Patents by Inventor Wen Pin Liu

Wen Pin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110112678
    Abstract: The present disclosure provides a semiconductor manufacturing method. The method includes providing product data of a product, the product data including a sensitive product parameter; searching existing products according to the sensitive product parameter to identify a relevant product from the existing products; determining an initial value of a processing model parameter to the product using corresponding data of the relevant product; assigning the initial value of the processing model parameter to a processing model associated with a manufacturing process; thereafter, tuning a processing recipe using the processing model; and performing the manufacturing process to a semiconductor wafer using the processing recipe.
    Type: Application
    Filed: November 11, 2009
    Publication date: May 12, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Wei Hsu, Yu-Jen Cheng, Wen-Pin Liu, Shun-Ping Wang, Shin-Rung Lu, Jo Fei Wang, Jong-I Mou, Andy Tsen, Chun-Hsien Lin
  • Publication number: 20110084949
    Abstract: A display device including an e-paper device and a power converter is provided. The e-paper device displays information. The power converter generates a plurality of output voltages respectively at a plurality of output terminals and provides the plurality of output voltages to the e-paper device. The power converter includes a transformer and a plurality of diodes. The transformer has a primary winding and a plurality of secondary windings. The diodes are electrically connected between the secondary windings and the output terminals for generating the output voltages, respectively.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 14, 2011
    Inventors: Ming-Chih Chiu, Wen-Pin Liu, Rong Hsu
  • Publication number: 20080048489
    Abstract: A bicycle rim assembling structure includes a plurality of through holes disposed equidistantly at a concave surface on an external side of a rim, and a corresponding number of eyelets are engaged into the through holes by a pressing machine. The eyelet is T-shaped with a distal edge of its broadened circular section at the top bent into an internal wall of a cannular hole, and the lowest section of its linear flat body section at the bottom bent into another cannular hole, and both upper and lower cannular holes have the same diameter, and the eyelets are engaged into the through holes. The space of the linear flat body section under the eyelet provides a function of adjusting the spokes, and the thickness of the eyelet provides sufficient strength to accept the pulling force applied to the eyelet after the spoke is installed to the rim to prevent accidents.
    Type: Application
    Filed: August 23, 2006
    Publication date: February 28, 2008
    Inventor: Wen-Pin Liu
  • Patent number: 7266398
    Abstract: The present invention is a circuit that is set in a communication apparatus. The circuit is co-operated with a button of an audio receiving/transmitting device for triggering an on-hook or off-hook function when the communication apparatus receives an incoming call. The button is normally closed. The on-hook and off-hook functions are triggered by a triggering signal which is higher than a threshold value. Thus, the present invention doesn't execute the on-hook or off-hook function by an on/off button set in the communication apparatus but directly execute the button set in the audio receiving/transmitting device, which improved the convenience of the communication apparatus.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: September 4, 2007
    Assignee: Benq Corporation
    Inventors: Sea Weng Young, Chun Chi Hsu, Wen Pin Liu
  • Publication number: 20070084279
    Abstract: An apparatus for controlling micro-fluid temperature is provided. The apparatus includes a chip, a fixed stand, a heat-absorption block, and an actuator. The chip has a reaction chamber for disposing a micro-fluid, and the temperature of the micro-fluid rises by heating the chip to reach the required reaction temperature. In the cooling-down operation, the heat-absorption block can contact the chip when pushed by the actuator, so as to dissipate the heat from the chip by way of heat conduction. Moreover, in the heating operation, the heat-conductive block is out of contact with the chip such that the micro-fluid in the chip is quickly heated, so as to reach the required reaction temperature of the micro-fluid rapidly.
    Type: Application
    Filed: December 27, 2005
    Publication date: April 19, 2007
    Inventors: Chien-Chih Huang, Mei-Ya Wang, Wen-Pin Liu