Patents by Inventor Wen Sen
Wen Sen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250091512Abstract: An exterior mirror assembly with an actuator is provided. The actuator comprises: a gear element, a driving unit and a limiting element. The driving unit is configured to impart a rotation of the gear element. The limiting element is adjacent to a circumference of the gear element. The gear element has a teeth portion with a first end and a second end and the teeth portion extends along the circumference of the gear element. The limiting element leans against the first end or the second end of the teeth portion when the driving unit drives the gear element to rotate by an angle.Type: ApplicationFiled: September 19, 2023Publication date: March 20, 2025Applicant: Chris Cam Industry Inc.Inventors: Hung-Lung Chen, Wen-Sen Wu, Kai-I Teng
-
Patent number: 12189900Abstract: A touch detection system includes a stylus, a panel and a processing circuit. The panel can include a plurality of sensing cells used to receive a first signal and a second signal generated by a touch event. The processing circuit can be coupled to the panel and used to determine a plurality of first areas and a plurality of first intensities corresponding to the first signal, determine a plurality of second areas and a plurality of second intensities corresponding to a second signal, and determine whether the touch event is triggered by the stylus touching the panel according to the first intensities, first areas, the second intensities and the second areas.Type: GrantFiled: April 6, 2023Date of Patent: January 7, 2025Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Fong-Wei Yang, Min-Chi Kao, Chung-Wen Chang, Ming-Kai Cheng, Tzu-Hsi Yang, Wen-Sen Su
-
Publication number: 20240412090Abstract: Systems and techniques that facilitate coupling a superconducting cable to a interconnect chip and a quantum processor. In various embodiments, a system can comprise a quantum processor, one or more interconnect chips, and one or more cable connections. The quantum processor can comprise a plurality of qubits. Additionally, the one or more interconnect chips can be bonded to the quantum processor, and the one or more cable connections can be coupled to the one or more interconnect chips. With embodiments, the one or more interconnect chips can comprise one or more signal routings from the one or more cable connections to the quantum processor. Further, in embodiments, a first signal can pass from the one or more cable connections to at least one of the plurality of qubits.Type: ApplicationFiled: June 7, 2023Publication date: December 12, 2024Inventors: Neereja Sundaresan, Shawn Anthony Hall, Jason S. Orcutt, Jae-Woong Nah, Yves Martin, Wen-Sen Lu, John Michael Cotte
-
Publication number: 20240385620Abstract: An autonomous mobile robot fleet includes a service transceiver module, a dispatch module, a robot fleet, a monitoring module, a storage module, and a certificate module. The service transceiver module is configured to receive and send mission information. The dispatch module couples to the service transceiver module, and is configured to generate dispatch information according to the mission information. The robot fleet wirelessly couples to the dispatch module. The robot fleet is used to execute the dispatch information. The monitoring module wirelessly couples to the robot fleet. The monitoring module generates monitoring information according to a status signal from the robot fleet. The storage module couples to the dispatch module and the monitoring module. The certificate module couples to the storage module, and wirelessly couples to the robot fleet. The certificate module is configured to generate certificate information according to the dispatch information and the monitoring information.Type: ApplicationFiled: August 21, 2023Publication date: November 21, 2024Inventors: Wen-Sen LEE, Tsun-Hsien KUO, Chen-Wei YANG
-
Publication number: 20240338098Abstract: A touch detection system includes a stylus, a panel and a processing circuit. The panel can include a plurality of sensing cells used to receive a first signal and a second signal generated by a touch event. The processing circuit can be coupled to the panel and used to determine a plurality of first areas and a plurality of first intensities corresponding to the first signal, determine a plurality of second areas and a plurality of second intensities corresponding to a second signal, and determine whether the touch event is triggered by the stylus touching the panel according to the first intensities, first areas, the second intensities and the second areas.Type: ApplicationFiled: April 6, 2023Publication date: October 10, 2024Applicant: HIMAX TECHNOLOGIES LIMITEDInventors: Fong-Wei Yang, Min-Chi Kao, Chung-Wen Chang, Ming-Kai Cheng, Tzu-Hsi Yang, Wen-Sen Su
-
Patent number: 11715715Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.Type: GrantFiled: March 15, 2021Date of Patent: August 1, 2023Assignee: Unimicron Technology Corp.Inventors: Tzyy-Jang Tseng, Ming-Ru Chen, Cheng-Chung Lo, Chin-Sheng Wang, Wen-Sen Tang
-
Patent number: 11623384Abstract: A rubber sole thermo-molding machine includes a lower mold seat disposed on a hydraulic actuator of the machine seat. The lower mold seat ascends and descends with respect to the upper mold seat according to the hydraulic actuator, allowing the lower upper molds to close and open. The upper mold seat moves between a normal position and a tilt position according to the turning mechanism. The middle plate horizontally moves between the upper and the lower mold seats, and has a push mechanism connected with the middle frame. When the pin of the middle frame and the fasten unit on the push mechanism are separated, the middle frame is stacked on the middle plate or the lower mold to move, facilitating the cleansing and material-feeding operations. The user can cleanse the upper mold without being hindered by the middle frame, assuring the safe and smooth process.Type: GrantFiled: December 8, 2020Date of Patent: April 11, 2023Assignee: DAH TYAN HYDRAULIC MACHINE INDUSTRIAL CO., LTD.Inventor: Wen-Sen Tian
