Patents by Inventor Wen-Liang Tseng

Wen-Liang Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220287182
    Abstract: An embedded component structure includes a board, an electronic component, and a dielectric material layer. The board has a through cavity. The board includes an insulating core layer and a conductive member. The insulating core layer has a first surface and a second surface opposite thereto. The through cavity penetrates the insulating core layer. The conductive member extends from a portion of the first surface along a portion of the side wall of the through cavity to a portion of the second surface. The electronic component includes an electrode. The electronic component is disposed in the through cavity. The dielectric material layer is at least filled in the through cavity. The connection circuit layer covers and contacts the conductive member and the electrode. A manufacturing method of an embedded component structure is also provided.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 8, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Yu-Hua Chen, Chun-Hsien Chien, Wen-Liang Yeh, Ra-Min Tain
  • Patent number: 11390520
    Abstract: In an embodiment, a system includes: a chamber; and a magnetic assembly contained within the chamber. The magnetic assembly comprises: an inner magnetic portion comprising first magnets; and an outer magnetic portion comprising second magnets. At least two adjacent magnets, of either the first magnets or the second magnets, have different vertical displacements, and the magnetic assembly is configured to rotate around an axis to generate an electromagnetic field that moves ions toward a target region within the chamber.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: July 19, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Tsez-Chong Tsai, Shuen-Liang Tseng, Szu-Hsien Lo, Po-Wen Yang, Ming-Jie He
  • Publication number: 20220223391
    Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the operations of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 14, 2022
    Inventors: Ming-Jie HE, Shawn YANG, Szu-Hsien LO, Shuen-Liang TSENG, Wen-Cheng CHENG, Chen-Fang CHUNG, Chia-Lin HSUEH, Kuo-Pin CHUANG
  • Patent number: 10890802
    Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: January 12, 2021
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Chao-Hsiung Chang, Lung-Hsin Chen, Wen-Liang Tseng, Pin-Chuan Chen, Hsin-Chiang Lin, Hou-Te Lin
  • Publication number: 20200373466
    Abstract: A light source device for a display includes light emitting diode packages. Each light emitting diode package includes a substrate, a first light emitting diode chip emitting a first beam of light, a second light emitting diode chip emitting a second beam of light, and a package layer including a wavelength converting material. Frequency bands of the first and second light beams both have a full width at half maximum of 30 nm to 40 nm. The wavelength converting material is excited by the first and second beams to generate a third beam of light, the frequency band of the third beam of light having a full width at half maximum of 10 nm to 50 nm. A display using the light source device is also disclosed.
    Type: Application
    Filed: September 12, 2019
    Publication date: November 26, 2020
    Inventors: HSIN-CHIANG LIN, HOU-TE LIN, CHAO-HSIUNG CHANG, LUNG-HSIN CHEN, PIN-CHUAN CHEN, WEN-LIANG TSENG
  • Publication number: 20200365783
    Abstract: A packaging structure of an LED comprises a substrate with first surface, a first electrode arranged on the first surface, at least one light emitting chip on the first electrode, and a packaging body arranged on the first surface to cover the light emitting chip. The first surface defines at least one groove, part of the package body is in the groove. By increasing the contact area between the substrate and the packaging body or mounting an embedded structure on the substrate, the firmness of the bond between the packaging body and the substrate is improved.
    Type: Application
    Filed: July 1, 2019
    Publication date: November 19, 2020
    Inventors: HOU-TE LIN, PIN-CHUAN CHEN, WEN-LIANG TSENG, LUNG-HSIN CHEN, HSIN-CHIANG LIN, CHAO-HSIUNG CHANG
  • Publication number: 20200326594
    Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.
    Type: Application
    Filed: November 12, 2019
    Publication date: October 15, 2020
    Inventors: CHAO-HSIUNG CHANG, LUNG-HSIN CHEN, WEN-LIANG TSENG, PIN-CHUAN CHEN, HSIN-CHIANG LIN, HOU-TE LIN
  • Patent number: 10705376
    Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: July 7, 2020
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Hsin-Chiang Lin, Chien-Cheng Kuo, Pin-Chuan Chen, Lung-Hsin Chen, Wen-Liang Tseng
  • Patent number: 10510931
    Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: December 17, 2019
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
    Inventors: Hou-Te Lin, Yi-Sen Lin, Chin-Fu Cheng, Wen-Liang Tseng, Pin-Chuan Chen
  • Publication number: 20190319173
    Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.
    Type: Application
    Filed: May 7, 2018
    Publication date: October 17, 2019
    Inventors: Hou-Te LIN, Yi-Sen LIN, Chin-Fu CHENG, Wen-Liang TSENG, Pin-Chuan CHEN
  • Patent number: 10222024
    Abstract: A light emitting device includes a light source and a lens. The lens includes a light emitting surface, a top surface, four edge surfaces, and a bottom surface. The light emitting surface includes a central recess and two convex regions connecting the central recess at opposite sides. The light emitting surface is symmetrical about the central recess. The lens further defines a receiving space in the bottom surface and four positioning pins on the bottom surface. The receiving space includes a light incident surface. The two convex regions of the light emitting surface and the light incident surface are non-spherical surfaces. A maximum distance, dn, between the light source and the light incident surface is larger than a maximum distance, Dm, between the light incident surface and the light emitting surface. The light emitting device provides a wide-angle light distribution.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: March 5, 2019
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Hsin-Chiang Lin, Lung-Hsin Chen, Wen-Liang Tseng
  • Publication number: 20190033659
    Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.
