Abstract: A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A rate of change of a relatively luminous intensity relative to the temperature of the first LED array is lower than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. A heat dissipation efficiency of the second heat sink is higher than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much lower temperature.

Abstract: An illuminating apparatus (20) includes a lamp cover (200), a solid-state light emitting component (23) and an air tank (24). The lamp cover has a first end and an opposite second end. The lamp cover tapers from the first end to the second end. The lamp cover defines therein an air channel (25) running from the first end to the second end of the lamp cover. The solid-state light emitting component is disposed in the lamp cover at the second end thereof. The air tank has a chamber (240) therein in thermally contact with the solid-state light emitting component. The air tank has a plurality of first and second air vents (244, 245). The chamber is communicated with the air channel via the first air vents, and is communicated with an ambient environment via the second air vents. The first and second air vents are disposed at different altitudes.

Abstract: An exemplary laser device includes a laser source and an optical module. The laser source is configured for emitting a laser beam in the TEMxy mode, wherein 0?x?3, and 0?y?3. The optical module includes a cylindrical-type lens disposed on a light path of the laser beam. The cylindrical-type lens has a first surface and an opposite second surface, and the first surface faces toward the laser source. At least one of the first surface and the second surface is a cylindrical-type curved surface configuring for adjusting a field distribution of the laser beam of the laser source.

Abstract: An LED lamp for lighting purpose includes a lamp base, a heat sink, a plurality of LED modules and a blower. The lamp base encloses an inner space and defines a plurality of vents therein. The vents communicate the inner space with a surrounding atmosphere. The heat sink comprises a cylinder at a center thereof. The cylinder has a through hole therein, which communicates with the inner space and vents of the lamp base and cooperates therewith to form an air passage. The LED modules are attached to a periphery of the heat sink. The blower generates an airflow circulating through the air passage to thereby dissipate heat generated by the LED modules.

Abstract: An exemplary method includes the following steps. First, a substrate is provided. Second, a nitride-based multi-layered structure is epitaxially grown on the substrate. The multi-layered structure includes a first-type layer, an active layer, and a second-type layer arranged one on the other in that order along a direction away from the substrate. A crystal growth orientation of the multi-layered structure intersects with a <0001> crystal orientation thereof. Thirdly, the multi-layered structure is patterned to form a mesa structure thereof, wherein the first-type layer is partially exposed to form an exposed portion. The mesa structure has a top surface facing away from the substrate, and side surfaces adjacent to the top surface. Fourthly, a first-type electrode and a second-type electrode are formed in ohmic contact with the first-type layer and the second-type layer, respectively. Finally, the top and side surfaces of the patterned multi-layered structure are wet etched.

Abstract: An exemplary solid-state light emitting device includes a substrate, a light emitting structure, a first electrode and a second electrode have opposite polarities with each other. The light emitting structure includes a first-type semiconductor layer, a second-type semiconductor layer and an active layer between the first-type semiconductor layer and the second-type semiconductor layer. The first electrode electrically is connected with the first-type semiconductor layer. The first electrode includes a first contact pad and a current induced electrode spaced apart and insulated from each other. The second electrode has an opposite polarity with respect to the first electrode. The second electrode includes a transparent conductive layer formed on and electrically connected with the second-type semiconductor layer and a metallic conductive layer formed on the transparent conductive layer and in electrical contact therewith.

Abstract: An exemplary embodiment of a light source module includes a lighting module and a thermoelectric cooler. The lighting module includes a first heat-conducting dielectric plate and a plurality of LED chips arranged on the first heat-conducting dielectric plate. The thermoelectric cooler is formed on an opposite side of the first heat-conducting dielectric plate to the LED chips. The thermoelectric cooler includes a second heat-conducting dielectric plate opposite to the first heat-conducting dielectric plate, and a plurality of thermoelectric elements located between the first heat-conducting dielectric plate and the second heat-conducting dielectric plate. The thermoelectric elements are connected with each other.

Abstract: An exemplary embodiment of a light source module includes a thermoelectric cooler, many LED chips, and a circuit layer. The thermoelectric cooler includes a first heat-conducting dielectric plate, a second heat-conducting dielectric plate opposite to the first heat-conducting dielectric plate, and a number of thermoelectric elements located between the first heat-conducting dielectric plate and the second heat-conducting dielectric plate. The thermoelectric elements are connected with each other. The LED chips and the circuit layer are formed on the first heat-conducting dielectric plate and facing away from the second heat-conducting dielectric plate, and the LED chips are electrically connected to the circuit layer.

Abstract: A solid state light illuminator includes a solid state lighting element, a primary coil, and a secondary coil. The secondary coil and the solid state lighting element cooperatively form a circuit. The secondary coil couples electromagnetically with the primary coil. The primary coil is adapted for electrically connecting to an AC power source to generate an alternating magnetic field. The alternating magnetic field generates an induced electromotive force in the secondary coil to apply an electrical current to the solid state lighting element.

Abstract: A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A rate of change of a relatively luminous intensity relative to the temperature of the first LED array is lower than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. A heat dissipation efficiency of the second heat sink is higher than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much lower temperature.

Abstract: A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A ratio of change of relatively luminous intensity relative to change of temperature of the first LED array is less than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. An active heat dissipating device (80) is in combination with the second heat sink for enhancing a heat dissipation efficiency of the second heat sink, and thus the heat dissipation efficiency of the second heat sink is greater than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much less temperature.

Abstract: An exemplary streetlight system for illuminating a road surface comprises an illuminating device, an infrared detection device and a controlling device. The illuminating device includes a light source. The infrared detection device is configured for detecting whether there are vehicles or passersby on the road surface and generating a detection signal. The controlling device is configured for receiving the detection signal, generating a controlling signal according to the detection signal and sending the controlling signal to the light source, thereby modulating the brightness of the light source.

Abstract: A light source module includes a light source and an thermoelectric cooler. The thermoelectric cooler includes a first base board, a second base board and a number of thermoelectric cooling units. The first base board includes a first surface and an opposing second surface. The second base board includes a top surface and a bottom surface. The light source is defined on the first surface of the first base board. The thermoelectric cooling units are disposed between the first surface of the first base board and the top surface of the second base board, and are configured for transferring heat generated from the light source from the first base board to the second base board.

Abstract: An illuminating device includes a circuit board, a light source, and a thermoelectric cooler. The circuit board has a first surface and a second surface at an opposite side of the circuit board to the first surface. The light source is electrically mounted on the first surface of the circuit board. The thermoelectric cooler is attached on the second surface of the circuit board.

Abstract: An LED includes a substrate having a substantially flat substrate surface, a plurality of electrodes extending through the substrate, an LED chip configured for emitting light, a first and a second coplanar reflective layers formed on the surface, and a light pervious encapsulation member mounted on the substrate surface. The light pervious encapsulation member covers the LED chip and the first reflective layer and a portion of the second reflective layer. The LED chip is mounted on the substrate surface and electrically connected with the electrodes. The first reflective layer and the second reflective layer are configured for reflecting the light emitted from the LED chip.