Abstract: An embedded component structure including a circuit board, an electronic component, a dielectric layer and a connection circuit layer and a manufacturing method thereof is provided. The circuit board has a through hole and includes a core layer, a first circuit layer, and a second circuit layer. The first circuit layer and the second circuit layer are disposed on the core layer. The through hole penetrates the first circuit layer and the core layer. The electronic component including a plurality of connection pads is disposed within the through hole where the dielectric layer is filled in. The Young's modulus of the core layer is greater than the Young's modulus of the dielectric layer. The connection circuit layer covers and contacts a first electrical connection surface of the first circuit layer and at least one of a second electrical connection surface of each of the connection pads. A manufacturing method of an embedded component structure is also provided.

Abstract: A circuit carrier board includes a first build-up layer structure, a substrate, an adhesive layer, and a conductive structure. The first build-up layer includes a plurality of first dielectric layers and a plurality of first circuit layers original stacked. The substrate includes a base and a second build-up layer structure disposed on the base. The second build-up layer structure includes a plurality of second dielectric layers and a plurality of second circuit layer original stacked. A top most layer of the second circuit layers is exposed outside of the second dielectric layers. The conductive structure penetrates through the first dielectric layers, the first circuit layers and the adhesive layer, and contacts with the top most layer of the second circuit layers. The conductive structure electrical connects the first circuit layers to the second circuit layers. A manufacturing method of the circuit carrier board is also provided.

Abstract: A multiple rhombic dodecahedron puzzle includes a plurality of wooden puzzles arranged in a multiple rhombic dodecahedron. The multiple rhombic dodecahedron is equivalent to a cube formed by a plurality of rhombic dodecahedrons connecting to each other. Each of the wooden puzzles includes two unit elements. The two unit elements are connected to each other and are the same others. Each of the two unit elements has a plurality of surfaces. Each of the surfaces has a diamond shape or a triangular shape. Two of the surfaces which in the triangular shape are connected to each other in order to form a concave shape, and the surfaces are surrounded to form a closed space.

Abstract: An inhibitor of a wild type and Y641 F mutant of human histone methyltransferase EZH2 is provided herein. Particularly, the inhibitor is a compound represented by formula (I) or a pharmaceutically acceptable salt thereof. The inhibitor can be used to treat a cancer or precancerous condition related to EZH2 activity.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region; removing part of the first fin-shaped structure to forma first trench; forming a dielectric layer in the first trench, wherein the dielectric layer comprises silicon oxycarbonitride (SiOCN); and planarizing the dielectric layer to form a first single diffusion break (SDB) structure.

Abstract: A package structure includes a substrate, a metal-insulator-metal capacitor, a circuit redistribution structure, and a chip. The metal-insulator-metal capacitor is disposed over the substrate and includes a first electrode, a second electrode, and an insulating layer. The circuit redistribution structure is disposed over the metal-insulator-metal capacitor and includes a first circuit redistribution layer and a second circuit redistribution layer. The first circuit redistribution layer includes a first wire electrically connected to the first electrode and a second wire electrically connected to the second electrode. The second circuit redistribution layer is disposed on the first circuit redistribution layer and includes a third wire electrically connected to the first wire and a fourth wire electrically connected to the second wire. The chip is disposed over the circuit redistribution structure and electrically connected to the third wire and the fourth wire.

Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.

Abstract: A laser radar device comprises a laser projecting system and a laser radar detecting system. The laser projecting system comprises a laser diode; and a light source orientation adjustment unit comprising a collimating lens and a Powell lens to modulate the angle at which the first incident laser beam is projected onto an object. The laser radar detecting system comprises at least two laser radar detection units disposed in the horizontal direction and vertical direction of the object, respectively. The laser radar detection units each comprise a wedge-shaped lens, an aspherical lens system and an optical detector. By designing optical parameters of the wedge-shaped lens and stacking the laser radar detection units in the horizontal direction and vertical direction, it is feasible to facilitate overall device manufacturing and processing, meet R&D needs, and adjust an optical system in its entirety easily.

Abstract: An electric motor for a blower and the like has a commutator and a brush assembly for making electrical contact with the commutator. The brush assembly includes a brush holder and a brush slidably mounted to the brush holder. The brush holder includes a brush holder plate and a side portion extending from the brush holder plate. The brush is arc-shaped and includes a first surface contacting the brush holder plate and a second surface contacting the side portion of the brush holder. The side portion of the brush holder has a number of ribs contacting the second surface of the brush.

Abstract: A fluid generating device and an electric apparatus utilizing the fluid generating device are provided. The fluid generating device includes a motor and an impeller driven by the motor. The motor is a single phase direct current brushless motor which includes a stator and a rotor. The stator includes a stator core and a stator winding. The stator core includes an outer ring portion, teeth extending inwardly from the outer ring portion, a pole shoe formed at the tooth. Slot openings are formed between the pole shoes. The rotor is received in a receiving chamber defined by the pole shoes. Inner surfaces of the pole shoes and the rotor form therebetween a substantially even air gap. The presence of even air gap can reduce the cogging torque of the motor, thus reducing the startup current and noise of the motor.

