Abstract: The present disclosure provides a method of manufacturing an integrated circuit device in some embodiments. In the method, a semiconductor substrate is processed through a series of operations to form a topographically variable surface over the semiconductor substrate. The topographically variable surface varies in height across the semiconductor substrate. A polymeric bottom anti-reflective coating (BARC) is provided over the topographically variable surface. Chemical mechanical polishing is performed to remove a first portion of the BARC, and etching effectuates a top-down recessing of the BARC.

Abstract: A wafer polishing process includes polishing a central area on the back side of a wafer, polishing a peripheral area on the back side of the wafer, buffing the central area, and buffing the peripheral area. The process can significantly reduce scratch-related wafer breakage, can correct focus spots on wafers, and can replace cleaning processes that use chemical etchants. Polishing and buffing can include polishing and buffing the bevel region. Further improvements include polishing with abrasive pads having a soft backing, polishing or buffing with pads having relatively soft abrasive particles, polishing or buffing with abrasive pads made from abrasive particles that have been sorted and selected for regularity of shape, irrigating the surface being polished or buffed with an aqueous solution that includes a friction-reducing agent, and buffing with abrasive pads having 20 k or finer grit or non-abrasive pads.

Abstract: An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a polymer coating, CMP to form a planar surface, then plasma etching to effectuate a planar recessing of the polymer coating. The material can be recessed together with the polymer coating, or subsequently with the recessed polymer coating providing a mask. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The polymer can be a photoresist. The polymer can be provided with suitable adhesion and uniformity for the CMP process through a two-step baking process and by exhausting the baking chamber from below the substrate.

Abstract: An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a bottom anti-reflective coating (BARC), baking to induce cross-linking in the BARC, CMP to remove a first portion of the BARC and form a planar surface, then plasma etching to effectuate a planar recessing of the BARC. The plasma etching can have a low selectivity between the BARC and the material being recessed, whereby the BARC and the material are recessed simultaneously. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The method can be particularly effective when an abrasive used during CMP forms ester linkages with the BARC.

Abstract: A method for performing a Chemical Mechanical Polishing (CMP) process includes applying a CMP slurry solution to a surface of a hardened fluid material on a substrate, the solution comprising an additive to change a bonding structure on the surface of the hardened fluid material. The method further includes polishing the surface of the hardened fluid material with a polishing head.

Abstract: An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a bottom anti-reflective coating (BARC), baking to induce cross-linking in the BARC, CMP to remove a first portion of the BARC and form a planar surface, then plasma etching to effectuate a planar recessing of the BARC. The plasma etching can have a low selectivity between the BARC and the material being recessed, whereby the BARC and the material are recessed simultaneously. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The method can be particularly effective when an abrasive used during CMP forms ester linkages with the BARC.

Abstract: An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a polymer coating, CMP to form a planar surface, then plasma etching to effectuate a planar recessing of the polymer coating. The material can be recessed together with the polymer coating, or subsequently with the recessed polymer coating providing a mask. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The polymer can be a photoresist. The polymer can be provided with suitable adhesion and uniformity for the CMP process through a two-step baking process and by exhausting the baking chamber from below the substrate.

Abstract: A wafer polishing process includes polishing a central area on the back side of a wafer, polishing a peripheral area on the back side of the wafer, buffing the central area, and buffing the peripheral area. The process can significantly reduce scratch-related wafer breakage, can correct focus spots on wafers, and can replace cleaning processes that use chemical etchants. Polishing and buffing can include polishing and buffing the bevel region. Further improvements include polishing with abrasive pads having a soft backing, polishing or buffing with pads having relatively soft abrasive particles, polishing or buffing with abrasive pads made from abrasive particles that have been sorted and selected for regularity of shape, irrigating the surface being polished or buffed with an aqueous solution that includes a friction-reducing agent, and buffing with abrasive pads having 20k or finer grit or non-abrasive pads.

Abstract: A light emitting diode (LED) module and a display device adopting the same LED module are provided. The LED module includes a circuit substrate, a LED chip, a connector and a conductive line. The LED chip has at least three pins, and the LED chip is fixed on the circuit substrate through the pins, wherein one of the pins is defined as a no connection (NC) pin. The connector includes a non-conductive housing, at least one fixing pin and a conductor. The fixing pin is connected to the non-conductive housing, and the non-conductive housing is fixed on the circuit substrate through the said at least one fixing pin. A part of the non-conductive housing is covered with the conductor. The conductive line is disposed on the circuit substrate and is electrically connected between the conductor and the NC pin.

