Patents by Inventor Wenjun Luo

Wenjun Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237566
    Abstract: The electronic device includes a frame, a screen, and a circuit board assembly. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: February 25, 2025
    Assignee: Honor Device Co., Ltd.
    Inventors: Jianqiang Guo, Liang Bai, Lianjie Ye, Wenjun Luo, Zhihai Li
  • Patent number: 12219727
    Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: February 4, 2025
    Assignee: HONOR DEVICE CO., LTD.
    Inventors: Jianqiang Guo, Wenjun Luo, Fan Yang
  • Publication number: 20240401670
    Abstract: A bevel gear pair with constant meshing characteristics with a constructed tooth pair is provided. The bevel gear pair with a constructed tooth pair includes a bevel gear I with a constructed tooth pair and a bevel gear II with a constructed tooth pair based on conjugate curves. In the present disclosure, a normal tooth profile curve of the bevel gear I with a constructed tooth pair and a normal tooth profile curve of the bevel gear II with a constructed tooth pair are continuous combined curves with the same curve shape, which facilitates machining by the same cutter. A common normal at an inflection point or a tangent point of the continuous combined curve passes through a pitch point of the bevel gear pair with a constructed tooth pair, and a position of the inflection point or the tangent point can be adjusted according to an actual demand.
    Type: Application
    Filed: May 2, 2024
    Publication date: December 5, 2024
    Inventors: Bingkui CHEN, Dongyu WANG, Luhe ZHANG, Xinxin YE, Wenjun LUO, Yonghong CHEN, Chaoyang LI, Changyan PENG, Hehe LU
  • Publication number: 20240401673
    Abstract: Provided is a herringbone planetary gear transmission device with a constant meshing characteristics constructed tooth pair, which relates to the technical field of gear transmission. The transmission device includes a sun gear with a constructed tooth pair, a planetary gear with a constructed tooth pair and an internal gear with a constructed tooth pair based on conjugate curves. Normal tooth profiles of the gears with a constructed tooth pair in the present disclosure are all the same combined curve and can be machined by using the same cutter. A common normal at an inflection point or a tangent point of the curve passes through a pitch point of a meshing gear pair, and a sliding ratio of the meshing gear pair is adjusted according to an adjusted position of the inflection point or the tangent point. A contact ratio of the meshing gear pair is designed as an integer.
    Type: Application
    Filed: May 8, 2024
    Publication date: December 5, 2024
    Inventors: Bingkui CHEN, Chao TIAN, Luhe ZHANG, Changyan PENG, Wenjun LUO, Chaoyang LI, Yonghong CHEN
  • Publication number: 20240401685
    Abstract: Provided is a herringbone gear pair with a constant meshing characteristics constructed tooth pair. The herringbone gear pair with a constructed tooth pair includes a herringbone gear I with a constructed tooth pair and a herringbone gear II with a constructed tooth pair based on conjugate curves. In the present disclosure, normal tooth profile curves of the herringbone gear pair with a constructed tooth pair are continuous combined curves with the same curve shape, which facilitates machining by the same cutter. A common normal at an inflection point or a tangent point of the continuous combined curve passes through a pitch point of the gear pair, and a position of the inflection point or the tangent point can be adjusted according to an actual demand. A contact ratio of the herringbone gear pair with a constructed tooth pair is designed as an integer.
    Type: Application
    Filed: May 2, 2024
    Publication date: December 5, 2024
    Inventors: Luhe ZHANG, Wenjun LUO, Chaoyang LI, Yonghong CHEN, Changyan PENG, Bingkui CHEN
  • Publication number: 20240401686
    Abstract: Provided is an external meshing cylindrical gear pair with a constant meshing characteristics constructed tooth pair. The external meshing cylindrical gear pair with a constructed tooth pair includes a cylindrical gear I with a constructed tooth pair and a cylindrical gear II with a constructed tooth pair based on conjugate curves. In the present disclosure, normal tooth profile curves of the cylindrical gear I with a constructed tooth pair and the cylindrical gear II with a constructed tooth pair are continuous combined curves with the same curve shape, which facilitates machining by the same cutter. A common normal at an inflection point or a tangent point of the continuous combined curve passes through a pitch point of the gear pair, and a position of the inflection point or the tangent point can be adjusted according to an actual demand. A contact ratio is designed as an integer.
