Abstract: The present disclosure relates to a method, a device and a storage medium for processing virus which can automatically distinguish which of processing mode is best for the current status of the electronic apparatus. The method includes: detecting a virus scan operation; in response to the virus scan operation, determining whether conditions (i) and (ii) are true, wherein the condition (i) is true when a time interval between a last time of processing virus using a first virus processing mode and the current time is larger than a preset interval, the condition (ii) is true when at least one of risk situations exist during a time period between the last time of processing virus using the first virus processing mode and the current time; if one of conditions (i) and (ii) being true, calling the first virus processing mode to scan files in the electronic apparatus.

Abstract: A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.

Abstract: A working fluid in cooperation with a solar thermal system comprises a heat conduction medium and a plurality of metal nano-particles mixed in the heat conduction medium. Each of the metal nano-particles includes a metal particle and a protection layer, and the protection layer is an oxide and covers the metal particle. A manufacturing method of metal nano-particles is also disclosed.

Abstract: A curable composition comprises the following: (A) a branched polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R7, a? to c?, e? and f to j are as defined in the specification.

Abstract: The present invention relates to a new use of citral for manufacturing a medicament for treating focal segmental glomerulosclerosis (FSGS). Particularly, the present invention discloses that citral is effective in alleviating symptoms of FSGS, including reducing glomerular epithelial hyperplasia lesions (EPHLs), peri-glomerular inflammation or glomerular hyalinosis or sclerosis, and also reducing proteinuria or hematuria or lowering serum urea nitrogen level or serum creatinine level in the subject.

Abstract: A multifunction socket device is connected to a main AC power and comprises a frame unit, at least one power outlet, a cover unit and a first illuminating unit. The multifunction socket device can provide power source and illumination device, which bring more convenience and options to modern lifestyle.

Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.

Abstract: The present disclosure discloses method and device for triggering operations via interface components. The method comprises: triggering movement of a floating window corresponding to an interface component by operating on the floating window; moving the floating window to a first region; triggering a release command to release the floating window in the first region; running the interface component corresponding to the floating window in accordance with the release command. The device comprises: a triggering module that triggers movement of a floating window corresponding to an interface component by operating on the floating window; a movement module that moves the floating window to a first region; a release module that triggers a release command to release the floating window in the first region; and a running module that runs the interface component corresponding to the floating window in accordance with the release command. The present disclosure greatly enhances operational convenience.

Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.

Abstract: An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allyltrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.

Abstract: A curable composition comprises the following: (A) a branched polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R7, a? to c?, e? and f to j are as defined in the specification.

Abstract: A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I?): (R12SiO2/2)a1(R23SiO1/2)b1(CH2CH2)e1; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1, R2 and R4 to R7 and a1, b1, e1 and f to j are as defined in the specification.

Abstract: A method of manufacturing a light emitting diode (LED) comprising: providing a porous carrier, a base disposed on the carrier and a plurality of light emitting elements mounted on the base, wherein the carrier defines a plurality of micro through-holes extending through a first face to a second face of the carrier, and the base has electrical structures formed thereon electrically connecting to the light emitting elements, respectively; providing a mold to receive the carrier therein and distributing a phosphor glue on the base to cover the light emitting elements, and the mold defining an air outlet communicated with the through-holes of the carrier; vacuuming the mold via the air outlet to flatten an outer face of the phosphor glue; heating the phosphor glue and removing the mold; and removing the carrier.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.

Abstract: A method for packaging an LED, includes steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to each pair of the electrodes; positioning an LED die on each anisotropic conductive paste and electrically connecting each LED die to each corresponding pair of the electrodes with the anisotropic conductive paste by hot compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages.

Abstract: An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle ? is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle ? is defined between the reflecting portion and the bottom surface. The angle ? is larger than the angle ?.

Abstract: An electronic label system includes a host and at least one electronic label. The host includes a first control unit for generating a text message, a first storage unit storing a graphic database, and a converting unit configured to convert the text message to a graphic message according to the graphic database. The electronic label is configured to communicate with the host for receiving the graphic message therefrom, and includes a display unit and a second control unit configured to control the display unit to display the graphic message.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: A curable organopolysiloxane composition comprises the following: (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups and having an average unit formula (I): (R12SiO2/2)a(R23SiO1/2)b(R3SiO3/2)c(SiO4/2)d(CH2CH2)e; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1 to R7 and a to j are as defined in the specification.

Abstract: A light emitting diode (LED) bulb includes a connecting body having a first end and a second end opposite to the first end, a mounting base located at a second end of the connecting body and a plurality of LED units mounted on the mounting base. The mounting base has a top face distant from the second end of the connecting body and an inclined lateral face located between the top face of the mounting base and the second end of the connecting body. The inclined lateral face of the mounting base extends downwardly and inwardly from a periphery of the top face of the mounting base towards the second end of the connecting body. The plurality of LED units mounted on the first top face and the inclined lateral face of the mounting base, respectively.