Abstract: Plasma modifications of catalyst supports before and after impregnation of metal precursors improve the activity, selectivity and stability of catalysts, e.g. Ni catalysts for benzene hydrogenation and Pd catalysts for selective hydrogenation of acetylene. Plasma modification of the support before impregnation is slightly more effective than the plasma modification after impregnation. However, plasma modifications after impregnation increase the stability and selectivity of catalysts more effectively. The economic benefit of much improved stability of Ni catalysts for hydrogenation of benzene and the enhanced activity and selectivity of Pd catalysts for acetylene hydrogenation, e.g., is significant. Similar benefits for various catalysts and other industrial processes via RF plasma techniques are expected.

Abstract: A method for treating a copper surface of a semiconductor device provides exposing the copper surface to a citric acid solution after the surface is formed using CMP (chemical mechanical polishing) or other methods. The citric acid treatment may take place during a cleaning operation that takes place in a wafer scrubber, or subsequent to such an operation. The citric acid treatment removes copper oxides that form on copper surfaces exposed to the environment and prevents hillock formation during subsequent high temperature operations. The copper surface is then annealed and the annealing followed by an NH3 plasma treatment which again removes any copper oxides that may be present. The NH3 plasma operation roughens exposed surfaces improving the adhesion of subsequently-formed films such as a dielectric film preferably formed in-situ with the NH3 plasma treatment. The subsequently-formed film is formed over an oxide-free, hillock-free copper surface.

Abstract: A disc box includes a base, a securing member and a key member. The base has a lid and a body, which has a lateral side connected to that of the lid. The lid and the body include latching portions opposite to each other and key-reception portions adjacent to the respective latching portions. The latching portions are formed at an internal edge of the lid and the body respectively. The securing member is received in the latching portions for locking the lid and the body together so that the disc box is burglarproof. The key member is arranged inside the key-reception portions in order to reject the securing member that is clamped in the respective latching portion in advance. When the key member is drawn out, the securing member can be removed out at the same time.

Abstract: An optical disc accommodating case has a bottom cover, an upper lid and a connecting member. The connecting member has two lateral edges opposed to each other. The bottom cover and the upper lid are respectively and pivotally assembled onto the two lateral edges of the connecting member. The bottom cover, the upper lid and the connecting member are formed separately and then assembled together. As such, the optical disc accommodating case cannot be twisted or deformed, thereby ensuring that the position of a retaining base of the bottom cover is precise, and that the optical disc is capable of being installed on the bottom cover smoothly. Therefore, the efficiency of the optical disc automatic packing process is improved, causing the cost of the optical disc automatic packing process to be lowered.

Abstract: A disc box includes a base, a securing member and a key member. The base has a lid and a body, which has a lateral side connected to that of the lid. The lid and the body include latching portions opposite to each other and key-reception portions adjacent to the respective latching portions. The latching portions are formed at an internal edge of the lid and the body respectively. The securing member is received in the latching portions for locking the lid and the body together so that the disc box is burglarproof. The key member is arranged inside the key-reception portions in order to reject the securing member that is clamped in the respective latching portion in advance. When the key member is drawn out, the securing member can be removed out at the same time.

Abstract: A high-efficiency matrix-type LED device comprises an epitaxial wafer on which a plurality of independently insulated LEDs are formed by a method of manufacturing integrated circuits; and a conducting line mounted on each one of the LEDs by an evaporation method for forming a large-sized matrix-type LED unit capable of increasing brightness, simplifying manufacturing procedure, and saving manufacturing cost effectively. In addition, a sub-mount having a two-way Zener diode embedded therein is applied to the matrix-type LED unit. By mounting the matrix-type LED unit on the sub-mount, the two-way Zener diode can protect the LEDs against damage from electrostatic discharge (ESD) so as to increase lifetime of LEDs.

Abstract: The invention provides a complementary color detection device receiving a light source and outputting a complementary color reading thereof, comprising a filter extracting a red, green and blue light component from the light source; and a detector receiving the red green and blue light components and outputting a first, second and third reading respectively, wherein the complementary color reading is a combination of the first, second and third readings, and each of the first, second and third readings is a voltage difference between a first and second terminal of a light detection device.

Abstract: A disk retaining structure, disposed inside a disk box and adapted to hold a disk, comprises a flat base disposed on a central part of the disk box; a pair of finger strips integrally formed at a central part of the flat base and each of the finger strips can be bent relative to the flat base. Two retaining pieces are respectively disposed adjacent to two upper edges of two outside surfaces of the finger strips and each of them has a flange at a bottom edge of a free end thereof. Two supporting pieces are respectively disposed adjacent to two lower edges of the outside surfaces of the finger strips. A buckling structure is provided between the two finger strips. When the finger strips are pinched, a disk can be conveniently placed horizontally on the retaining structure.

