Patents by Inventor Wen-Li Huang

Wen-Li Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190146141
    Abstract: A frameless panel light includes a light source module and a lamp cover having a front portion and side portions surrounding the front portion. The front and side portions define an accommodating space. The light source module is disposed in the accommodating space and includes a light source and a light guide plate. The light guide plate includes a light-transmissive substrate including first and second major surfaces and a side surface connecting the first and second major surfaces and a microstructure formed on the first major surface and including a recess and an annular groove around the recess. The annular groove has a depth greater than that of the recess. A bottom of the recess is at higher elevation than the first major surface from the second major surface. The annular groove has a protruding portion protruding from a bottom of the annular groove.
    Type: Application
    Filed: December 20, 2018
    Publication date: May 16, 2019
    Inventors: Teng-Huei HUANG, I-Chang TSAO, Cheng-Ta KUO, Jhih-Han LIN, Wei-Jung CHANG, Sheng-Ju CHUNG, Li-Li LIU, Wen ZHOU
  • Patent number: 10290546
    Abstract: A semiconductor structure includes a plurality of first semiconductor layers interleaved with a plurality of second semiconductor layers. The first and second semiconductor layers have different material compositions. A dummy gate stack is formed over an uppermost first semiconductor layer. A first etching process is performed to remove portions of the second semiconductor layer that are not disposed below the dummy gate stack, thereby forming a plurality of voids. The first etching process has an etching selectivity between the first semiconductor layer and the second semiconductor layer. Thereafter, a second etching process is performed to enlarge the voids.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: May 14, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Li Chiang, Szu-Wei Huang, Huan-Sheng Wei, Jon-Hsu Ho, Chih Chieh Yeh, Wen-Hsing Hsieh, Chung-Cheng Wu, Yee-Chia Yeo
  • Publication number: 20020174616
    Abstract: A protective slip-proof cover for steps includes a rectangular pad having a first side formed with a downwardly extending apron, another side of the rectangular pad being formed with a plurality of first and second holes and a plurality of suckers each having a circular body, a tubular stem extending upwardly from a central top portion of the circular body, and a T-shaped pulling stem extending upwardly from a top portion of the circular body, the suckers being mounted under the pad with the tubular stem and the T-shaped pulling stem extending upwardly through the first and second holes respectively, a plurality of fixing caps each being inserted through a respective one of the second holes into the tubular stem thereby affixing the suckers on a bottom of the pad.
    Type: Application
    Filed: May 25, 2001
    Publication date: November 28, 2002
    Inventor: Wen-Li Huang