Patents by Inventor Wen Neng Liao

Wen Neng Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200182253
    Abstract: A fan blade includes an arch-shaped body, a connecting portion, at least one sheet and at least one reinforcement component. The arch-shaped body has a pressure bearing surface and a negative pressure surface opposite to the pressure bearing surface. The connecting portion is connected to a first end portion of the arch-shaped main body. The sheet is connected to the pressure bearing surface or the negative pressure surface. The reinforcement component is connected to the pressure bearing surface. An orthogonal projection of the sheet on the arch-shaped body and an orthogonal projection of the reinforcement component on the arch-shaped body are not overlapped with each other. A fan is also provided.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Applicant: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin
  • Publication number: 20200182554
    Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.
    Type: Application
    Filed: February 15, 2020
    Publication date: June 11, 2020
    Applicant: Acer Incorporated
    Inventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 10642322
    Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: May 5, 2020
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 10634435
    Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 28, 2020
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
  • Publication number: 20200124351
    Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 23, 2020
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
  • Publication number: 20200110450
    Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.
    Type: Application
    Filed: December 9, 2019
    Publication date: April 9, 2020
    Applicant: Acer Incorporated
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 10606328
    Abstract: An accessory is selectively coupled in a first position or a second position to a portable electronic device. The accessory includes a touch unit and a heat dissipation unit. The touch unit is configured to be touched by a user to apply a contact force. An area of the touch unit to be touched by the user is defined as a contact point. When the accessory is in the first position, the touch unit detects a location of the contact point and outputs a control signal to the portable electronic device. The heat dissipation unit comes in contact with a heat source of the portable electronic device when the accessory is in the second position.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: March 31, 2020
    Assignee: Acer Incorporated
    Inventors: Sheng-Yan Chen, Hsueh-Chih Peng, Wen-Neng Liao, Cheng-Wen Hsieh
  • Publication number: 20200091038
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1mm to be qualified to achieve a safety certification.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 19, 2020
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10563926
    Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: February 18, 2020
    Assignee: ACER INCORPORATED
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
  • Publication number: 20200049159
    Abstract: An axial flow fan includes a hub and a plurality of fan blade sets. The hub is configured to rotate around an axis. The fan blade sets are disposed at the peripheral of the hub, wherein each of the fan blade sets includes a first fan blade and a second fan blade arranged side by side along the axis and a flow channel is defined by each of the first fan blades and the corresponding second fan blade. Each of the flow channels has an inlet and an outlet opposite to each other, wherein at least one of each of the first fan blades and the corresponding second fan blade has a flow guiding hole and each of the flow guiding holes is located between the inlet and the outlet. Each of the flow guiding holes is communicated with the flow channel.
    Type: Application
    Filed: November 26, 2018
    Publication date: February 13, 2020
    Applicant: Acer Incorporated
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20200040738
    Abstract: A heat dissipation fan including a hub and a plurality of fan assemblies are provided. The fan assemblies are disposed around the hub, and each of the fan assemblies includes at least two blades. A runner is formed between the at least two blades. A width of the runner gradually reduces along a rotating axis of the hub.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 6, 2020
    Applicant: Acer Incorporated
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20200012323
    Abstract: A hinge mechanism is provided, including a fixed member, a rotary member pivotally connected to the fixed member, a pin, a first gear set, and a second gear set. The first and second gear sets are connected to the fixed member and the rod and respectively have a teeth-uncompleted gear. When the rotary member rotates relative to the fixed member from an initial angle to a first angle, the first gear set drives the pin to rotate in a first direction. When the rotary member further rotates relative to the fixed member from the first angle to a second angle, the second gear set drives the ping to rotate in a second direction, which is the opposite of the first direction.
    Type: Application
    Filed: July 2, 2019
    Publication date: January 9, 2020
    Inventors: Yu-Chin HUANG, Wen-Neng LIAO, Cheng-Wen HSIEH, Yu-Ming LIN
  • Publication number: 20200011610
    Abstract: A portable electronic device having a heat source is provided with a suitable heat dissipation module. The heat dissipation module includes an evaporator, at least one pipe, a working fluid, and at least one check valve. The evaporator thermally contacts the heat source to transmit the heat generated by the heat source to the evaporator. The pipe is connected to the evaporator to form at least one loop, and the working fluid is filled in the loop. The working fluid absorbs and dissipates the heat in the loop to generate a phase change. The check valve is disposed at the loop and provides at least one recirculation channel in the same direction as the first direction and opposite to a second direction to block the working fluid from flowing in the second direction. The first and the second directions are opposite to each other.