    Type: Application
    Filed: November 1, 2017
    Publication date: January 31, 2019
    Inventors: HSIN-CHIANG LIN, CHIEN-CHENG KUO, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • Publication number: 20190033658
    Abstract: A liquid crystal display module comprises a thin film transistor array substrate, a liquid crystal layer, a color filter substrate and a plurality of light emitting diode chips. The thin film transistor array substrate has a first surface and a second surface. A circuit structure is formed on the first surface. A plurality of thin film transistors is formed on the second surface and electrically connecting to the circuit structure. The liquid crystal layer faces the second surface. The liquid crystal layer is formed between the thin film transistor array substrate and the color filter substrate. The light emitting diode chips are adhered on the first surface and electrically connecting to the circuit structure. Each light emitting diode chip has a light emitting surface. Light emitted from the light emitting surfaces is incident on the first surface of the thin film transistor array substrate.
    Type: Application
    Filed: July 27, 2017
    Publication date: January 31, 2019
    Inventors: HSIN-CHIANG LIN, CHIEN-CHENG KUO, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • Patent number: 10133133
    Abstract: A liquid crystal display base includes a liquid crystal module, both a power circuit and a integration circuit, a electric device mounted on the power circuit. The liquid crystal module includes a TFT array substrate and a color filter substrate mounted on the TFT array substrate. The power circuit board mounted on the TFT array substrate. The TFT array substrate has a first surface and a second surface opposite to the first surface, a plurality of through holes extend through the first surface and the second surface, each through hole has equal inner diameter from the first surface to the second surface. the TFT array substrate 11 is made of glass, sapphire, ceramic, a plurality of conductive layers are in the plurality of through holes, both the electric device, the integration circuit and the power circuit board are coupled with the liquid crystal module.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: November 20, 2018
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC
    Inventors: Hsin-Chiang Lin, Chien-Cheng Kuo, Pin-Chuan Chen, Lung-Hsin Chen, Wen-Liang Tseng
  • Patent number: 9992566
    Abstract: A wireless joint includes a converter, a radio frequency (RF) device, and a connector. The converter realizes a conversion between an audio signal and a wireless signal. The RF device receives and transmits the wireless signal. The connector connects with a microphone body.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: June 5, 2018
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chun-Hung Lai, Wen-Liang Tseng, Meng-Feng Kuo, Chih-Chun Chang, Kuo-Chun Huang
  • Patent number: 9899587
    Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: February 20, 2018
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Yau-Tzu Jang, Yu-Liang Huang, Wen-Liang Tseng, Pin-Chuan Chen, Lung-Hsin Chen, Hsing-Fen Lo, Chao-Hsiung Chang, Che-Hsang Huang, Yu-Lun Hsieh
  • Patent number: 9842968
    Abstract: A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence. The N type semiconductor layer, the active layer, and the P type semiconductor layer are etched to define a plurality of recesses and a groove. An insulating layer to cover side surfaces of the recesses and the P type semiconductor layer is formed and a portion of the insulating layer is etched to define an opening to expose a top portion of the P type semiconductor layer. A pair of electrodes is formed and the LED die is cut along the groove to obtain an individual LED die.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: December 12, 2017
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin, Pin-Chuan Chen, Lung-Hsin Chen, Wen-Liang Tseng
  • Publication number: 20170301828
    Abstract: A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence. The N type semiconductor layer, the active layer, and the P type semiconductor layer are etched to define a plurality of recesses and a groove. An insulating layer to cover side surfaces of the recesses and the P type semiconductor layer is formed and a portion of the insulating layer is etched to define an opening to expose a top portion of the P type semiconductor layer. A pair of electrodes is formed and the LED die is cut along the groove to obtain an individual LED die.
    Type: Application
    Filed: April 10, 2017
    Publication date: October 19, 2017
    Inventors: CHAO-HSIUNG CHANG, HOU-TE LIN, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • Patent number: 9786642
    Abstract: A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: October 10, 2017
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Hou-Te Lin, Wen-Liang Tseng, Lung-Hsin Chen, Pin-Chuan Chen, Hsin-Chiang Lin, Chao-Hsiung Chang
  • Patent number: 9746162
    Abstract: A light emitting diode (LED) bulb includes a connecting body, a lamp cap located at a first end of the connecting body, a mounting base located at a second end of the connecting body opposite to the first end, a plurality of LED modules mounted on the mounting base and a sheath assembled to the second end of the connecting body. The sheath includes a first portion and a second portion detachably engaged with the first portion to cooperatively define an enclosed space enclosing the mounting base and the LED modules therein.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: August 29, 2017
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Lung-Hsin Chen, Wen-Liang Tseng