    Type: Application
    Filed: May 2, 2024
    Publication date: December 5, 2024
    Inventors: Bingkui CHEN, Zhongtao LI, Luhe ZHANG, Wenjun LUO, Yonghong CHEN, Chaoyang LI, Changyan PENG
  • Publication number: 20240401684
    Abstract: Provided is an internal meshing cylindrical gear pair with a constant meshing characteristics constructed tooth pair. The internal meshing cylindrical gear pair with a constructed tooth pair includes an external cylindrical gear with a constructed tooth pair and an internal cylindrical gear with a constructed tooth pair based on conjugate curves. In the present disclosure, normal tooth profile curves of the external cylindrical gear with a constructed tooth pair and the internal cylindrical gear with a constructed tooth pair are continuous combined curves with the same curve shape, which facilitates machining by the same cutter. A common normal at an inflection point or a tangent point of the continuous combined curve passes through a pitch point of the gear pair, and a position of the inflection point or the tangent point can be adjusted as required, so as to adjust a sliding ratio of the gear pair.
    Type: Application
    Filed: May 2, 2024
    Publication date: December 5, 2024
    Inventors: Bingkui CHEN, Fei LIU, Luhe ZHANG, Yonghong CHEN, Changyan PENG, Wenjun LUO, Chaoyang LI
  • Publication number: 20240306300
    Abstract: A flexible circuit board, a circuit board assembly, and an electronic device are provided. The flexible circuit board includes at least a flexible dielectric layer and a first connection metal layer. The flexible dielectric layer includes a through hole extending along a thickness direction of the flexible dielectric layer. The through hole includes a middle basic hole and outer auxiliary holes. Two or more outer auxiliary holes are distributed and arranged along a circumferential direction of the middle basic hole. The middle basic hole is in communication with the two or more outer auxiliary holes. The first connection metal layer is arranged on an inner wall of the through hole and is connected to the flexible dielectric layer. The first connection metal layer includes a middle channel extending along a thickness direction.
    Type: Application
    Filed: August 18, 2022
    Publication date: September 12, 2024
    Inventors: Jianqiang Guo, Wenjun Luo, Mingchuan Li
  • Publication number: 20240292581
    Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity.
    Type: Application
    Filed: August 22, 2022
    Publication date: August 29, 2024
    Inventors: Jianqiang Guo, Wenjun Luo, Jun Li
  • Publication number: 20240269759
    Abstract: This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.
    Type: Application
    Filed: September 14, 2022
    Publication date: August 15, 2024
    Applicant: Honor Device Co., Ltd.
    Inventors: Jianqiang GUO, Wenjun LUO, Mingchuan LI
  • Publication number: 20240244752
    Abstract: A circuit board assembly that is applied to an electronic device is provide. The circuit board assembly includes at least printed circuit boards, a flexible circuit board, and a support. Two or more printed circuit boards are spaced apart. The printed circuit boards include first pads. Two neighboring printed circuit boards are connected to the flexible circuit board. The flexible circuit board includes a bending region, straight regions, and second pads. Straight regions are respectively arranged on two opposite sides of the bending region. The straight regions are located between the two printed circuit boards. The bending region and the straight regions form an accommodating space. The second pad is arranged in the straight region. The first pad is connected to the second pad. The support is arranged in the accommodating space. The support includes two stacked support bodies.
    Type: Application
    Filed: August 18, 2022
    Publication date: July 18, 2024
    Inventors: Jianqiang Guo, Wenjun Luo
  • Publication number: 20240206102
    Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.
    Type: Application
    Filed: August 18, 2022
    Publication date: June 20, 2024
    Inventors: Jianqiang GUO, Wenjun LUO, Fan YANG
  • Patent number: 11954806
    Abstract: A polar navigation window period assessment system based on three-dimensional visualization simulation of ship-ice interaction is provided in the present application, including a virtual reality interactive operation module for interacting with virtual reality scenes based on a virtual reality (VR) handle and a VR helmet; a three-dimensional virtual visualization integration module for observing the virtual reality scenes from a global perspective; a three-dimensional simulation module of the Arctic route environment for simulating a route environment scene; an Arctic navigation virtual scene module for establishing a navigation virtual scene; an Arctic navigation window period assessment module for assessing navigation window periods of the ship on different routes; a system storing and outputting module for storing interactive operation information, virtual reality scene information and window period assessment result information, and outputting them in form of curve diagrams and data tables.
    Type: Grant
    Filed: November 4, 2023
    Date of Patent: April 9, 2024
    Assignee: SHANGHAI JIAO TONG UNIVERSITY
    Inventors: Guijie Shi, Deyu Wang, Wenjun Luo, Chuntong Li, Jiaqi Jiang
  • Publication number: 20220407218
    Abstract: An electronic device, relating to the technical field of antennas. The electronic device includes a frame, a screen, and a circuit board assembly. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator.
