Abstract: A home network comprises at least one appliance having an appliance interactive display and an appliance communication module, a server having a server communication module, and a mobile device having a mobile interactive display and a mobile communication module. The mobile device or server is configured to send a message having an embedded interactive element to the at least on appliance when the server communication module or the mobile communication module is in communication with the appliance communication module.

Abstract: The present invention provides a flexible OLED and a manufacture method thereof. The flexible OLED is capable of decreasing the resistance of the second electrode (12) and increasing the conducting ability to even the voltages of respective pixels, to improve the display homogeneity, and meanwhile, capable of reducing the thickness of the second electrode (12) and saving the material of the second electrode (12) by covering the auxiliary conducting layer (13) on the second electrode (12). The manufacture method of the flexible OLED is capable of decreasing the resistance of the second electrode (12) and increasing the conducting ability to even the voltages of respective pixels, to improve the display homogeneity, and meanwhile, capable of reducing the thickness of the second electrode (12) and saving the material of the second electrode (12) by forming the auxiliary conducting layer (13) on the second electrode (12) to cover the second electrode (12).

Abstract: The present invention provides an OLED display device, which includes an assisting conductive layer formed on a bottom surface of an upper substrate in such a way that the assisting conductive layer is in direct contact with and electrically connected to a second electrode that is located on a top surface of a lower substrate so that electrical conduction capability of the second electrode is enhanced and the electrical resistance of the second electrode is reduced to thereby make in-plane voltage homogenous, improve consistency of displaying, and alleviate the issues of non-uniform panel brightness and mura and also help reduce the thickness of the second electrode for saving material of the second electrode and increase light transparency of the second electrode.

Abstract: The present invention relates to methods and medicarnents useful for treating locally advanced pancreatic cancer (LAPC). Improved therapeutic methods and regimens comprising anti-connective tissue growth factor (CTGF) agents, including anti-CTGF antibodies, are provided. Included are induction therapies for converting unreseetable LAPC into borderline or resectable status.

Abstract: A packaged IC device has a power bar assembly with one or more power distribution bars, mounted on top of the IC die, which enables assembly using a lead frame that does not include any power distribution bars. External power supply voltages are brought to the IC die by (i) a corresponding first bond wire that connects a lead frame lead to a corresponding die-mounted power distribution bar and (ii) a corresponding second bond wire that connects the power distribution bar to a corresponding bond pad on the IC die. As such, different types of packaged IC devices having different numbers and/or configurations of power distribution bars can be assembled using a single, generic lead frame design having a die pad, tie bars, and leads, but no power distribution bars.

Abstract: A universal substrate for assembling ball grid array (BGA) type integrated circuit packages has a non-conducting matrix, an array of conducting vias extending between top and bottom surfaces of the matrix, and one or more instances of each of two or more different types of fiducial pairs on the top surface of the matrix. Each instance of each different fiducial pair indicates a location of a different via sub-array of the substrate for a different BGA package of a particular package size. The same substrate can be used to assemble BGA packages of different size, thereby avoiding having to design a different substrate for each different BGA package size.

Abstract: Example appliances that trigger applications on consumer devices based on user proximity to appliance background are disclosed. A disclosed example system includes an appliance to detect a proximity of a user to the appliance, a remote server to receive a result of the proximity detection from the appliance, and to send an application trigger based on the result, and a user device associated with the user to activate an application on the user device in response to the application trigger received from the remote server.

Abstract: Example appliances that trigger applications on consumer devices based on user proximity to appliance background are disclosed. A disclosed example system includes an appliance to detect a proximity of a user to the appliance, a remote server to receive a result of the proximity detection from the appliance, and to send an application trigger based on the result, and a user device associated with the user to activate an application on the user device in response to the application trigger received from the remote server.

Abstract: A semiconductor device includes a lead frame, and an integrated circuit die. The lead frame has a flag for supporting the die and leads that surround that flag and die. The lead frame also has ground ring that surrounds the flag and die. First bond wires electrically connect the die to the lead frame leads. An insulating layer is disposed on the ground ring, and a power layer is disposed on the insulating layer. The semiconductor device further includes second bond wires that connect the die to the ground ring and third bond wires that connect the die to the power layer.