-
Patent number: 11599437Abstract: A mechanism is provided for automatically detecting, diagnosing, transporting, and repairing devices having failed during burn-in testing. Embodiments provide a system that monitors devices undergoing burn-in testing and detecting when a device or a component within a device fails the burn-in test. Embodiments can then alert burn-in-rack monitor personnel of the device failure. Embodiments can concurrently determine the nature of the failure applying a machine learning-based prediction model against log files associated with the failed device. The diagnosis along with a recommended repair strategy can be provided to the repair center as an aid in accelerating the repair process. In addition, the diagnosis can be used to order parts for the repair from a parts depot. In this manner, embodiments can reduce the time for detection, diagnosis, and repair of the failed device.Type: GrantFiled: February 22, 2021Date of Patent: March 7, 2023Assignee: Dell Products L.P.Inventors: Yun Xi, Yu Huang Lin, Meng Meng Jiang, Wen Sen Que, Hua Shan Liang, Mu Shou Lan, Zhi Jian Weng, Lang Lin
-
Patent number: 11520430Abstract: A touch signal processing method, for a touch display integrated device including a plurality of touch display units, is provided. Each of the plurality of touch display units includes a touch microcontroller unit (MCU). The touch signal processing method includes sensing, by a sensing module of each of the plurality of touch display units, a physical area corresponding to each of the plurality of touch display units to generate a plurality of sensing raw data; passing, by an (n?1)-th touch MCU of the plurality of touch display units, a plurality of overlap sensing raw data corresponding to an overlap area of the physical area to an n-th touch MCU; and determining, by each of the touch MCU of the plurality of touch display units, a coordinate information corresponding to a touch location of a processing area.Type: GrantFiled: January 29, 2021Date of Patent: December 6, 2022Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Li-Lin Liu, Chun-Jen Su, Wen-Sen Su, Yen-Hsiang Lin
-
Patent number: 11467690Abstract: A touch-and-display device operated with an active stylus is provided. A touch position is detected in a touch detection period. An uplink signal is transmitted and a downlink signal is detected in a stylus detection period. When the downlink signal is detected, it is determined if a distance between a stylus position and the touch position is less than or equal to a first predetermined distance. A stylus mode is not entered if the determination result is affirmative.Type: GrantFiled: September 29, 2021Date of Patent: October 11, 2022Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Chung-Wen Chang, Fong Wei Yang, Ming-Kai Cheng, Wen-Sen Su, Shen-Feng Tai
-
Publication number: 20220244804Abstract: A touch signal processing method, for a touch display integrated device including a plurality of touch display units, is provided. Each of the plurality of touch display units includes a touch microcontroller unit (MCU). The touch signal processing method includes sensing, by a sensing module of each of the plurality of touch display units, a physical area corresponding to each of the plurality of touch display units to generate a plurality of sensing raw data; passing, by an (n?1)-th touch MCU of the plurality of touch display units, a plurality of overlap sensing raw data corresponding to an overlap area of the physical area to an n-th touch MCU; and determining, by each of the touch MCU of the plurality of touch display units, a coordinate information corresponding to a touch location of a processing area.Type: ApplicationFiled: January 29, 2021Publication date: August 4, 2022Inventors: Li-Lin Liu, Chun-Jen Su, Wen-Sen Su, Yen-Hsiang Lin
-
Publication number: 20220238471Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.Type: ApplicationFiled: March 15, 2021Publication date: July 28, 2022Applicant: Unimicron Technology Corp.Inventors: Tzyy-Jang Tseng, Ming-Ru Chen, Cheng-Chung Lo, Chin-Sheng Wang, Wen-Sen Tang
-
Publication number: 20210382801Abstract: A mechanism is provided for automatically detecting, diagnosing, transporting, and repairing devices having failed during burn-in testing. Embodiments provide a system that monitors devices undergoing burn-in testing and detecting when a device or a component within a device fails the burn-in test. Embodiments can then alert burn-in-rack monitor personnel of the device failure. Embodiments can concurrently determine the nature of the failure applying a machine learning-based prediction model against log files associated with the failed device. The diagnosis along with a recommended repair strategy can be provided to the repair center as an aid in accelerating the repair process. In addition, the diagnosis can be used to order parts for the repair from a parts depot. In this manner, embodiments can reduce the time for detection, diagnosis, and repair of the failed device.Type: ApplicationFiled: February 22, 2021Publication date: December 9, 2021Applicant: Dell Products L.P.Inventors: Yun Xi, Yu huang Lin, Meng Meng Jiang, Wen Sen Que, Hua Shan Liang, Mu Shou Lan, Zhi Jian Weng, Lang Lin
-