    Type: Application
    Filed: April 13, 2021
    Publication date: December 22, 2022
    Applicant: Honor Device Co., Ltd.
    Inventors: Jianqiang GUO, Liang BAI, Lianjie YE, Wenjun LUO, Zhihai LI
  • Patent number: 11480345
    Abstract: An air conditioner indoor unit includes a housing and a chassis connected to the housing. The chassis and the housing form a receiving chamber with an access opening. At least a portion of an inner side surface of a bottom wall of the chassis forms a guiding surface extending to the access opening. The chassis includes an avoidance hole and a resilient member. At least a portion of the resilient member is arranged in the avoidance hole and protrudes from the guiding surface.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: October 25, 2022
    Assignees: GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Zhicai Cai, Wenjun Luo, Kuifang Zou
  • Patent number: 11466744
    Abstract: The present disclosure discloses an electromagnetic multistage adjustable variable inertance and variable damping device. Iron cores are magnetized by winding electromagnetic coil windings outside the iron cores and applying an electric current action to the electromagnetic coil windings, and air gap magnetic fields are generated by the magnetized iron cores and permanent magnets in air gaps to cause the variation of shear damping forces between a driving shear plate and magnet yokes and between driven shear plates and magnet yokes, which avoids that the mechanical properties of an inerter cannot be fully utilized due to the friction caused by mutual contact among parts, thereby realizing multistage real-time adjustability of an instance coefficient and a damping coefficient of the device.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: October 11, 2022
    Assignee: East China Jiaotong University
    Inventors: Yonghu Huang, Hongli Zhang, Mengyuan Lv, Wenjun Luo, Yongsheng Liu
  • Patent number: 11384012
    Abstract: A durable, hydrophobic and anti-scratching nano-coating for coating on a glass substrate or surface having a water contact angle of about 90° or more, a reduced coefficient of friction by 50% or more, and a reduced surface roughness compared to those of the glass substrate or surface without the nano-coating is provided, which includes a layer of fluorinated silica derived from sol-gel hydrolysis between one or more tetraalkoxysilanes having at least three alkoxy groups and one or more polyfluorinated silanes having at least a trialkoxysilane and from 15 to 17 fluorine atoms in the presence of a catalyst to a reaction mixture of the sol-gel hydrolysis between the one or more tetraalkoxysilanes and the one or more polyfluorinated silanes, and a solvent. A related method of fabricating the nano-coating via atomization of acid-containing or alkali-containing solution and sol-gel precursor solution onto the glass surface is also provided.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 12, 2022
    Assignee: Nano and Advanced Materials Institute Limited
    Inventors: Su Ping Bao, Wenjun Luo, Lei Gao, Man Lung Sham
  • Patent number: 11262086
    Abstract: Disclosed are an indoor unit and an air conditioner having the indoor unit. The indoor unit has a housing having a chassis that can be mounted to a wall, and a front frame connected with the chassis, in which the front frame and the chassis can be joined to define a mounting cavity having a mounting mouth opened downwards, and a fan assembly positioned in the mounting cavity and exposed to an outside at the mounting mouth, in which the fan assembly can be removably connected with the front frame and the chassis.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: March 1, 2022
    Assignees: GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Zhicai Cai, Kuifang Zou, Wenjun Luo
  • Publication number: 20210364189
    Abstract: A mounting plate includes a marking structure. The marking structure includes a plurality of through holes arranged sequentially in at least one predetermined direction, and a scale mark corresponding to the plurality of through holes and configured to indicate a distance between at least some of the plurality of through holes.
    Type: Application
    Filed: August 30, 2019
    Publication date: November 25, 2021
    Inventors: Kuifang ZOU, Jiabing YE, Lin GAN, Lilong ZHOU, Zhicai CAI, Huawei CHEN, Wenjun LUO
  • Publication number: 20210356143
    Abstract: An air conditioner indoor unit includes a housing and a chassis connected to the housing. The chassis and the housing form a receiving chamber with an access opening. At least a portion of an inner side surface of a bottom wall of the chassis forms a guiding surface extending to the access opening. The chassis includes an avoidance hole and a resilient member. At least a portion of the resilient member is arranged in the avoidance hole and protrudes from the guiding surface.
    Type: Application
    Filed: August 30, 2019
    Publication date: November 18, 2021
    Inventors: Zhicai CAI, Wenjun LUO, Kuifang ZOU