Abstract: Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.

Abstract: A package structure of a compound semiconductor device comprises a thin conductive film with a pattern, a die, at least one metal wire or metal bump and a transparent encapsulation material. The die is mounted on the first surface of the thin conductive film, and is electrically connected to the thin conductive film through the metal wire or the metal bump. The transparent encapsulation material is overlaid on the first surface of the conductive film and the die. A second surface of the conductive film is not covered by the transparent encapsulation material, and is opposite the first surface.

Abstract: A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.

Abstract: This invention relates to a method for virtual bass synthesis. The low frequency signal is attained by applying a low pass filter to the original. In order to reduce the operations, process of down sampling the low frequency signal, moving the low frequency signal to a series of harmonics whose frequencies are integral times as large as the frequency of low frequency signals, and then up sampling them are provided. By means of psycho-acoustic theory, the weights of harmonics are attained and applied to the harmonics. Finally the weighted harmonics are combined to produce the bass signal. As the result, the virtual bass effect which is almost the same as the low frequency of the original audio signal can be accomplished. Because the harmonic signals are high frequency ones, the virtual effect can be made in the panel speakers or ordinary low-end speakers.

Abstract: A package structure of a light-emitting diode (LED) comprises a package carrier, an LED die mounted and electrically connected to the package carrier, a molding compound covering the package carrier and the LED die, and two electrodes disposed on opposite end portions of the molding component. A reflecting layer is overlaid on two side surfaces of the molding component facing the LED die, respectively. Thus, the rays emitted by the LED die are reflected by the reflecting layer and directed above the circuit surface of the LED die. Afterward, they pass through the molding compound to access the outside of the LED package. Each electrode has at least two surfaces vertical to each other, and is respectively electrically connected to a P-electrode and an N-electrode of the LED die.

Abstract: A method of fabricating an image sensor on a semiconductor substrate having a sensor array region is described. A first planar layer is formed on a semiconductor substrate. Then, a color filter array (CFA) is formed on the first planar layer. A second planar layer is formed on the color filter array. Thereafter, a plurality of U-lenses is formed on the second planar layer. A passivation is formed over the second planar layer and the U-lenses by performing a plasma-enhanced chemical vapor deposition (PECVD) process using TEOS gas. The passivation layer is formed under the conditions that include applying radio frequency power at a rating between 250W˜450W and supplying TEOS gas at a mass flow rate of about 150˜500 mg/m.

Abstract: A universal power measurement SoC includes an analog signal conditioning circuit, analog-to-digital converter circuit, memory and micro control unit. The analog signal conditioning circuit receives physical signals from a signal sensor and adjusts the polarities and amplitudes of the signals to produce suitable analog signals and gain status. The analog-to-digital converter circuit converts the adjusted analog signals into digital signals. The memory stores the pre-setup parameters of the power measurement. The micro control unit, according to users' choices, processes the converted digital signals with the gain status to produce the output signals of the power measurement.

Abstract: A universal power measurement SoC includes an analog signal conditioning circuit, analog-to-digital converter circuit, memory and micro control unit. The analog signal conditioning circuit receives physical signals from a signal sensor and adjusts the polarities and amplitudes of the signals to produce suitable analog signals and gain status. The analog-to-digital converter circuit converts the adjusted analog signals into digital signals. The memory stores the pre-setup parameters of the power measurement. The micro control unit, according to users' choices, processes the converted digital signals with the gain status to produce the output signals of the power measurement. The SoC can reduce the number of the needed devices, cost, and the production adjusting period for promoting the system functions, increase the stability, accuracy, and the flexibility of application, and simplify the procedure of adjusting and production.

Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

Abstract: A front-end signal-processing device having an automatic gain-control function used in the analog-to-digital conversion. The circuit comprises a buffer circuit, an amplifying/attenuating circuit, a pre-processing gain-adjusting circuit and an amplification/attenuation gain-adjusting circuit. In the front-end signal-processing device having an automatic gain-control function used in the analog-to-digital conversion, a set of gain-adjusting signals S1 and S2 are produced by hardware for controlling the amplification or attenuation gain of signals, thereby automatically adjusting the amplitude of the input signals. In addition, the microprocessor can select an appropriate restoring parameter according to the gain-adjusting signals to ensure that the numeral result conforms to the original input signal.

Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

Abstract: A front-end signal-processing device having an automatic gain-control function used in the analog-to-digital conversion. The circuit comprises a buffer circuit, an amplifying/attenuating circuit, a pre-processing gain-adjusting circuit and an amplification/attenuation gain-adjusting circuit. In the front-end signal-processing device having an automatic gain-control function used in the analog-to-digital conversion, a set of gain-adjusting signals S1 and S2 are produced by hardware for controlling the amplification or attenuation gain of signals, thereby automatically adjusting the amplitude of the input signals. In addition, the microprocessor can select an appropriate restoring parameter according to the gain-adjusting signals to ensure that the numeral result conforms to the original input signal.

Abstract: A photo sensing device uses surface-emitting LED as light emitter to increase responsive of light receiver and prevent the short circuit of connection wires, and the manufacturing method thereof. The light emitter is directly mounted on top front surface of an encapsulating epoxy enclosing a light receiver. The light emitted from backside of the light emitter passes through the encapsulating epoxy and is directly absorbed by the light receiver. The response is enhanced as compared with prior art.

Abstract: A method for tuning P-, I- and D-type controller which is used in combination or individually to control a variable y of a process in a feedback system, which comprises making the integrating (I) and derivative (D) unit of the controller inoperative; increasing the proportional control gain K until a desired oscillation is obtained; calculating the ultimate gain Ku and ultimate period Tu in accordance with the amplitude and period measured from the oscillation; and setting the parameters of the PID controller in dependence upon the Ku and Tu values, wherein the control signal U resulting from the controller gain K is restricted to a range from a lower limit Umin to an upper limit Umax to avoid the system being operated in an unstable condition. An apparatus suitable for performing the present method is also disclosed.