Publication number: 20210178655Abstract: A rubber sole thermos-molding machine includes a lower mold seat disposed on a hydraulic actuator of the machine seat. The lower mold seat ascends and descends with respect to the upper mold seat according to the hydraulic actuator, allowing the lower upper molds to close and open. The upper mold seat moves between a normal and a tilt positions according to the turning mechanism. The middle plate horizontally moves between the upper and the lower mold seats, and has a push mechanism connected with the middle frame. When the pin of the middle frame and the fasten unit on the push mechanism are separated, the middle frame is stacked on the middle plate or the lower mold to move, facilitating the cleansing and material-feeding operations. The user can cleanse the upper mold without being hindered by the middle frame, assuring the safe and smooth process.Type: ApplicationFiled: December 8, 2020Publication date: June 17, 2021Inventor: WEN-SEN TIAN
-
Patent number: 10971417Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.Type: GrantFiled: August 5, 2019Date of Patent: April 6, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai
-
Patent number: 10949963Abstract: The present invention relates to an inspection system and more particularly to a system and method for inspection of wet ophthalmic lens, preferably in an automated lens manufacturing line. The inspection system provides for capturing multiple images of an ophthalmic lens using multiple cameras, each with a customized optical unit which may use wavelength filters, and the ophthalmic lens illuminated by multiple lighting modules each configured for a different wavelength, or a different polarization and triggered to strobe the illumination at the same instance or at different instances in the time domain. Suitable filters used in the optical module for each camera ensures appropriate images at different illuminating wavelength, especially when all the illuminations are strobed at the same time. Images captured and inspected by this configuration aids in improvement in method of inspection with enhanced degree of reliability and quality.Type: GrantFiled: November 7, 2019Date of Patent: March 16, 2021Assignee: EMAGE VISION PTE. LTD.Inventors: Soon Wei Wong, Wen Sen Zhou, Sergey Smorgon, Kundapura Parameshwara Srinivas
-
Publication number: 20200074620Abstract: The present invention relates to an inspection system and more particularly to a system and method for inspection of wet ophthalmic lens, preferably in an automated lens manufacturing line. The inspection system provides for capturing multiple images of an ophthalmic lens using multiple cameras, each with a customized optical unit which may use wavelength filters, and the ophthalmic lens illuminated by multiple lighting modules each configured for a different wavelength, or a different polarization and triggered to strobe the illumination at the same instance or at different instances in the time domain. Suitable filters used in the optical module for each camera ensures appropriate images at different illuminating wavelength, especially when all the illuminations are strobed at the same time. Images captured and inspected by this configuration aids in improvement in method of inspection with enhanced degree of reliability and quality.Type: ApplicationFiled: November 7, 2019Publication date: March 5, 2020Inventors: Soon Wei WONG, Wen Sen ZHOU, Sergey SMORGON, Kundapura Parameshwara SRINIVAS
-
Patent number: 10489901Abstract: The present invention relates to an inspection system and more particularly to a system and method for inspection of wet ophthalmic lens, preferably in an automated lens manufacturing line. The inspection system provides for capturing multiple images of an ophthalmic lens using multiple cameras, each with a customized optical unit which may use wavelength filters, and the ophthalmic lens illuminated by multiple lighting modules each configured for a different wavelength, or a different polarization and triggered to strobe the illumination at the same instance or at different instances in the time domain. Suitable filters used in the optical module for each camera ensures appropriate images at different illuminating wavelength, especially when all the illuminations are strobed at the same time. Images captured and inspected by this configuration aids in improvement in method of inspection with enhanced degree of reliability and quality.Type: GrantFiled: April 8, 2016Date of Patent: November 26, 2019Assignee: EMAGE VISION PTE. LTD.Inventors: Soon Wei Wong, Wen Sen Zhou, Sergey Smorgon, Kundapura Parameshwara Srinivas
-
Publication number: 20190355640Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.Type: ApplicationFiled: August 5, 2019Publication date: November 21, 2019Inventors: Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai
-
Patent number: 10373885Abstract: Disclosed herein is a package comprising a first die having a first redistribution layer (RDL) disposed on a first side of a first substrate and a second die having a second RDL disposed on a first side of a second substrate, with the first RDL bonded to the second RDL. A third die having a third RDL is disposed on a first side of a third substrate, the third die mounted over the second die, with the second die disposed between the first die and the third die. First vias extend through, and are electrically isolated from, the second substrate, with the first vias each contacting a conductive element in the first RDL or the second RDL. Second vias extend through, and are electrically isolated from, the third substrate, with the second vias each contacting a conductive element in the third RDL or one of the first vias.Type: GrantFiled: May 30, 2017Date of Patent: August 6, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai