Patents by Inventor Wen-Pin Yang

Wen-Pin Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7501310
    Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: March 10, 2009
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Wen-Pin Yang
  • Patent number: 7498646
    Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: March 3, 2009
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen Kun Yang, Wen Pin Yang
  • Publication number: 20090051025
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Application
    Filed: October 22, 2008
    Publication date: February 26, 2009
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Publication number: 20090042226
    Abstract: The present invention describes a newly discovered full-length polynucleotide encoding an SH2 domain-containing adapter protein, called human MIST, cloned, isolated and identified from a human spleen cDNA library. Also described are the MIST polypeptide sequence, expression vectors, host cells, agonists, antagonists, antisense molecules, and antibodies related to the polynucleotide and/or polypeptide of the present invention. Novel splice variant forms of human MIST are provided. Methods for screening for modulators, particularly inhibitors, of the MIST protein and use of the human MIST polynucleotide and polypeptide for therapeutics and diagnostics are described.
    Type: Application
    Filed: September 4, 2008
    Publication date: February 12, 2009
    Inventors: Juan J. Perez-Villar, Han Chang, Steven B. Kanner, Gena S. Whitney, Yuli Wu, Wen-Pin Yang
  • Patent number: 7482431
    Abstract: The present invention relates to KCNQ proteins defining potassium channels. In particular, the invention concerns the human KCNQ2, human KCNQ3, murine KCNQ2, and rat KCNQ2 proteins reported herein. KCNQ2 and KCNQ3 proteins are nervous system-selective and may be involved in neurotransmission and neuroprotection. The KCNQ2 and KCNQ3 of the present invention can be used to assay for modulators of the proteins, which would be useful in treatment of such disorders as ataxia, myokymia, seizures, Alzheimer's disease, Parkinson's disease, age-associated memory loss, learning deficiencies, motor neuron diseases, epilepsy, stroke, and the like.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: January 27, 2009
    Assignee: Bristol-Myers Squibb Company
    Inventors: Michael A. Blanar, Paul C. Levesque, Wayne A. Little, Michael G. Neubauer, Wen-Pin Yang
  • Patent number: 7459781
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: December 2, 2008
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Patent number: 7442770
    Abstract: The present invention describes a newly discovered full-length polynucleotide encoding an SH2 domain-containing adapter protein, called human MIST, cloned, isolated and identified from a human spleen cDNA library. Also described are the MIST polypeptide sequence, expression vectors, host cells, agonists, antagonists, antisense molecules, and antibodies related to the polynucleotide and/or polypeptide of the present invention. Novel splice variant forms of human MIST are provided. Methods for screening for modulators, particularly inhibitors, of the MIST protein and use of the human MIST polynucleotide and polypeptide for therapeutics and diagnostics are described.
    Type: Grant
    Filed: December 18, 2006
    Date of Patent: October 28, 2008
    Assignee: Bristol-Myers Squibb Company
    Inventors: Juan J. Perez-Villar, Han Chang, Wen-Pin Yang, Yuli Wu, Gena S. Whitney, Steven B. Kanner
  • Publication number: 20080165284
    Abstract: An antenna member (120) includes a main body (122), a receiver (121) extending from the main body configured for receiving TV signals, an infrared receiver (123) arranged in the main body configured for receiving remote control signals sent out from a remote device.
    Type: Application
    Filed: November 8, 2007
    Publication date: July 10, 2008
    Applicant: FITIPOWER INTEGRATED TECHNOLOGY, INC
    Inventors: WEN-PIN YANG, FAN-HSI KUNG
  • Publication number: 20080105967
    Abstract: To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.
    Type: Application
    Filed: November 28, 2007
    Publication date: May 8, 2008
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Publication number: 20080108168
    Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
    Type: Application
    Filed: November 27, 2007
    Publication date: May 8, 2008
    Inventors: Wen-Kun Yang, Wen-Pin Yang
  • Publication number: 20080017941
    Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.
    Type: Application
    Filed: July 19, 2006
    Publication date: January 24, 2008
    Applicant: Advanced Chip Engineering Technology Inc.
    Inventors: Wen Kun Yang, Wen Pin Yang
  • Publication number: 20080020511
    Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.
    Type: Application
    Filed: April 27, 2007
    Publication date: January 24, 2008
    Applicant: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Wen Pin Yang
  • Publication number: 20070243586
    Abstract: The current invention discloses nucleic acid and amino acid sequences for novel organic anion transfer proteins (“OATPs”). The invention encompasses the OATPs described herein, together with vectors containing the cDNA sequences, host cells containing the vectors and polypeptides having all or part of an OATP. Also encompasses are uses for OATPs for targeting drugs to specific organs and for modulating the concentration of endogenous substrates.
    Type: Application
    Filed: May 17, 2007
    Publication date: October 18, 2007
    Inventors: Todd Kirchgessner, Bonnie Hsiang, Yingjie Zhu, Yuli Wu, Zhaoqing Wang, Jean Lynch, Xin Huang, Wen-Pin Yang
  • Patent number: 7262289
    Abstract: The present invention relates to KCNQ proteins defining potassium channels. In particular, the invention concerns the human KCNQ2, human KCNQ3, murine KCNQ2, and rat KCNQ2 proteins reported herein. KCNQ2 and KCNQ3 proteins are nervous system-selective and may be involved in neurotransmission and neuroprotection. The KCNQ2 and KCNQ3 of the present invention can be used to assay for modulators of the proteins, which would be useful in treatment of such disorders as ataxia, myokymia, seizures, Alzheimer's disease, Parkinson's disease, age-associated memory loss, learning deficiencies, motor neuron diseases, epilepsy, stroke, and the like.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: August 28, 2007
    Assignee: Bristol-Myers Squibb Co.
    Inventors: Michael A. Blanar, Wen-Pin Yang, Paul C. Levesque, Michael G. Neubauer, Wayne A. Little
  • Patent number: 7262081
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: August 28, 2007
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Patent number: 7241590
    Abstract: The present invention describes a newly discovered full-length polynucleotide encoding an SH2 domain-containing adapter protein, called human MIST, cloned, isolated and identified from a human spleen cDNA library. Also described are the MIST polypeptide sequence, expression vectors, host cells, agonists, antagonists, antisense molecules, and antibodies related to the polynucleotide and/or polypeptide of the present invention. Novel splice variant forms of human MIST are provided. Methods for screening for modulators, particularly inhibitors, of the MIST protein and use of the human MIST polynucleotide and polypeptide for therapeutics and diagnostics are described.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: July 10, 2007
    Assignee: Bristol-Myers Squibb Company
    Inventors: Juan J. Perez-Villar, Han Chang, Wen-Pin Yang, Yuli Wu, Gena S. Whitney, Steven B. Kanner
  • Publication number: 20070148692
    Abstract: The present invention relates to KCNQ proteins defining potassium channels. In particular, the invention concerns the human KCNQ2, human KCNQ3, murine KCNQ2, and rat KCNQ2 proteins reported herein. KCNQ2 and KCNQ3 proteins are nervous system-selective and may be involved in neurotransmission and neuroprotection. The KCNQ2 and KCNQ3 of the present invention can be used to assay for modulators of the proteins, which would be useful in treatment of such disorders as ataxia, myokymia, seizures, Alzheimer's disease, Parkinson's disease, age-associated memory loss, learning deficiencies, motor neuron diseases, epilepsy, stroke, and the like.
    Type: Application
    Filed: February 16, 2007
    Publication date: June 28, 2007
    Inventors: Michael Blanar, Wen-Pin Yang, Paul Levesque, Michael Neubauer, Wayne Little
  • Patent number: 7235375
    Abstract: The current invention discloses nucleic acid and amino acid sequences for novel organic anion transfer proteins (“OATPs”). The invention encompasses the OATPs described herein, together with vectors containing the cDNA sequences, host cells containing the vectors and polypeptides having all or part of an OATP. Also encompasses are uses for OATPs for targeting drugs to specific organs and for modulating the concentration of endogenous substrates.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: June 26, 2007
    Assignee: Bristol-Myers Squibb Company
    Inventors: Todd G. Kirchgessner, Bonnie Hsiang, Yingjie Zhu, Yuli Wu, Zhaoging Wang, Jean S. Lynch, Xin Huang, Wen-Pin Yang
  • Publication number: 20070117141
    Abstract: The present invention describes a newly discovered full-length polynucleotide encoding an SH2 domain-containing adapter protein, called human MIST, cloned, isolated and identified from a human spleen cDNA library. Also described are the MIST polypeptide sequence, expression vectors, host cells, agonists, antagonists, antisense molecules, and antibodies related to the polynucleotide and/or polypeptide of the present invention. Novel splice variant forms of human MIST are provided. Methods for screening for modulators, particularly inhibitors, of the MIST protein and use of the human MIST polynucleotide and polypeptide for therapeutics and diagnostics are described.
    Type: Application
    Filed: December 18, 2006
    Publication date: May 24, 2007
    Inventors: Juan Perez-Villar, Han Chang, Wen-Pin Yang, Yuli Wu, Gena Whitney, Steven Kanner
  • Patent number: 7196408
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: March 27, 2007
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen