Patents by Inventor Wen Neng Liao

Wen Neng Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210317844
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 14, 2021
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20210317839
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one flow inlet. The impeller assembled in the housing and rotating about an axial direction includes a hub and a plurality blades disposed around the hub. The flow inlet is located in the axial direction and faces the hub. Each of the blades has a wing tab next to the flow inlet, and the wing tab extends from a main surface of the blade to another blade. The wing tab has an inclined surface facing toward a periphery of the flow inlet along a radial direction of the impeller.
    Type: Application
    Filed: April 5, 2021
    Publication date: October 14, 2021
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Jau-Han Ke, Kuang-Hua Lin
  • Publication number: 20210321533
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.
    Type: Application
    Filed: March 30, 2021
    Publication date: October 14, 2021
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
  • Patent number: 11119280
    Abstract: Disclosed are grating couplers having a high coupling efficiency for optical communications. In one embodiment, an apparatus for optical coupling is disclosed. The apparatus includes: a substrate; a grating coupler comprising a plurality of coupling gratings over the substrate, wherein each of the plurality of coupling gratings extends in a first lateral direction and has a cross-section having a middle-raised shape in a second lateral direction, wherein the first and second lateral directions are parallel to a surface of the substrate and perpendicular to each other in a grating plane; and a cladding layer comprising an optical medium, wherein the cladding layer is filled in over the grating coupler.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: September 14, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng-Wei Kuo, Lan-Chou Cho, Huan-Neng Chen, Chewn-Pu Jou, Wen-Shiang Liao
  • Publication number: 20210215170
    Abstract: A heat dissipation fan including a housing, a hub, and a plurality of blades is provided. The hub is rotatably disposed in the housing. The blades are disposed at a surrounding edge of the hub to be rotated with the hub. When the heat dissipation fan is operated, at least one flow path is formed by two adjacent blades, and the flow path has a reduction section away from the hub.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 15, 2021
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wei-Chin Chen, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20210207898
    Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.
    Type: Application
    Filed: March 24, 2021
    Publication date: July 8, 2021
    Applicant: Acer Incorporated
    Inventors: Cheng-Yu Cheng, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 11048309
    Abstract: A heat dissipation module including a first fan and a second fan is provided. The first fan has a first hub and a plurality of first fan blades disposed on the first hub. The second fan has a second hub and a plurality of second fan blades disposed on the second hub. Herein the first hub and the second hub are movably connected to each other in an axial direction such that the first fan and the second fan coincide or are separated from each other.
    Type: Grant
    Filed: June 29, 2019
    Date of Patent: June 29, 2021
    Assignee: Acer Incorporated
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 11035378
    Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: June 15, 2021
    Assignee: Acer Incorporated
    Inventors: Jau-Han Ke, Shun-Ta Yu, Cheng-Yu Cheng, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20210136949
    Abstract: A remote heat exchanging module is configured to dissipate heat of a heat source and includes a first heat conduction member, a second heat conduction member, and a heat dissipation member. The first heat conduction member includes a first metallic layer in thermal contact with the heat source, a second metallic layer including a first end and a second end opposite to each other, and a graphene layer located between the first and the second metallic layers. The first end is in thermal contact with the second metallic layer. The heat dissipation member is in thermal contact with the second end. Heat generated by the heat source is transferred to the second end sequentially through the first heat conduction member and the first end and is dissipated out of the remote heat exchanging module through the heat dissipation member. A composite thin-layered heat conduction structure is also provided.
