Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.

Abstract: In one example, a keyboard housing may include a chassis, a plurality of keys exposed through a top surface of the chassis, and an input device assembly connected to the chassis. The input device assembly may include a flexible touch sensing component to receive a touch input and a support structure. The support structure may include a first portion and a second portion foldable onto the first portion. The first portion and the second portion may support the flexible touch sensing component.

Abstract: Disclosed is a method for forming a crystalline protective polysilicon layer which does not create defective voids during subsequent processes so as to provide effective protection to devices underneath. In one embodiment, a method for forming a semiconductor device, includes: depositing a protective coating on a first polysilicon layer; forming an epitaxial layer on the protective coating; and depositing a second polysilicon layer over the epitaxial layer, wherein the protective coating comprises a third polysilicon layer, wherein the third polysilicon layer is deposited at a first temperature in a range of 600-700 degree Celsius, and wherein the third polysilicon layer in the protect coating is configured to protect the first polysilicon layer when the second polysilicon layer is etched.

Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.

Abstract: The application relates to a polymerization vessel and a method for manufacturing the same. An interior surface of the polymerization vessel has a specific structure, so that the polymerization vessel has better heat transfer efficiency. Closed cooling channels are constructed from the specific structure, and therefore cooling fluid flows in the closed cooling channels. Furthermore, there won't be any by-pass defects in the cooling channels of the polymerization vessel, thereby improving cooling efficiency of the cooling fluid.

Abstract: A RRAM device includes a bottom electrode, a resistive material layer, atop electrode, a hard mask and high work function sidewall parts. The bottom electrode, the resistive material layer, the top electrode and the hard mask are sequentially stacked on a substrate. The high work function sidewall parts cover sidewalls of the top electrode and sidewalls of the hard mask, thereby constituting a RRAM cell. A method of forming the RRAM device is also provided.

Abstract: A resistive random access memory (RRAM) structure includes a RRAM cell, spacers and a dielectric layer. The RRAM cell is disposed on a substrate. The spacers are disposed beside the RRAM cell, wherein widths of top surfaces of the spacers are larger than or equal to widths of bottom surfaces of the spacers. The dielectric layer blanketly covers the substrate and sandwiches the RRAM cell, wherein the spacers are located in the dielectric layer. A method for forming the resistive random access memory (RRAM) structure is also provided.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: A torsion sensor, including a casing assembly, a sleeve set, a driven slider, a driving slider, an elastic member, a magnetic sensor, and a magnetic member is provided. The sleeve set includes a first sleeve, a second sleeve, and a third sleeve. The first sleeve is disposed in the casing assembly. The second sleeve has a neck portion sleeved on the second side of the first sleeve. The third sleeve is disposed between the first and the second sleeves. The driven slider is connected to a head portion of the second sleeve. The driving slider surrounds an outer side of the driven slider. The elastic member surrounds an outer side of the second sleeve. One of the magnetic sensor and the magnetic member is disposed in the casing assembly, and the other one is disposed in the sleeve set. The magnetic sensor and the magnetic member are disposed opposite to each other.

Abstract: A driving circuit includes at least one light-emitting element, a drive line, a data line, a touch sensor, and a read line. The drive line is electrically coupled to a first terminal of the at least one light-emitting element. The data line is electrically coupled to a second terminal of the at least one light-emitting element. The drive line is electrically coupled to a first terminal of the touch sensor. The read line is electrically coupled to a second terminal of the touch sensor. The read line is electrically isolated from the data line.

Abstract: A circuit board includes multiple of first touch sensing electrodes, multiple of second touch sensing electrodes, and multiple of dummy patterns. The first touch sensing electrodes extend along a first direction. The second touch sensing electrodes extend along a second direction. The first touch sensing electrodes are electrically insulated from the second touch sensing electrodes. The first direction is not parallel to the second direction. The dummy patterns are positioned on the areas between the first touch sensing electrodes and the second touch sensing electrodes. The first touch sensing electrodes, the second touch sensing electrodes, and the dummy electrodes are non-transparent.

Abstract: A driving circuit includes at least one light-emitting element, a drive line, a data line, a touch sensor, and a read line. The drive line is electrically coupled to a first terminal of the at least one light-emitting element. The data line is electrically coupled to a second terminal of the at least one light-emitting element. The drive line is electrically coupled to a first terminal of the touch sensor. The read line is electrically coupled to a second terminal of the touch sensor. The read line is electrically isolated from the data line.

Abstract: The disclosure provides a drive device including a gear, a bearing, and a motor rotor. The gear includes an installation hole. The bearing is disposed in the installation hole of the gear and includes a rotation hole, a sliding groove, and a drive assembly. The sliding groove communicates with the rotation hole, and the drive assembly is movably disposed in the sliding groove. The motor rotor rotatably passes through the rotation hole of the bearing. The drive assembly is moved to lock the bearing by the rotation of the motor rotor, and the torsion force of the motor rotor is transmitted to the gear through the bearing.

Abstract: A torsion sensor, including a casing assembly, a sleeve set, a driven slider, a driving slider, an elastic member, a magnetic sensor, and a magnetic member is provided. The sleeve set includes a first sleeve, a second sleeve, and a third sleeve. The first sleeve is disposed in the casing assembly. The second sleeve has a neck portion sleeved on the second side of the first sleeve. The third sleeve is disposed between the first and the second sleeves. The driven slider is connected to a head portion of the second sleeve. The driving slider surrounds an outer side of the driven slider. The elastic member surrounds an outer side of the second sleeve. One of the magnetic sensor and the magnetic member is disposed in the casing assembly, and the other one is disposed in the sleeve set. The magnetic sensor and the magnetic member are disposed opposite to each other.

Abstract: A system and a method for compensating uniformity of brightness are provided. The system includes an edge-type backlight assembly, a display panel, a brightness sensor, a compensating calculator, and a local dimming controller. The display panel is disposed above the edge-type backlight assembly. The display panel includes plural regions for local dimming. The brightness sensor is configured to measure whether the brightness distribution of the display panel is uniform. When the brightness distribution of the display panel is not uniform, the compensating calculator calculates a brightness compensation value corresponding to each of the regions of the display panel. The local dimming controller is configured to drive the edge-type backlight assembly according to the brightness compensation value corresponding to each of the regions of the display panel.

Abstract: The present disclosure is related to a touch technology field and provides a backlight module and a touch display device using the backlight module. The backlight module includes a substrate, plural driving electrode lines, plural receiving electrode lines, and plural light sources. The driving electrode lines are disposed on the substrate. The receiving electrode lines are disposed on the substrate, in which the receiving electrode lines and the driving electrode lines define plural light source regions on the substrate. The lights sources are disposed in the light source regions, in which each of the light source regions includes at least one of the light sources. The touch display device includes the backlight module and a display panel. The backlight module is configured to provide backlight light. The display panel is disposed on the backlight module to use the backlight light to display images.