Abstract: A back-light module including a light guide plate (LGP), first light-emitting devices, and second light-emitting devices is provided. The LGP has a top-emitting surface, a bottom surface and a side surface. The LGP has at least one indentation. The indentation has a first light-incident sidewall and a pair of second light-incident sidewalls. The second light-incident sidewalls are located on two sides of the first light-incident sidewall and adjacent to the first light-incident sidewall. Normal vectors of the second light-incident sidewalls and the first light-incident sidewall are not parallel. The first light-emitting devices are located in the indentation, and a first light beam propagating toward the first light-incident sidewall is emitted from each of the first light-emitting devices. The second light-emitting devices are located in the indentation, and a second light beam propagating toward one of the second light-incident sidewalls is emitted from each of the second light-emitting devices.

Abstract: A back-light module including a light guide plate (LGP), first light-emitting devices, and second light-emitting devices is provided. The LGP has a top-emitting surface, a bottom surface and a side surface. The LGP has at least one indentation. The indentation has a first light-incident sidewall and a pair of second light-incident sidewalls. The second light-incident sidewalls are located on two sides of the first light-incident sidewall and adjacent to the first light-incident sidewall. Normal vectors of the second light-incident sidewalls and the first light-incident sidewall are not parallel. The first light-emitting devices are located in the indentation, and a first light beam propagating toward the first light-incident sidewall is emitted from each of the first light-emitting devices. The second light-emitting devices are located in the indentation, and a second light beam propagating toward one of the second light-incident sidewalls is emitted from each of the second light-emitting devices.

Abstract: A light emitting diode (LED) module and a display device adopting the same LED module are provided. The LED module includes a circuit substrate, a LED chip, a connector and a conductive line. The LED chip has at least three pins, and the LED chip is fixed on the circuit substrate through the pins, wherein one of the pins is defined as a no connection (NC) pin. The connector includes a non-conductive housing, at least one fixing pin and a conductor. The fixing pin is connected to the non-conductive housing, and the non-conductive housing is fixed on the circuit substrate through the said at least one fixing pin. A part of the non-conductive housing is covered with the conductor. The conductive line is disposed on the circuit substrate and is electrically connected between the conductor and the NC pin.

Abstract: A combination lock includes an outer case with an inner case received therein and the outer case has a chamber which communicates with a passage in which a latch is received. A spring is mounted to the latch and provides a force to move the latch in a direction away from the chamber. A front unit having two disks is located in the first chamber and a rear unit having two disks is located in the second chamber. The two disks of the front unit drive each other and the two disks of the rear unit drive each other. A first dial plate drives one of the disks of the front unit and a second dial plate drives one of the disks of the rear unit. When the notches are in alignment with each other, the end piece of the latch can pass through the notches and the lock is unlocked.

Abstract: A multistage lock apparatus has a base, a disk holder, two selecting devices, two disk sets and at least one interfering element. The base has a mounting panel and a central tube. The disk holder is connected to the base and has a mounting beam, two extending beams, a middle beam, a connecting beam and two mounting spaces. The selecting devices are rotatably connected to the base. The disk sets are respectively mounted on the selecting devices in the mounting specs of the disk holder and each disk set has a driving disk and at least one driven disk. The at least one interfering element is mounted securely on the disk holder and each of the at least one interfering element has a mounting tab and two elastic panels.

Abstract: A multistage lock apparatus has a base, a disk holder, two selecting devices, two disk sets and at least one interfering element. The base has a mounting panel and a central tube. The disk holder is connected to the base and has a mounting beam, two extending beams, a middle beam, a connecting beam and two mounting spaces. The selecting devices are rotatably connected to the base. The disk sets are respectively mounted on the selecting devices in the mounting specs of the disk holder and each disk set has a driving disk and at least one driven disk. The at least one interfering element is mounted securely on the disk holder and each of the at least one interfering element has a mounting tab and two elastic panels.

Abstract: A lock cylinder assembly has a base, multiple selecting disks and multiple disk sets. The base has an axis. The selecting disks are rotatably connected to the base along the axis of the base. The disk sets are operationally mounted along the axis of the base and are respectively connected to the selecting disks. Each disk set has multiple disks operationally mounted along the axis of the base. Accordingly, a lock cylinder assembly that can increase the difficulty of unlocking the lock cylinder assembly to improve the safety of using the lock cylinder assembly is provided.

Abstract: A lock cylinder assembly has a base, multiple selecting disks and multiple disk sets. The base has an axis. The selecting disks are rotatably connected to the base along the axis of the base. The disk sets are operationally mounted along the axis of the base and are respectively connected to the selecting disks. Each disk set has multiple disks operationally mounted along the axis of the base. Accordingly, a lock cylinder assembly that can increase the difficulty of unlocking the lock cylinder assembly to improve the safety of using the lock cylinder assembly is provided.

Abstract: A keyboard with a pointing device has a board with a bottom edge; a space key mounted on the bottom edge of the board, wherein the space key is particularly operated by either of two thumbs; multiple keys mounted on the board; and a pointing device mounted on the board and adjacent to the space key. By setting the pointing device adjacent to the space key, the pointing device can be conveniently driven by either thumb. Therefore, a user's hand does not need to move away from the keyboard when inputting data via the pointing device.