providing a substrate; forming an insulating layer on the substrate; forming a first trench in the insulating layer; forming a first semiconductor layer in the first trench; and removing a portion of the insulating layer to expose the first semiconductor layer.
    Type: Application
    Filed: June 4, 2020
    Publication date: September 24, 2020
    Inventors: Shih-Pang Chang, Guang-Li Luo, Szu-Hung Chen, Wen-Kuan Yeh, Jen-Inn Chyi, Meng-Yang Chen, Rong-Ren Lee, Shih-Chang Lee, Ta-Cheng Hsu
  • Publication number: 20200271945
    Abstract: A lens driving module includes a holder, a cover, a carrier, at least one first magnet, a first coil, at least two second magnets, at least one first sensor and at least one second sensor. The holder includes an opening hole. The cover is made of metal material and coupled to the holder. The carrier is movably disposed in the cover and for coupling to a lens. The first magnet is movably disposed in the cover. The first coil is wound around an outer side of the carrier. The second magnets are disposed on one end of the carrier. The first sensor is for detecting a magnetic field of the second magnets. The second sensor is for detecting a magnetic field of the first magnet.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 27, 2020
    Inventors: Chun-Yi LU, Te-Sheng TSENG, Wen-Hung HSU
  • Patent number: 10741513
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: August 11, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Patent number: 10727231
    Abstract: A heterogeneously integrated semiconductor device includes a substrate comprising a first material; a recess formed within the substrate and having a bottom portion with a first width, a top portion with a second width and a middle portion with a third width larger than the first width and the second width; and a first semiconductor layer filled in the bottom portion and including a second material different from the first material.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: July 28, 2020
    Assignees: National Applied Research Laboratories, EPISTAR Corporation
    Inventors: Shih-Pang Chang, Guang-Li Luo, Szu-Hung Chen, Wen-Kuan Yeh, Jen-Inn Chyi, Meng-Yang Chen, Rong-Ren Lee, Shih-Chang Lee, Ta-Cheng Hsu
  • Publication number: 20200206164
    Abstract: Methods for treating a wound or promote wound healing are provided, comprising the step of administering a composition including an effective amount of ?-1 adrenergic receptor antagonist to a subject in need thereof. Also provided is apparatus for wound healing, comprising a dressing and a composition including an effective amount of ?-1 adrenergic receptor antagonist.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 2, 2020
    Inventors: Chun-Wei LU, Jong-Hwei SU PANG, Yu-Shien KO, Wen-Hung CHUNG, Chao-Kai HSU
  • Publication number: 20200208295
    Abstract: A mono-crystalline silicon growth apparatus includes a furnace, a support base, a crucible, a heating module disposed outside of the crucible, and a heat adjusting module above the crucible. The heat adjusting module includes a diversion tube, a plurality of heat preservation sheets, and a hard shaft. The diversion tube includes a tube body and a carrying body connected to the tube body. The heat preservation sheets are sleeved around the tube body and are stacked and disposed on the carrying body. The hard shaft passes through the tube body and does not rotate. The hard shaft includes a water flow channel disposed therein and a clamping portion configured to clamp a seed crystal. Therefore, a fluid injected into the water flow channel takes away the heat near the clamping portion. A heat adjusting module and a hard shaft of the mono-crystalline silicon growth apparatus are provided.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 2, 2020
    Inventors: CHUN-HUNG CHEN, HSING-PANG WANG, Wen-Ching Hsu, I-CHING LI
  • Publication number: 20200209711
    Abstract: A lens assembly driving module includes a base, a cover, a lens carrier and a damping agent. The cover is coupled to the base. The lens carrier is integrally formed with a plastic barrel into a coaxial unitary element which has an internal space for receiving at least one optical lens element and includes at least two protrusion portions located on one end of the coaxial unitary element close to the base. The damping agent is filled between the base and each of the protrusion portions. The protrusion portions are a part of the coaxial unitary element, and a distance in a direction perpendicular to an optical axis between the part of the coaxial unitary element and the internal space is a maximum distance among distances in the direction perpendicular to the optical axis between other parts of the coaxial unitary element and the internal space.
    Type: Application
    Filed: October 25, 2019
    Publication date: July 2, 2020
    Inventors: Te-Sheng TSENG, Ming-Ta CHOU, Wen-Hung HSU
  • Publication number: 20200208296
    Abstract: A mono-crystalline silicon growth method includes: providing a furnace, a supporting base and a crucible which do not rotate relative to the furnace, and a heating module disposed at an outer periphery of the supporting base. After solidifying a liquid surface of a silicon melt in the crucible to form a crystal, the heating power of the heating module is successively reduced to appropriately adjust the temperature around the crucible to effectively control a temperature gradient of a thermal field around the crucible, so as to form a mono-crystalline silicon ingot by solidifying the silicon melt.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 2, 2020
    Inventors: CHUN-HUNG CHEN, HSING-PANG WANG, WEN-CHING HSU, I-CHING LI