Abstract: A semiconductor device includes a semiconductor substrate having opposing first and second main surfaces, a via (TSV) extending from the first main surface of the substrate to the second main surface of the substrate, first electrical connectors formed near the first main surface and second electrical connectors formed near the second main surface. There are insulated bond wires, each extending through the via and having a first end bonded to a respective one of the first electrical connectors and a second end bonded to a respective one of the second electrical connectors. The via may be filled with an encapsulating material.

Abstract: A lead frame includes a lead formed of a conductive material and having first and second ends, opposing first and second main surfaces, and opposing first and second side surfaces each extending between the first and second main surfaces. A polymeric layer is formed at least on the first main surface and the first and second side surfaces of the lead at least proximate the second end of the lead. An opening in the polymeric layer on the first main surface of the lead proximate the second end is provided for connecting the lead to, for example, a semiconductor die via a bond wire.

Abstract: A semiconductor device includes a lead frame, and an integrated circuit die. The lead frame has a flag for supporting the die and leads that surround that flag and die. The lead frame also has ground ring that surrounds the flag and die. First bond wires electrically connect the die to the lead frame leads. An insulating layer is disposed on the ground ring, and a power layer is disposed on the insulating layer. The semiconductor device further includes second bond wires that connect the die to the ground ring and third bond wires that connect the die to the power layer.

Abstract: A dicing blade suitable for cutting a semiconductor wafer has an edge of fine grit for polishing a top surface of the wafer and a protruding part of coarse grit for making an initial cut into the wafer. The blade reduces chipping of the top surface of the wafer and increases throughput by facilitating cutting and polishing in one operation. The blade can dice and polish comparatively thick wafers having narrow scribe lines in a single operation.

Abstract: A lead frame includes a lead formed of a conductive material and having first and second ends, opposing first and second main surfaces, and opposing first and second side surfaces each extending between the first and second main surfaces. A polymeric layer is formed at least on the first main surface and the first and second side surfaces of the lead at least proximate the second end of the lead. An opening in the polymeric layer on the first main surface of the lead proximate the second end is provided for connecting the lead to, for example, a semiconductor die via a bond wire.

Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.

Abstract: A semiconductor sensor device is packaged using a lid in which one or more dies are mounted to a substrate within the lid housing and one or more other dies are mounted to the substrate outside of the lid housing. The dies located outside of the lid housing may be encapsulated in a molding compound. In one embodiment, the lid has a vent hole and an active region of a pressure-sensing die located inside the lid housing is covered by a pressure-sensitive gel that together enable ambient atmospheric pressure immediately outside the sensor device to reach the active region of the pressure-sensing die. The sensor device may also have one or more other types of sensor dies, such as an acceleration-sensing die, to form a multi-sensor device.

Abstract: A fan control system. The fan control system has a programmable microcontroller to receive an input signal and a rotation speed signal corresponding to the actual rotation speed of the fan motor, determining an output signal according to the input signal and the rotation speed signal, and outputting the output signal; and a fan-driving unit to receive the output signal and adjusting the rotation speed for driving the fan motor according to the output signal. The rotation speed is in a relation of a multi-stage function to the input signal.

Abstract: Biofunctionalized fibers including a fiber platform and a histidine-tagged protein and, optionally, an antibody. Chitosan is a fiber useful as the fiber platform. The fiber platform may be treated with nickel or may be directly linked to the histidine-tagged protein e.g., histidine-tagged streptococcal IgG-binding protein, protein G, protein G3T, GFP or RFP. The resulting biofunctionalized fibers can be assembled into protein fiber assemblies by a variety of biofabrication methods. The fiber assemblies, e.g., in the form of woven fabrics, are useful for (i) antigen capture; (ii) immunoanalysis, and/or (iii) multiplexed analysis. In one fabrication, each fiber of a fiber assembly presents a specific antibody, and mixing and matching of fibers, for example by weaving of fabrics from various antibody-presenting fibers, allows for multiple antigens to be captured simultaneously for multiplexed analysis.

Abstract: A hot swap fan includes a fan and a puller structure. The puller structure covers a side surface of the fan. The puller structure includes a base, a holder, and a fixing structure. A first end of the base is pivoted to the fan. The holder and the fixing structure are on a second end of the base.

Abstract: A fan includes a frame and an impeller. The impeller is disposed in the frame and the impeller has a plurality of blades. Each blade has a wing part and a flap part, and the wing part and the flap part form a predetermined angle. A blade is also disclosed.