    Type: Application
    Filed: October 28, 2020
    Publication date: May 6, 2021
    Applicant: Acer Incorporated
    Inventors: Kuang-Hua Lin, Wen-Neng Liao
  • Patent number: 10996006
    Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: May 4, 2021
    Assignee: Acer Incorporated
    Inventors: Cheng-Yu Cheng, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 10990137
    Abstract: A hinge mechanism is provided. The hinge mechanism includes a base, a magnetic assembly, a torque assembly, and a calibration component. The magnetic assembly is disposed in the base. The torque assembly is connected to the base, and includes a substrate, a first cylinder, and a second cylinder. The substrate is disposed in the base. The first cylinder penetrates the substrate, and is rotatable relative to the substrate. The second cylinder penetrates the substrate, and is rotatable relative to the substrate and the first cylinder. The calibration component is disposed between the magnetic assembly and the torque assembly, and abuts an inner wall of the first cylinder, and an inner wall of the second cylinder.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 27, 2021
    Assignee: ACER INCORPORATED
    Inventors: Yu-Chin Huang, Hsueh-Chih Peng, Wen-Chieh Tai, Wen-Neng Liao, Kuang-Hua Lin
  • Patent number: 10963018
    Abstract: A shaft structure and an electronic device using the same are provided. The shaft structure includes a friction fixing member, a friction rotating member, a latch and a magnetic module. The friction fixture has a fixed wall. The friction rotating member has an elastic wall. The friction rotating member is inserted into the friction fixing member. The latch is inserted into the friction rotating member and pushed against the inner side of the elastic wall so that the elastic wall is expanded to push against the fixed wall of the friction fixing member. The magnetic module is configured to provide a magnetic repulsive force to the latch to push the latch against the elastic wall.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: March 30, 2021
    Assignee: ACER INCORPORATED
    Inventors: Yu-Chin Huang, Wen-Neng Liao
  • Publication number: 20210079927
    Abstract: An axial flow fan includes a hub and a plurality of fan sets disposed around the hub. The hub rotates around a center axis and has a positive pressure side and a negative pressure side opposite to each other. Each of the fan sets includes at least two blades, and each blade has a wind inlet end, a wind outlet end opposite to the wind inlet end, a negative pressure surface, and a positive pressure surface opposite to the negative pressure surface. The wind outlet end of one of the adjacent two blades corresponds to the wind inlet end of the other one of the adjacent two blades. A gap is provided between the negative pressure surface of one of the adjacent two blades and the positive pressure surface of the other one of the adjacent two blades.
    Type: Application
    Filed: February 20, 2020
    Publication date: March 18, 2021
    Applicant: Acer Incorporated
    Inventors: Kuang-Hua Lin, Tsung-Ting Chen, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 10928869
    Abstract: A heat dissipation module including a chamber, a first cooling member, and a barrier part is provided. The chamber has an accommodating space, at least one inlet, and at least one outlet. The at least one inlet is disposed in a first side wall of the chamber and communicates with the accommodating space. The at least one outlet is disposed in a second side wall of the chamber away from the at least one inlet and communicates with the accommodating space. The first cooling member is disposed in the accommodating space. The first cooling member has a guiding surface which extends obliquely upward. The barrier part is disposed outside the guiding surface of the first cooling member and has at least one through hole.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: February 23, 2021
    Assignee: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Wei-Chin Chen, Jau-Han Ke
  • Patent number: 10928868
    Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: February 23, 2021
    Assignee: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 10914313
    Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: February 9, 2021
    Assignee: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10908653
    Abstract: A hinge mechanism is provided, including a fixed member, a rotary member pivotally connected to the fixed member, a pin, a first gear set, and a second gear set. The first and second gear sets are connected to the fixed member and the rod and respectively have a teeth-uncompleted gear. When the rotary member rotates relative to the fixed member from an initial angle to a first angle, the first gear set drives the pin to rotate in a first direction. When the rotary member further rotates relative to the fixed member from the first angle to a second angle, the second gear set drives the ping to rotate in a second direction, which is the opposite of the first direction.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: February 2, 2021
    Assignee: ACER INCORPORATED
    Inventors: Yu-Chin Huang, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin
  • Patent number: 10876542
    Abstract: An axial flow fan includes a hub and a plurality of fan blade sets. The hub is configured to rotate around an axis. The fan blade sets are disposed at the peripheral of the hub, wherein each of the fan blade sets includes a first fan blade and a second fan blade arranged side by side along the axis and a flow channel is defined by each of the first fan blades and the corresponding second fan blade. Each of the flow channels has an inlet and an outlet opposite to each other, wherein at least one of each of the first fan blades and the corresponding second fan blade has a flow guiding hole and each of the flow guiding holes is located between the inlet and the outlet. Each of the flow guiding holes is communicated with the flow channel.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: December 29, 2020
    Assignee: Acer Incorporated
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20200370563
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet and at least one outlet. The impeller is disposed in the housing and rotates about an axis. The inlet is located in an axial direction of the axis and corresponds to the impeller. The outlet is located in a radial direction relative to the axis. The inlet is divided into a compression section and a release section in the rotation direction of the impeller, and the compression section has a uniform first radial dimension relative to the axis. The release section has an extended second radial dimension relative to the axis, and the second radial dimension is greater than the first radial dimension.
    Type: Application
    Filed: April 27, 2020
    Publication date: November 26, 2020
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Chun-Chieh Wang
  • Patent number: 10808715
    Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: October 20, 2020
    Assignee: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Yu-Ming Lin, Cheng-Yu Cheng, Cheng-Wen Hsieh