Abstract: An optical wavefront testing system includes a light source, an image capturing unit and a processing unit. The image capturing unit includes a lens array and a sensor module that is configured to detect light rays passing through an optical element and the lens array. The processing unit controls the sensor module to detect the light rays under a plurality exposure conditions for generating a plurality of images each including a plurality of light spots, obtains a plurality of light spot datasets corresponding to the light spots and each including a plurality of pixel coordinate sets and a plurality of pixel values, and obtains wavefront information associated with the light spots based on the light spot datasets of at least two of the images.

Abstract: A method for adjusting the adaptive screen-refresh rate and a device thereof are provided. The method for adjusting the adaptive screen-refresh rate includes the following steps: determining a first screen-refresh rate set by the display source; and based on the first screen-refresh rate, setting a refresh rate used by a displaying module for displaying the picture or frame on a displaying screen periodically.

Abstract: An image focus alignment structure includes a base, a lens barrel, a first sealant layer and a second sealant layer. The base has a first installation portion and a second installation portion. The lens barrel is disposed on the base. The first sealant layer is for fixing a partial barrel body of the lens barrel on the first installation portion. The second sealant layer is for fixing another partial barrel body of the lens barrel on the second installation portion.

Abstract: A hexagonal prismatic packing puzzle is provided, which includes 18 different shapes of puzzles. Each of the puzzles is composed of a plurality of unit components and the puzzles can be pieced together into a hexagonal prism. The unit components are selected from a group consisting of a first unit component and a second unit component. The volume of the first unit component is larger than that of the second unit component. The packing puzzle does not have an only solution or a specific solution. A user may develop and improve the sense of space and the cognitive of geometric figures thereof. Further, the user may train ability to think in multiple ways and achieve edutainment in the process of thinking.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a first gate structure and a second gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the first gate structure and the second gate structure; transforming the first gate structure and the second gate structure into a first metal gate and a second metal gate; forming a hard mask on the first metal gate and the second metal gate; removing part of the hard mask, the second metal gate, and part of the fin-shaped structure to form a trench; and forming a dielectric layer into the trench to form a single diffusion break (SDB) structure.

Abstract: A method for fabricating a semiconductor structure includes forming a plurality of mandrels over a substrate, wherein the substrate comprises a semiconductor substrate as a base. Then, a first dielectric layer is formed to cover on a predetermined mandrel of the mandrels. A second dielectric layer is formed over the substrate to cover the mandrels. The mandrels are removed, wherein a remaining portion of the first dielectric layer and the second dielectric layer at a sidewall of the mandrels remains on the substrate. An anisotropic etching process is performed over the substrate until a top portion of the semiconductor substrate is etched to form a plurality of fins corresponding to the remaining portion of the first dielectric layer and the second dielectric layer.

Abstract: An invisible light blocking structure includes a first transparent substrate, a metal layer, a transparent protecting layer and an invisible light blocking unit. The first transparent substrate has a first bottom side and a first upper side. The metal layer is disposed on the first bottom side and has a first metal side facing away from the first transparent substrate. The first upper side faces away from the metal layer. The transparent protecting layer is disposed on the first metal side. The transparent protecting layer has a first protecting side facing away from the first transparent substrate. The invisible light blocking unit is disposed on at least one of a first protecting side and the first upper side. The invisible light blocking unit has cesium tungstate.

Abstract: A light detection and ranging system comprises an optical transmitter for beam scanning on a scan region, and receiving reflected light from the scan region; and an optical receiver for directing the reflected light for signal conversion. The optical transmitter includes a beam refractive unit including optical refractive devices, rotatably disposed about a rotation axis, for directing a collimated laser beam from a first optical path towards a direction depending on rotation angles of the optical refractive devices; and a motion unit for actuating relative motion of the optical refractive devices so as to perform beam scanning towards directions on the scan region. The optical receiver includes an off-axis reflective unit, disposed in the first optical path, for directing the reflected light towards a second optical path; and a light detection unit, disposed in the second optical path, for performing signal conversion on the reflected light.

Abstract: The prevent invention provides a lens focusing apparatus. The lens focusing apparatus comprises a lens holding module for clamping at least one lens to be tested, a chart display module and a focal length shortening module. The chart display module includes a frame assembly, a first chart display and a plurality of second chart displays disposed on the frame assembly. Each second chart display is inclined at a first predetermined angle relative to the first chart display. The focal length shortening module includes a first focal length shortening device and a plurality of second focal length shortening devices. The first focal length shortening device is disposed between the at least one lens and the first chart display, and each second focal length shortening device is disposed between the at least one lens and the corresponding second chart display.

Abstract: An optical wavefront testing system includes a light source, an image capturing unit and a processing unit. The image capturing unit includes a lens array and a sensor module that is configured to detect light rays passing through an optical element and the lens array. The processing unit controls the sensor module to detect the light rays under a plurality exposure conditions for generating a plurality of images each including a plurality of light spots, obtains a plurality of light spot datasets corresponding to the light spots and each including a plurality of pixel coordinate sets and a plurality of pixel values, and obtains wavefront information associated with the light spots based on the light spot datasets of at least two of the images.