Abstract: A LED-based light emitting device having integrated rectifier circuit driven directly by an AC voltage and a related fabrication method is provided herein. The light emitting mainly contains a lower substrate and an upper substrate. The lower substrate has a built-in rectifier circuit and appropriate electrical contacts of the rectifier circuit are exposed on the top surface of the lower substrate. The upper substrate contains multiple LEDs arranged in an N×M array and the LEDs are all electrically insulated from each other. Metallic plating techniques are applied to establish electrical connection between these LEDs so that they jointly form a circuit matching the rectifier circuit on the lower substrate. The two substrates are faced towards each other and metallic bumps are applied to connect the LED circuit on the upper substrate to the rectifier circuit on the lower substrate, completing a fully function light emitting device.

Abstract: A method for treating a copper surface of a semiconductor device provides exposing the copper surface to a citric acid solution after the surface is formed using CMP (chemical mechanical polishing) or other methods. The citric acid treatment may take place during a cleaning operation that takes place in a wafer scrubber, or subsequent to such an operation. The citric acid treatment removes copper oxides that form on copper surfaces exposed to the environment and prevents hillock formation during subsequent high temperature operations. The copper surface is then annealed and the annealing followed by an NH3 plasma treatment which again removes any copper oxides that may be present. The NH3 plasma operation roughens exposed surfaces improving the adhesion of subsequently-formed films such as a dielectric film preferably formed in-situ with the NH3 plasma treatment. The subsequently-formed film is formed over an oxide-free, hillock-free copper surface.

Abstract: A cooling/heating fan apparatus includes a protective shade, a fan motor having a propeller shaft extended into the protective shade, an impeller mounted on a distal end of the propeller shaft, at least one porous ceramic carrier mounted on the propeller shaft and located between the fan motor and the impeller, wherein the porous ceramic carrier has a plurality of through holes each having a surface provided with an electro-thermal plating film layer. Thus, the air from the ambient environment is heated by the electro-thermal plating film layer quickly, thereby enhancing the heating efficiency of the fan apparatus.

Abstract: A method of fabricating a copper interconnect on a substrate is disclosed in which the interconnect and substrate are subjected to a low temperature anneal subsequent to polarization of the interconnect and prior to deposition of an overlying dielectric layer. The low temperature anneal inhibits the formation of hillocks in the copper material during subsequent high temperature deposition of the dielectric layer. Hillocks can protrude through passivation layer, thus causing shorts within the connections of the semiconductor devices formed on the substrate. In one example, the interconnect and substrate are annealed at a temperature of about 200 ° C. for a period of about 180 seconds in a forming gas environment comprising hydrogen (5 parts per hundred) and nitrogen (95 parts per hundred).

Abstract: A SAW device includes: a SAW chip having a piezoelectric substrate and transmitting and receiving transducers; a circuit board formed with conductive inner contacts, each of which is connected electrically to a respective one of the transmitting and receiving transducers; a first adhesive-confining curb interconnecting the circuit board and the transmitting and receiving transducers and cooperating with the circuit board and the SAW chip to define an enclosed cavity thereamong; a second adhesive-confining curb surrounding the first adhesive-confining curb to define a sealing space therebetween; an adhesive body filling the sealing space; and a molding compound covering the SAW chip and connected sealingly to the second adhesive-confining curb.

Abstract: A disk case has a top case, a bottom case pivotally connected to the top case, and an engaging base located on the bottom case for hooking a compact disk therein. The bottom case is pivotally connected to the top case. The engaging base is located on the bottom case; moreover, the engaging base has a supporting plate located on the bottom case, an engaging body protruding from the top surface of the supporting plate and defining a plurality of grooves formed therein and a plurality of hooking portions respectively located beside the corresponding grooves of the engaging body.

Abstract: A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 to 100 KPa.

Abstract: A method of smoothening a dielectric layer. First, a substrate is provided. Next, a dielectric layer is formed on the semiconductor substrate. Finally, the dielectric layer is smoothened by a plasma treatment employing a silane based gas and a nitrogen based gas.

Abstract: The present invention discloses a shooting mechanism of a shot repeater toy, such as an L-shape gun body, comprising a target platform disposed on one side, a trigger disposed on another side of a handle and a magazine disposed at the bottom of the target platform for shooting bullets in succession. Pulling the trigger can start a poking unit in the target platform to successively shoot bullets, and thus constituting a toy gun for shooting bullets in succession.

Abstract: The present invention discloses a shooting mechanism of a shot repeater toy, such as an L-shape gun body, comprising a target platform disposed on one side, a trigger disposed on another side of a handle and a magazine disposed at the bottom of the target platform for shooting bullets in succession. Pulling the trigger can start a poking unit in the target platform to successively shoot bullets, and thus constituting a toy gun for shooting bullets in succession.

Abstract: A discrete circuit component is made from a substrate with the first and second surfaces thereof each having a corresponding matrix of electrically conductive segments. A plated through-hole connects each of the conductive segments of each the first and second conductive segments electrically. The through-hole is first clogged and then subsequently cleared of clogging in the fabrication stages.