Abstract: Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.

Abstract: A top view light emitting device package and fabrication method thereof include a bilateral circuit is provided for emitting two far light fields with no requirement for multiple devices. Moreover, the top view light emitting device package of the disclosure also provides depressions and reflectors formed on the surfaces of the silicon substrate to enhance the reflective efficiency and fix a specific light field.

Abstract: A package structure includes a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first conductive layer, a second conductive layer and a die. The silicon substrate has a first surface and an opposite second surface. The first surface has a reflective opening, and the second surface has two electrode via holes connected to the reflective opening and a recess disposed outside the electrode via holes. The first insulating layer overlays the first surface, the second surface and the recess. The reflective layer is disposed on the reflective opening. The second insulating layer is disposed on the reflective layer. The first conductive layer is disposed on the second insulating layer. The second conductive layer is disposed on the second surface and inside the electrode via holes. The die is fixed inside the reflective opening and electrically connected to the first conductive layer.

Abstract: A method and an electronic device for communication quality improvement based on ambient noise sensing are provided for improving communication quality. The method includes: during a call, dynamically setting a noise reduction mode in response to the varying of an ambient noise amount of at least one audio signal received by the electronic device. The setting step includes: during the call, dynamically determining whether the ambient noise amount indicates the needs of the application of noise reduction. If the ambient noise amount indicates the needs of the application of noise reduction, then one of a plurality of noise reduction levels is selected according to the ambient noise amount, and the noise reduction mode is set according to the selected noise reduction level, wherein the noise reduction levels include at least two levels corresponding to two different amounts of noise reduction.

Abstract: A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode. The cap layer covers the light emitting diode die.

Abstract: This invention relates to a method for virtual bass synthesis. The low frequency signal is attained by applying a low pass filter to the original. In order to reduce the operations, process of down sampling the low frequency signal, moving the low frequency signal to a series of harmonics whose frequencies are integral times as large as the frequency of low frequency signals, and then up sampling them are provided. By means of psycho-acoustic theory, the weights of harmonics are attained and applied to the harmonics. Finally the weighted harmonics are combined to produce the bass signal. As the result, the virtual bass effect which is almost the same as the low frequency of the original audio signal can be accomplished. Because the harmonic signals are high frequency ones, the virtual effect can be made in the panel speakers or ordinary low-end speakers.

Abstract: A light-emitting diode device includes a frame, a light-emitting diode die, a fluorescent layer, a reflector, and a lens. The light-emitting diode die is disposed on the frame. The fluorescent layer is directly molded to cover the light-emitting diode die. The reflector is directly molded on the frame, surrounding the light-emitting diode die, and configured to direct light from the light-emitting die in a predetermined direction. The lens is directly molded within the reflector, covering the fluorescent layer.

Abstract: A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.

Abstract: A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.

Abstract: A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.

Abstract: Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.

Abstract: A compound semiconductor device package module structure includes a heat dissipation film, a dielectric layer, a plurality of compound semiconductor dies, means for mounting the compound semiconductor dies on the heat dissipation film, and a transparent encapsulation material. The dielectric layer includes a plurality of openings formed on the heat dissipation film. The compound semiconductor dies are placed on the heat dissipation film in the openings, and adjacent two compound semiconductor dies are separated by the dielectric layer. The transparent encapsulation material covers the compound semiconductor dies.

Abstract: A system and method for configuring LED BLU with high NTSC is provided in this invention by using algorithm to compute concentration of multiple phosphors. After the mixed with the LED, an LED BLU with high NTSC can be provided.

Abstract: A method and a system for configuring a high CRI LED is provided in this invention, by using an algorithm to compute which of at least two phosphors that can be mixed with the LED. A mixed-emitting spectrum can provide a high CRI white light at a predetermined color temperature.

Abstract: The invention discloses a method for fabricating a photoelectric device. A ceramic substrate is first provided, and then a first patterned electrode and a second patterned electrode are formed on and underneath the surface of the ceramic substrate. A plurality of photoelectric devices is sequentially connected to the first electrode layer with a wire solder or a eutectic joint method. The encapsulation materials cover the each photoelectric die to prevent damaged from the external force or environment. Cutting the ceramic substrate along the spaces between the photoelectric dies forms a plurality of independent package units.

Abstract: A package structure for light emitting diode devices comprises a substrate having a reflective cavity, a die mounted inside the reflective cavity, a reflective layer disposed on the surface of the reflective cavity, a plurality of electrodes disposed under the surface of the substrate which is opposite to the reflective cavity, and a dual brightness enhancement film overlaid on the reflective cavity. The dual brightness enhancement film efficiently reflects the polarized light that is generated from the die and is not in a transparent direction back to the reflective layer. Subsequently, this light is reflected from the reflective layer to the dual brightness enhancement film. The portions of the reflected light propagating in the same direction as the transparent direction will transmit through the package structure.

Abstract: A package structure for photoelectronic devices comprises a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first conductive layer, a second conductive layer and a die. The silicon substrate has a first surface and a second surface, wherein the first surface is opposed to the second surface. The first surface has a reflective opening, and the second surface has at least two electrode via holes connected to the reflective opening and a recess disposed outside the electrode via holes. The first insulating layer overlays the first surface, the second surface and the recesses. The reflective layer is disposed on the reflective opening. The second insulating layer is disposed on the reflective layer. The first conductive layer is disposed on the surface of the second insulating layer. The second conductive layer is disposed on the surface of the second surface and inside the electrode via holes.

Abstract: A package structure of a light-emitting diode (LED) comprises a package carrier, an LED die mounted and electrically connected to the package carrier, a molding compound covering the package carrier and the LED die, and two electrodes disposed on opposite end portions of the molding component. A reflecting layer is overlaid on two side surfaces of the molding component facing the LED die, respectively. Thus, the rays emitted by the LED die are reflected by the reflecting layer and directed above the circuit surface of the LED die. Afterward, they pass through the molding compound to access the outside of the LED package. Each electrode has at least two surfaces vertical to each other, and is respectively electrically connected to a P-electrode and an N-electrode of the LED die.