Abstract: A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs.

Abstract: An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.

Abstract: A surface profile measurement apparatus, which measures a surface profile of an object, includes a wavefront measurement unit, a driving unit and a rotation unit. The wavefront measurement unit has an image sensor and emits a detecting light. The driving unit has a plurality of stages for moving the object or the wavefront measurement unit. The rotation unit has a rotation axis, is disposed on one of the stages of the driving unit, and holds the object. When measuring the object, the rotation unit rotates the object and the image sensor simultaneously exposes and acquires a measurement data, formed by the detecting light reflected from the object. An alignment method of the surface profile measurement apparatus and an improved sub-aperture measurement data acquisition method are also disclosed.

Abstract: A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode. The cap layer covers the light emitting diode die.

Abstract: A method for diagnosis of diseases adopted on an electronic stethoscope which includes at least two sound receiving portions, a noise control portion, a processing portion, a data portion and an output portion. The method includes: first, the sound receiving portions receive sound signals issued from a patient's lungs included external noises; next, the sound signals are sent to the noise control portion which eliminates the external noise, and the processing portion to be overlapped and intensified; then characteristic values are retrieved from the sound signals to be compared with disease sound signal data in the data portion; finally the output portion outputs a diseases judgment result. Thus the electronic stethoscope can perform automatic interpretation of diseases to reduce human erroneous diagnostic judgment. Users also can get preliminary understanding of their body conditions when doctors are absent.

Abstract: In some aspects, message data is generated from a first representation of a message and a reference image. The message data is generated to hide the message such that generating a second representation of the message from the message data requires processing of a second image that is perceptually similar to the first image. In some examples, a degree to which the second representation of the message is perceptually similar to the first representation of the message is related to a degree to which the second image is perceptually similar to the first image.

Abstract: An LED (light emitting diode) module includes a circuit board and a plurality of LEDs mounted on the circuit board. The circuit board includes a support layer, an insulative layer and a conductive layer sequentially stacked on each other. The circuit board is embossed to form a plurality of pleats on top and bottom surfaces thereof, to thereby increase heat dissipation area of the circuit board.

Abstract: A light emitting diode package includes a substrate with a first metal layer, a second metal layer and an insulating layer between the first metal layer and the second metal layer. A cavity is defined in the insulating layer and the second metal layer. The second metal layer surrounding the cavity is divided into a first conductive portion and a second conductive portion. An LED chip is positioned inside the cavity and on an upper surface of the first metal layer. The LED chip has two electrodes electrically connected to the first conductive portion and the second conductive portion respectively. The cavity is filled with an encapsulation to cover the LED chip. A method for manufacturing the LED package is also disclosed.

Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.

Abstract: A method of manufacturing a semiconductor device having metal gate includes providing a substrate having a first transistor and a second transistor formed thereon, the first transistor having a first gate trench formed therein, forming a first work function metal layer in the first gate trench, forming a sacrificial masking layer in the first gate trench, removing a portion of the sacrificial masking layer to expose a portion of the first work function metal layer, removing the exposed first function metal layer to form a U-shaped work function metal layer in the first gate trench, and removing the sacrificial masking layer. The first transistor includes a first conductivity type and the second transistor includes a second conductivity type. The first conductivity type and the second conductivity type are complementary.

Abstract: An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allytrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.

Abstract: A cooling apparatus for server rack is disclosed, which is disposed above at least one server rack. The cooling apparatus for server rack includes a fan module disposed at a back end above the least one server rack, a heat exchanger module disposed at a front end above the least one server rack, and an air guide connecting the fan module and the heat exchanger module. A hot air exhausted from the back end of the least one server rack is extracted by the fan module and is sent to the heat exchanger module through the air guide, and the hot air is cooled by the heat exchanger module, and a cool air is exhausted from the front end of the least one server rack.

Abstract: This invention is directed to a food container comprising a lid and a base. The lid and base form three seals, including a locking seal, to prevent the leakage or spoilage of food during transport or temporary storage. Blades on the lid sealing edge and blades on the base sealing edge strengthen said edges, and further reinforce the seals formed between the lid and base. The lid and base, separately or when assembled, are stably stackable requiring a minimal amount of storage space.

Abstract: A planar lighting module comprises a substrate, at least one light guide device and a driver. A frame is located on the substrate for fastening the at least one light guide device and the driver. By manipulation and binding, the planar lighting module can be easily assembled or dismantled, no screws or welded joints are used, and it is also convenient to service.

Abstract: A stator for an electric motor has a laminated stator core 10 formed from a plurality of stacked laminations, and a stator winding formed from a plurality of coils 20 wound on bobbins 30. The stator core 10 has a plurality of teeth 40 which extend radially and alternately spaced between and connected to circumferentially extending yokes 50. The yokes and the teeth are separately formed with each yoke 50 being a stack of yoke laminations 12 and each tooth 40 being a stack of tooth laminations 14. The teeth 40 are inserted through the bobbins 30 and arranged in a cylindrical form with each tooth 40 extending radially. Yokes 50 are then fixed between radially outer ends 144 of adjacent teeth to complete the radially outer portion of the stator core. Each tooth 40 has a radial location surface 144b which contacts an inner surface of the adjacent yokes 50. The yokes 50 and teeth 40 are fixed together by welding the yokes 50 to the outer ends 144 of the teeth 40.

Abstract: A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages.

Abstract: A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.

Abstract: A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.

Abstract: An LED package includes a substrate; a plurality of LED units formed on the substrate; and a phosphor tape arranged on the LED units. Light from the LED units travels to an external environment through the phosphor tape. The phosphor tape has phosphor particles evenly distributed therein. A method for forming the LED package is also provided.