Abstract: An LED module includes a PCB with a first electrode and a second electrode formed thereon, an LED mounted on the PCB, a lens mounted on the PCB and covering the LED. The LED includes a base, an LED die mounted on the base, and a packaging layer arranged on the base and covering the LED die therein. The base is flat. The lens includes a bottom surface, a first light output surface extending from the bottom surface, a second light output surface extending upwardly from a central of the first light output surface and away from the bottom surface, and a reflecting surface recessing downwardly from a top end of the second light output surface and oriented towards the bottom surface. A chamber is defined in the bottom surface to receive the LED therein.

Abstract: An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.

Abstract: A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.

Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.

Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.

Abstract: An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allyltrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.

Abstract: A method of manufacturing a light emitting diode (LED) comprising: providing a porous carrier, a base disposed on the carrier and a plurality of light emitting elements mounted on the base, wherein the carrier defines a plurality of micro through-holes extending through a first face to a second face of the carrier, and the base has electrical structures formed thereon electrically connecting to the light emitting elements, respectively; providing a mold to receive the carrier therein and distributing a phosphor glue on the base to cover the light emitting elements, and the mold defining an air outlet communicated with the through-holes of the carrier; vacuuming the mold via the air outlet to flatten an outer face of the phosphor glue; heating the phosphor glue and removing the mold; and removing the carrier.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.

Abstract: A method for packaging an LED, includes steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to each pair of the electrodes; positioning an LED die on each anisotropic conductive paste and electrically connecting each LED die to each corresponding pair of the electrodes with the anisotropic conductive paste by hot compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages.

Abstract: An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle ? is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle ? is defined between the reflecting portion and the bottom surface. The angle ? is larger than the angle ?.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: A light emitting diode (LED) bulb includes a connecting body having a first end and a second end opposite to the first end, a mounting base located at a second end of the connecting body and a plurality of LED units mounted on the mounting base. The mounting base has a top face distant from the second end of the connecting body and an inclined lateral face located between the top face of the mounting base and the second end of the connecting body. The inclined lateral face of the mounting base extends downwardly and inwardly from a periphery of the top face of the mounting base towards the second end of the connecting body. The plurality of LED units mounted on the first top face and the inclined lateral face of the mounting base, respectively.

Abstract: A light emitting diode (LED) bulb includes a connecting body, a mounting base located on the connecting body and a plurality of LED modules mounted on the mounting base. The mounting base has a top face spaced from the connecting body and at least three surrounding walls. The top face of the mounting base orients toward a direction different that of each of the at least three surrounding walls. A lamp cover is secured to the connecting body and encloses the LED modules. An extension of the top face of the mounting base interests with the lamp cover at a point. A tangent line of the lamp cover through the point and the extension of the top face form an included angle which is less than 60 degrees. Furthermore, a center of the lamp cover is located above the top face.

Abstract: A light emitting diode (LED) bulb includes a connecting body, a lamp cap located at a first end of the connecting body, a mounting base located at a second end of the connecting body opposite to the first end, a plurality of LED modules mounted on the mounting base and a sheath assembled to the second end of the connecting body. The sheath includes a first portion and a second portion detachably engaged with the first portion to cooperatively define an enclosed space enclosing the mounting base and the LED modules therein.

Abstract: A method and an electronic device for communication quality improvement based on ambient noise sensing are provided for improving communication quality. The method includes: during a call, dynamically setting a noise reduction mode in response to the varying of an ambient noise amount of at least one audio signal received by the electronic device. The setting step includes: during the call, dynamically determining whether the ambient noise amount indicates the needs of the application of noise reduction. If the ambient noise amount indicates the needs of the application of noise reduction, then one of a plurality of noise reduction levels is selected according to the ambient noise amount, and the noise reduction mode is set according to the selected noise reduction level, wherein the noise reduction levels include at least two levels corresponding to two different amounts of noise reduction.

Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.

Abstract: A light-emitting diode includes a ceramic substrate, an electrode group setting on the substrate and co-fired with the ceramic substrate, an LED chip setting on the substrate and electrically connecting the electrode group. The electrode includes a first electrode and a second electrode spacing from the first electrode. The first electrode and the second electrode extend from a top surface of the substrate to a bottom surface of the substrate via side surfaces of the substrate. The light-emitting diode can be connected to a power source by the electrode group on the bottom surface of the substrate or by the electrode group on the side surfaces of the substrate.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.

Abstract: An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range.