Abstract: Provided is a coil carrier board, including a base coil layer, a conductive layer stacked on and bonded to the base coil layer, at least one build-up coil layer stacked on and bonded to the conductive layer, and an opening connecting the base coil layer, the conductive layer and the build-up coil layer. The coil carrier board has thick copper, fine line spacing and appropriate rigidity by means of the build-up circuit process and the structural design of the insulating layer of a photosensitive dielectric material bonded with a thermosetting dielectric material. Accordingly, the high current-carrying efficiency of the coil carrier board is enhanced, and the overall structure of the coil carrier board has better flatness, rigidity and high interlayer alignment accuracy, thereby facilitating miniaturization and automated assembly production.

Abstract: A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

Abstract: An integrated driving module with energy conversion function includes a patterned conductive circuit layer, an integrated electromagnetic induction component layer, a second dielectric layer, an embedded electrical component and a conductive component. The integrated electromagnetic induction component layer, which has a plurality of conductive coil layer, a plurality of conductive connecting component and a first dielectric layer, is disposed on the patterned conductive circuit layer. The conductive coil layers are stacked. Each conductive connecting component is electrically connected between the two conductive coil layers and between the corresponding conductive coil layer and the patterned conductive circuit layer. The first dielectric layer covers the conductive coil layers and the conductive connecting components. The second dielectric layer covers the patterned conductive circuit layer.

Abstract: An integrated driving module with energy conversion function includes a patterned conductive circuit layer, an integrated electromagnetic induction component layer, a second dielectric layer, an embedded electrical component and a conductive component. The integrated electromagnetic induction component layer, which has a plurality of conductive coil layer, a plurality of conductive connecting component and a first dielectric layer, is disposed on the patterned conductive circuit layer. The conductive coil layers are stacked. Each conductive connecting component is electrically connected between the two conductive coil layers and between the corresponding conductive coil layer and the patterned conductive circuit layer. The first dielectric layer covers the conductive coil layers and the conductive connecting components. The second dielectric layer covers the patterned conductive circuit layer.

Abstract: An integrated driving module with energy conversion function includes a patterned conductive circuit layer, an integrated electromagnetic induction component layer, a second dielectric layer, an embedded electrical component and a conductive component. The integrated electromagnetic induction component layer, which has a plurality of conductive coil layer, a plurality of conductive connecting component and a first dielectric layer, is disposed on the patterned conductive circuit layer. The conductive coil layers are stacked. Each conductive connecting component is electrically connected between the two conductive coil layers and between the corresponding conductive coil layer and the patterned conductive circuit layer. The first dielectric layer covers the conductive coil layers and the conductive connecting components. The second dielectric layer covers the patterned conductive circuit layer.

Abstract: A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit layer formed on the first insulating layer and electrically connected to the wiring layers with the second circuit layer electrically connected to the first circuit layer through the conductive posts. According to the present disclosure, fine-pitch circuits are formed in the circuit board, and thus only the circuit board needs a high-cost insulating material, thereby allowing the first insulating layer to be made of a low-cost material to reduce the fabrication cost.

Abstract: A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit layer formed on the first insulating layer and electrically connected to the wiring layers with the second circuit layer electrically connected to the first circuit layer through the conductive posts. According to the present disclosure, fine-pitch circuits are formed in the circuit board, and thus only the circuit board needs a high-cost insulating material, thereby allowing the first insulating layer to be made of a low-cost material to reduce the fabrication cost.

Abstract: A printed circuit board includes a base, a number of conductive pads, a dielectric layer, an activated metal layer, a first metal seed layer, a second metal seed layer, and a plurality of metal bumps. The conductive pads are formed on the base. The dielectric layer is formed on a surface of the conductive pads and portions of the base are exposed from the conductive pads. The dielectric layer includes blind vias corresponding to the conductive pads, and a laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the dielectric layer. The second metal seed layer is formed on the activated metal layer and the conductive pads. Each metal bump is formed on the second metal seed layer, and each metal bump protrudes from the dielectric layer.

Abstract: A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.