    Type: Application
    Filed: July 4, 2019
    Publication date: January 9, 2020
    Applicant: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Ming-Fei Tsai
  • Patent number: 10529649
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: January 7, 2020
    Assignee: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Publication number: 20200004303
    Abstract: A heat dissipation module including a first fan and a second fan is provided. The first fan has a first hub and a plurality of first fan blades disposed on the first hub. The second fan has a second hub and a plurality of second fan blades disposed on the second hub. Herein the first hub and the second hub are movably connected to each other in an axial direction such that the first fan and the second fan coincide or are separated from each other.
    Type: Application
    Filed: June 29, 2019
    Publication date: January 2, 2020
    Applicant: Acer Incorporated
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20190368250
    Abstract: A hinge mechanism is provided, including a fixed member, a rotary member, a hinge member, an annular member, and a hollow slider. The hinge member pivotally connects the rotary member to the fixed member and has a central axis. The annular member is disposed around the hinge member and has a depressed portion. The slider is disposed around the hinge member and located between the annular member and the rotary member. Additionally, the slider has a protrusion received in the depressed portion. When the rotary member rotates relative to the fixed member in an opening direction, the slider is forced by the rotary member to rotate relative to the annular member, so that the protrusion slides out of the depressed portion to form a first gap between the slider and the annular member along the central axis.
    Type: Application
    Filed: May 25, 2019
    Publication date: December 5, 2019
    Inventors: Yu-Chin HUANG, Wen-Neng LIAO
  • Publication number: 20190368251
    Abstract: A hinge mechanism is provided, including a rotary member, a first member, a second member, a first shaft, and a first slider. The first member has a first guiding channel. The second member pivotally connects to the first member and has a first recess. The first shaft pivotally connects the rotary member and the first member, wherein the first shaft has a first cavity. The first slider is movable between the first recess and the first cavity. When the first slider is located in the first recess, the first member is prohibited from rotating relative to the second member by the first slider. When the first slider slides from the first recess along the first guiding channel to the first cavity, the rotary member is prohibited from rotating relative to the first member by the first slider.
    Type: Application
    Filed: May 25, 2019
    Publication date: December 5, 2019
    Inventors: Yu-Chin HUANG, Wen-Neng LIAO
  • Patent number: 10496139
    Abstract: A hinge structure including a first fixing component, a second fixing component, a shaft, a first positioning component, and a second positioning component is provided. The shaft passes through the first fixing component and the second fixing component. The first positioning component is connected to the second fixing component, wherein the shaft passes through the first positioning component, and the first positioning component includes a positioning elastic piece. The shaft passes through the second positioning component, wherein the positioning elastic piece faces toward the second positioning component, and a side of the second positioning component facing toward the positioning elastic piece is configured with a plurality of positioning slots arranged circularly. The positioning elastic piece is configured to engage in any one of the positioning slots to lock an opened/closed state of the second fixing component and the first fixing component. An electronic device is also provided.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: December 3, 2019
    Assignee: Acer Incorporated
    Inventors: Yu-Chin Huang, Wen-Neng Liao
  • Publication number: 20190331135
    Abstract: A fan and a balance ring for the fan are provided. The fan includes a housing, a hub disposed in the housing, blades connected to the side surface of the hub, and a balance ring connected to the hub. The balance ring includes a ring chamber and a balance liquid filled in the ring chamber. The volume of the balance liquid is less than the volume of the ring chamber.
    Type: Application
    Filed: April 24, 2019
    Publication date: October 31, 2019
    Inventors: Cheng-Wen HSIEH, Wen-Neng LIAO, Chun-Chieh WANG, Yu-Ming LIN
  • Publication number: 20190302860
    Abstract: An accessory is selectively coupled in a first position or a second position to a portable electronic device. The accessory includes a touch unit and a heat dissipation unit. The touch unit is configured to be touched by a user to apply a contact force. An area of the touch unit to be touched by the user is defined as a contact point. When the accessory is in the first position, the touch unit detects a location of the contact point and outputs a control signal to the portable electronic device. The heat dissipation unit comes in contact with a heat source of the portable electronic device when the accessory is in the second position.
    Type: Application
    Filed: March 4, 2019
    Publication date: October 3, 2019
    Inventors: Sheng-Yan Chen, Hsueh-Chih Peng, Wen-Neng Liao, Cheng-Wen Hsieh