Abstract: A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members. The circuit members are spaced apart from one another in a current packaging process to increase a layer area. The assemble substrate thus fabricated meets the requirements for a packaging substrate of a large size, and has a high yield and low fabrication cost.

Abstract: A method of forming gates includes the following steps. Dummy gates are formed on a substrate. A spacer material is deposited to conformally cover the dummy gates. A removing process is performed to remove parts of the spacer material and the dummy gates, thereby forming spacers and recesses in the spacers.

Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

Abstract: An IoT system includes a computing module for controlling an integral function of the system and including an analysis unit and a machine learning unit. The analysis unit is capable of operational analysis and creating a predictive model and creating a predictive model according to the data analyzed. The machine learning unit has an algorithm function to create a corresponding learning model. An IoT module is electrically connected to the computing module to serve as an intermediate role. At least one detection unit is electrically connected to the IoT module and disposed in soil to detect data of environmental and soil conditions and sends the data detected to the computing module for subsequent analysis.

Abstract: A light detection and ranging system comprises an optical transmitter for beam scanning on a scan region, and receiving reflected light from the scan region; and an optical receiver for directing the reflected light for signal conversion. The optical transmitter includes a beam refractive unit including optical refractive devices, rotatably disposed about a rotation axis, for directing a collimated laser beam from a first optical path towards a direction depending on rotation angles of the optical refractive devices; and a motion unit for actuating relative motion of the optical refractive devices so as to perform beam scanning towards directions on the scan region. The optical receiver includes an off-axis reflective unit, disposed in the first optical path, for directing the reflected light towards a second optical path; and a light detection unit, disposed in the second optical path, for performing signal conversion on the reflected light.

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

Abstract: A light source device for a display includes light emitting diode packages. Each light emitting diode package includes a substrate, a first light emitting diode chip emitting a first beam of light, a second light emitting diode chip emitting a second beam of light, and a package layer including a wavelength converting material. Frequency bands of the first and second light beams both have a full width at half maximum of 30 nm to 40 nm. The wavelength converting material is excited by the first and second beams to generate a third beam of light, the frequency band of the third beam of light having a full width at half maximum of 10 nm to 50 nm. A display using the light source device is also disclosed.

Abstract: A packaging structure of an LED comprises a substrate with first surface, a first electrode arranged on the first surface, at least one light emitting chip on the first electrode, and a packaging body arranged on the first surface to cover the light emitting chip. The first surface defines at least one groove, part of the package body is in the groove. By increasing the contact area between the substrate and the packaging body or mounting an embedded structure on the substrate, the firmness of the bond between the packaging body and the substrate is improved.

Abstract: A semiconductor device includes a first semiconductor portion and a second semiconductor portion. The first semiconductor portion provides a plurality of memory components, including a first substrate layer, a plurality of first interconnect conductive layers, a plurality of first conductive vias, and a plurality of first conductive contacts. The first conductive contacts electrically connect to the first conductive vias, and the first conductive contacts in combination with the first conductive vias are formed on a top first interconnect conductive layer of the first interconnect conductive layers. The second semiconductor portion provides a control circuit, including a second substrate layer and a plurality of second interconnect conductive layers.

Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

Abstract: A multiple rhombic dodecahedron puzzle includes a plurality of wooden puzzles arranged in a multiple rhombic dodecahedron. The multiple rhombic dodecahedron is equivalent to a cube formed by a plurality of rhombic dodecahedrons connecting to each other. Each of the wooden puzzles includes two unit elements. The two unit elements are connected to each other and are the same others. Each of the two unit elements has a plurality of surfaces. Each of the surfaces has a diamond shape or a triangular shape. Two of the surfaces which in the triangular shape are connected to each other in order to form a concave shape.

Abstract: A method of forming gates includes the following steps. Dummy gates are formed on a substrate. A spacer material is deposited to conformally cover the dummy gates. A removing process is performed to remove parts of the spacer material and the dummy gates, thereby forming spacers and recesses in the spacers.

Abstract: A multiple rhombic dodecahedron puzzle includes a plurality of wooden puzzles arranged in a multiple rhombic dodecahedron. The multiple rhombic dodecahedron is equivalent to a cube formed by a plurality of rhombic dodecahedrons connecting to each other. Each of the wooden puzzles includes two unit elements. The two unit elements are connected to each other and are the same others. Each of the two unit elements has a plurality of surfaces. Each of the surfaces has a diamond shape or a triangular shape. Two of the surfaces which in the triangular shape are connected to each other in order to form a concave shape, and the surfaces are surrounded to form a closed space.

Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.

Abstract: A substrate structure includes a glass substrate, a first circuit layer, a second circuit layer, and at least one conductive region. The glass substrate has a first surface and a second surface opposing the first surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The conductive region includes a plurality of conductive micro vias. The conductive micro vias penetrate through the glass substrate. The conductive micro vias are electrically connected to the first circuit layer and the second circuit layer, and the conductive micro vias have a via size of 2 ?m to 10 ?m.

Abstract: The available delivery capability (ADC) of a power distribution network with respect to a power transaction is evaluated in real-time. The power transaction involves simultaneous power deliveries from power sources in a source area to loads in a sink area. First, a list of contingencies are ranked in the power distribution network with respect to static security constraints to obtain a subset of top-ranked contingencies. For each top-ranked contingency in the subset, a representation of the power transaction in a steady state of the power distribution network, in a form of parameterized three-phase power flow equations, is solved to obtain a corresponding power delivery capability (PDC) and a corresponding binding constraint among the static security constraints. The reliability of the power transaction in the power distribution network is then evaluated based on, at least in part, a first contingency PDC which is a smallest PDC among obtained corresponding PDCs.

Abstract: A carrier structure including a glass substrate, a buffer layer, and an inner circuit layer is provided. The glass substrate has a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate. The buffer layer is disposed on the first surface and the second surface of the glass substrate. The inner circuit layer is disposed on the buffer layer and in the through hole of the glass substrate. The inner circuit layer exposes a part of the buffer layer.

Abstract: A carrier structure including a glass substrate, a buffer layer, and an inner circuit layer is provided. The glass substrate has a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate. The buffer layer is disposed on the first surface and the second surface of the glass substrate. The inner circuit layer is disposed on the buffer layer and in the through hole of the glass substrate. The inner circuit layer exposes a part of the buffer layer.

Abstract: An inhibitor of a wild type and Y641F mutant of human histone methyltransferase EZH2 is provided herein. Particularly, the inhibitor is a compound represented by formula (I) or a pharmaceutically acceptable salt thereof. The inhibitor can be used to treat a cancer or precancerous condition related to EZH2 activity.

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.