Abstract: A printed circuit board includes a first, second, and third dielectric layers, and a first, second, and third trace layers. The first trace layer and the second trace layer are formed on opposite surfaces of the first dielectric layer. The second dielectric layer is formed on the second trace layer, a first blind hole is defined in the first surface and terminated at a position in the first dielectric layer, a first conductive via is formed in the first blind hole. A second blind hole is formed in the second dielectric layer and the first dielectric layer. A second conductive via is formed in the second blind hole. The third trace layer is electrically connected with the second conductive via. The first trace layer is electrically connected with the second trace layer through the first conductive via and the second conductive via.

Abstract: A method for manufacturing a part-embedded circuit structure includes: forming an inner resist layer with an opening on a base member to expose a portion of the base member; forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer; laminating a dielectric layer on the inner wiring layer; forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; and removing the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed.

Abstract: A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads. The solder mask is formed on a surface of the conductive circuit pattern and portions of the base are exposed from the circuit pattern. The solder mask includes blind vias corresponding to the pads, and laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the solder mask. The metal seed layer is formed on the activated metal layer and the pads. Each metal bump is formed on the metal seed layer, and each metal bump protrudes from the solder mask.

Abstract: A circuit board includes at least one core substrate, at least one insulating layer and at least one dielectric sheet. An opening is defined in the insulating layer corresponding to the core substrate. An area of cross-section of the opening is larger than that of the core substrate. The core substrate is received in the opening. The dielectric sheet is positioned on one side surface of the core substrate and the insulating layer. A cavity is defined in the circuit board. A number of pads of the core substrate are exposed via the cavity. The present disclosure also provides a method for manufacturing the circuit board and package structure.

Abstract: A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.

Abstract: A printed circuit board includes a first, second, and third dielectric layers, and a first, second, and third trace layers. The first trace layer and the second trace layer are formed on opposite surfaces of the first dielectric layer. The second dielectric layer is formed on the second trace layer, a first blind hole is defined in the first surface and terminated at a position in the first dielectric layer, a first conductive via is formed in the first blind hole. A second blind hole is formed in the second dielectric layer and the first dielectric layer. A second conductive via is formed in the second blind hole. The third trace layer is electrically connected with the second conductive via. The first trace layer is electrically connected with the second trace layer through the first conductive via and the second conductive via.

Abstract: A printed circuit board includes a base, a number of conductive pads, a dielectric layer, an activated metal layer, a first metal seed layer, a second metal seed layer, and a plurality of metal bumps. The conductive pads are formed on the base. The dielectric layer is formed on a surface of the conductive pads and portions of the base are exposed from the c conductive pads. The dielectric layer includes blind vias corresponding to the conductive pads, and a laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the dielectric layer. The second metal seed layer is formed on the activated metal layer and the conductive pads. Each metal bump is formed on the second metal seed layer, and each metal bump protrudes from the dielectric layer.

Abstract: A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads. The solder mask is formed on a surface of the conductive circuit pattern and portions of the base are exposed from the circuit pattern. The solder mask includes blind vias corresponding to the pads, and laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the solder mask. The metal seed layer is formed on the activated metal layer and the pads. Each metal bump is formed on the metal seed layer, and each metal bump protrudes from the solder mask.

Abstract: A packaging substrate includes a core board having a first surface and an opposite second surface; at least a conic through hole formed in the core board and penetrating the first and second surfaces; a plurality of conductive paths formed on a wall of the conic through hole, free from being electrically connected to one another in the conic through hole; and a plurality of first circuits and second circuits disposed on the first and second surfaces of the core board, respectively, and being in contact with peripheries of two ends of the conic through hole, wherein each of the first circuits is electrically connected through each of the conductive paths to each of the second circuits. Compared to the prior art, the packaging substrate has a reduced number of through holes or vias and an increased overall layout density.

Abstract: A semiconductor package substrate structure and a manufacturing method thereof are disclosed. The structure includes a substrate having a plurality of electrical connecting pads formed on at least one surface thereof; a plurality of electroplated conductive posts each covering a corresponding one of the electrical connecting pads and an insulating protective layer formed on the surface of the substrate and having a revealing portion for exposing the electroplated conductive posts therefrom. The invention allows the interval between the electroplated conductive posts to be minimized, the generation of concentrated stresses and the overflow of underfill to be avoided, as well as the reduction of the overall height of the fabricated package.

Abstract: A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection.