Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.

Abstract: For example, a method includes collecting orientation data from a mobile device as a user of the mobile device moves within an indoor space, generating orientation estimates for the mobile device from the orientation data, generating distance estimates representing distances of the mobile device to a wireless access point in the indoor space, storing the orientation estimates and the distance estimates together as a series of data blocks, constructing a plurality of trajectory segments from the orientation estimates, identifying identifiers for a last number of trajectory segments, using data blocks corresponding to the last number of trajectory segments, and identifying a predicted place within the indoor space to which the user is expected to go by using the identifiers to traverse a prediction tree, where branches of the prediction tree that are associated with the identifiers define a path that ends at a leaf node corresponding to the predicted place.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.

Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.

Abstract: A rubber sole thermo-molding machine includes a lower mold seat disposed on a hydraulic actuator of the machine seat. The lower mold seat ascends and descends with respect to the upper mold seat according to the hydraulic actuator, allowing the lower upper molds to close and open. The upper mold seat moves between a normal position and a tilt position according to the turning mechanism. The middle plate horizontally moves between the upper and the lower mold seats, and has a push mechanism connected with the middle frame. When the pin of the middle frame and the fasten unit on the push mechanism are separated, the middle frame is stacked on the middle plate or the lower mold to move, facilitating the cleansing and material-feeding operations. The user can cleanse the upper mold without being hindered by the middle frame, assuring the safe and smooth process.

Abstract: A mechanism is provided for automatically detecting, diagnosing, transporting, and repairing devices having failed during burn-in testing. Embodiments provide a system that monitors devices undergoing burn-in testing and detecting when a device or a component within a device fails the burn-in test. Embodiments can then alert burn-in-rack monitor personnel of the device failure. Embodiments can concurrently determine the nature of the failure applying a machine learning-based prediction model against log files associated with the failed device. The diagnosis along with a recommended repair strategy can be provided to the repair center as an aid in accelerating the repair process. In addition, the diagnosis can be used to order parts for the repair from a parts depot. In this manner, embodiments can reduce the time for detection, diagnosis, and repair of the failed device.

Abstract: A touch signal processing method, for a touch display integrated device including a plurality of touch display units, is provided. Each of the plurality of touch display units includes a touch microcontroller unit (MCU). The touch signal processing method includes sensing, by a sensing module of each of the plurality of touch display units, a physical area corresponding to each of the plurality of touch display units to generate a plurality of sensing raw data; passing, by an (n?1)-th touch MCU of the plurality of touch display units, a plurality of overlap sensing raw data corresponding to an overlap area of the physical area to an n-th touch MCU; and determining, by each of the touch MCU of the plurality of touch display units, a coordinate information corresponding to a touch location of a processing area.

Abstract: A touch-and-display device operated with an active stylus is provided. A touch position is detected in a touch detection period. An uplink signal is transmitted and a downlink signal is detected in a stylus detection period. When the downlink signal is detected, it is determined if a distance between a stylus position and the touch position is less than or equal to a first predetermined distance. A stylus mode is not entered if the determination result is affirmative.

Abstract: A touch signal processing method, for a touch display integrated device including a plurality of touch display units, is provided. Each of the plurality of touch display units includes a touch microcontroller unit (MCU). The touch signal processing method includes sensing, by a sensing module of each of the plurality of touch display units, a physical area corresponding to each of the plurality of touch display units to generate a plurality of sensing raw data; passing, by an (n?1)-th touch MCU of the plurality of touch display units, a plurality of overlap sensing raw data corresponding to an overlap area of the physical area to an n-th touch MCU; and determining, by each of the touch MCU of the plurality of touch display units, a coordinate information corresponding to a touch location of a processing area.

Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.

Abstract: A mechanism is provided for automatically detecting, diagnosing, transporting, and repairing devices having failed during burn-in testing. Embodiments provide a system that monitors devices undergoing burn-in testing and detecting when a device or a component within a device fails the burn-in test. Embodiments can then alert burn-in-rack monitor personnel of the device failure. Embodiments can concurrently determine the nature of the failure applying a machine learning-based prediction model against log files associated with the failed device. The diagnosis along with a recommended repair strategy can be provided to the repair center as an aid in accelerating the repair process. In addition, the diagnosis can be used to order parts for the repair from a parts depot. In this manner, embodiments can reduce the time for detection, diagnosis, and repair of the failed device.

Abstract: A rubber sole thermos-molding machine includes a lower mold seat disposed on a hydraulic actuator of the machine seat. The lower mold seat ascends and descends with respect to the upper mold seat according to the hydraulic actuator, allowing the lower upper molds to close and open. The upper mold seat moves between a normal and a tilt positions according to the turning mechanism. The middle plate horizontally moves between the upper and the lower mold seats, and has a push mechanism connected with the middle frame. When the pin of the middle frame and the fasten unit on the push mechanism are separated, the middle frame is stacked on the middle plate or the lower mold to move, facilitating the cleansing and material-feeding operations. The user can cleanse the upper mold without being hindered by the middle frame, assuring the safe and smooth process.

Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.

Abstract: The present invention relates to an inspection system and more particularly to a system and method for inspection of wet ophthalmic lens, preferably in an automated lens manufacturing line. The inspection system provides for capturing multiple images of an ophthalmic lens using multiple cameras, each with a customized optical unit which may use wavelength filters, and the ophthalmic lens illuminated by multiple lighting modules each configured for a different wavelength, or a different polarization and triggered to strobe the illumination at the same instance or at different instances in the time domain. Suitable filters used in the optical module for each camera ensures appropriate images at different illuminating wavelength, especially when all the illuminations are strobed at the same time. Images captured and inspected by this configuration aids in improvement in method of inspection with enhanced degree of reliability and quality.

Abstract: The present invention relates to an inspection system and more particularly to a system and method for inspection of wet ophthalmic lens, preferably in an automated lens manufacturing line. The inspection system provides for capturing multiple images of an ophthalmic lens using multiple cameras, each with a customized optical unit which may use wavelength filters, and the ophthalmic lens illuminated by multiple lighting modules each configured for a different wavelength, or a different polarization and triggered to strobe the illumination at the same instance or at different instances in the time domain. Suitable filters used in the optical module for each camera ensures appropriate images at different illuminating wavelength, especially when all the illuminations are strobed at the same time. Images captured and inspected by this configuration aids in improvement in method of inspection with enhanced degree of reliability and quality.

Abstract: The present invention relates to an inspection system and more particularly to a system and method for inspection of wet ophthalmic lens, preferably in an automated lens manufacturing line. The inspection system provides for capturing multiple images of an ophthalmic lens using multiple cameras, each with a customized optical unit which may use wavelength filters, and the ophthalmic lens illuminated by multiple lighting modules each configured for a different wavelength, or a different polarization and triggered to strobe the illumination at the same instance or at different instances in the time domain. Suitable filters used in the optical module for each camera ensures appropriate images at different illuminating wavelength, especially when all the illuminations are strobed at the same time. Images captured and inspected by this configuration aids in improvement in method of inspection with enhanced degree of reliability and quality.

Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.

Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.

Abstract: A method for preparing an isobenzofuran-1(3H)-one based compound of the following formula I is provided. R1, R2 and p are defined in the specification.

Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.