Patents by Inventor Wen Shi
Wen Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140034522Abstract: A durable anti-mold packet comprises a holding pouch, an absorption material and an anti-mold evaporation substance. The holding pouch has an upper edge, a lower edge, a left edge and a right edge. The left edge and right edge are folded and overlapped to form a housing space and an overlapped seam edge. The upper edge and lower edge are pressed and sealed. The overlapped seam edge is partially pressed and sealed to form an evaporation vent communicating with the exterior. The anti-mold evaporation substance is coated onto the absorption material which is held in the housing space. Therefore a greater amount of the anti-mold evaporation substance can be absorbed by the absorption material and the anti-mold evaporation substance can be slowly released from the absorption material to increase use duration of the anti-mold packet and provide anti-mold effect for a longer period to meet use requirements.Type: ApplicationFiled: August 1, 2012Publication date: February 6, 2014Inventor: Wen-Shi YIU
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Publication number: 20140008261Abstract: An anti-mold packet comprises a holding pouch and an anti-mold volatile substance. The holding pouch has an upper edge, a lower edge, a left edge and a right edge. The left edge and right edge are respectively bent and folded to form a holding space and a folded seam edge. The upper edge and lower edge are pressed and sealed. The folded seam edge is partially pressed and sealed to form a slit communicating with the exterior. The anti-mold volatile substance is held in the housing space. The holding space can hold a greater amount of anti-mold volatile substance in a packet fashion, and the anti-mold volatile substance can evaporate through the slit for a longer period to achieve durable anti-mold purpose to meet use requirements.Type: ApplicationFiled: July 3, 2012Publication date: January 9, 2014Inventor: Wen-Shi YIU
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Patent number: 8562809Abstract: A method of forming a bioelectronic device including a protein on an electrically conductive substrate, by electrodepositing aminopolysaccharide chitosan on the substrate while applying a cathodic voltage to the substrate, to form an aminopolysaccharide chitosan film thereon, applying an anodic voltage to the substrate in the presence of NaCl to activate the aminopolysaccharide chitosan film so that it is reactive with protein. The method also optionally includes reacting the aminopolysaccharide film, after activation thereof, with the protein, so that the protein assembles on and is coupled to the substrate, thereby forming a bioelectronic device. The protein can include single or multiple protein species, and including biosensing proteins. Additional methods include biosensing of electrochemically active compounds either present in a sample or generated during a biological recognition event and devices useful in such methods.Type: GrantFiled: October 2, 2009Date of Patent: October 22, 2013Assignee: University of Maryland, College ParkInventors: Yi Liu, Xiao-Wen Shi, Gregory F. Payne, W. Lee Meyer
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Patent number: 8415851Abstract: A terminal element, a motor winding structure and a manufacturing method are disclosed. The terminal element includes a fixing portion, a positioning portion and a buffering portion. The fixing portion is disposed at one end of the terminal element and has a serrate fixing pattern. The fixing portion is connected with a connecting position of the motor winding bobbin. The positioning portion is disposed adjacent to the fixing portion and urged against the motor winding structure for positioning the fixing portion while it is connected with the connecting position. The buffering portion has a first bending and a second bending, and the first bending is connected to positioning portion. The buffering portion absorbs the force applied to the terminal element.Type: GrantFiled: February 9, 2010Date of Patent: April 9, 2013Assignee: Delta Electronics, Inc.Inventors: Wen-Shi Huang, Chin-Chu Hsu, Chun-Hua Yang, Chia-Ying Hsu
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Publication number: 20130059946Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.Type: ApplicationFiled: April 25, 2012Publication date: March 7, 2013Inventors: Jingxu ZHU, Hiran PERINPANAYAGAM, Mohammad S. MOZUMDER, Hui ZHANG, Wen SHI
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Patent number: 8323990Abstract: Embodiments in accordance with the present invention relate to structures and methods allowing stress-induced electromigration to be tested in multiple interconnect metallization layers. An embodiment of a testing structure in accordance with the present invention comprises at least two segments of a different metal layer through via structures. Each segment includes nodes configured to receive force and sense voltages. Selective application of force and sense voltages to these nodes allows rapid and precise detection of stress-induced immigration in each of the metal layers.Type: GrantFiled: March 22, 2007Date of Patent: December 4, 2012Assignee: Semiconductor Manufacturing International (Shanghai) CorporationInventors: Wen Shi, Wei Wei Ruan
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Patent number: 8324766Abstract: A heat-dissipation structure for a motor. The heat-dissipation structure comprises a shaft, a seat and a rotator. The rotator coupled to the seat by the shaft comprises a housing and a cover. The housing comprises an inner side connected to the shaft and a bottom comprising at least one through hole. The cover is connected to an exterior of the bottom of the housing and a distance is formed between the cover and the housing, so that the cover prevents objects from entering the through hole.Type: GrantFiled: March 22, 2010Date of Patent: December 4, 2012Assignee: Delta Electronics, Inc.Inventors: Hung-Chi Chen, Ying-Chi Chen, Te-Tsai Chuang, Kuo-Cheng Lin, Wen-Shi Huang
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Patent number: 8283780Abstract: A surface mount semiconductor device has a semiconductor die encapsulated in a molding compound. Electrical contact elements of an intermediate set are disposed on the molding compound. A set of coated wires electrically connect bonding pads of the semiconductor die and the electrical contact elements of the intermediate set. A layer of insulating material covers the coated wires, the die and the electrical contact elements of the intermediate set. Electrically conductive elements are exposed at an external surface of the layer of insulating material and contact respective electrical contact elements of the intermediate set through the layer of insulating material.Type: GrantFiled: November 25, 2010Date of Patent: October 9, 2012Assignee: Freescale Semiconductor, IncInventors: Wai Yew Lo, Ly Hoon Khoo, Wen Shi Koh
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Publication number: 20120133053Abstract: A surface mount semiconductor device has a semiconductor die encapsulated in a molding compound. Electrical contact elements of an intermediate set are disposed on the molding compound. A set of coated wires electrically connect bonding pads of the semiconductor die and the electrical contact elements of the intermediate set. A layer of insulating material covers the coated wires, the die and the electrical contact elements of the intermediate set. Electrically conductive elements are exposed at an external surface of the layer of insulating material and contact respective electrical contact elements of the intermediate set through the layer of insulating material.Type: ApplicationFiled: November 25, 2010Publication date: May 31, 2012Applicant: FREESCALE SEMICONDUCTOR, INCInventors: Wai Yew Lo, Ly Hoon Khoo, Wen Shi Koh
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Publication number: 20120103822Abstract: Methods for the generation of hydrogels formed by electrodeposition of an electroaddressable polymer are described. The hydrogels may contain one or more cell populations electroaddressed or electroaddressable to a location within the hydrogel and where the cells of the cell populations are entrapped by the hydrogel and are capable of expansion within the hydrogel and may be releasable from the hydrogel. Further provided are electroaddressable polysaccharide blends for the in-film expansion of a cell population, allowing probing of the cells and formation of immunocomplexes. Further provided are methods of using hydrogels containing electroaddressed or electroaddressable cell populations in in-film bioprocessing methods such as cell-based biosensing, protein-based biosensing, and in studies of cell signaling.Type: ApplicationFiled: April 27, 2010Publication date: May 3, 2012Applicant: UNIVERSITY OF MARYLAND COLLEGE PARKInventors: Xiao-Wen Shi, Yi Liu, Gregory F. Payne, Xiaohua Yang
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Patent number: 8167532Abstract: A cowling of the invention includes a cover body and an empennage connected with the cover body. The cover body includes an accommodating space for receiving an impeller, and a first opening serving as an air inlet for the impeller. According to the wind direction, the empennage will adjust the first opening to the proper position to face the wind.Type: GrantFiled: January 31, 2007Date of Patent: May 1, 2012Assignee: Delta Electronics, Inc.Inventors: Wei-Chun Hsu, Shun-Chen Chang, Wen-Shi Huang
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Patent number: 8164091Abstract: Multi-purpose poly edge test structure. According to an embodiment, the present invention provides a test structure. The test structure includes a doped silicon substrate, the doped silicon substrate being grounded, the doped silicon substrate including a first gate structure and a second gate structure, the first and second gate structures overlaying the doped silicon substrate. The test structure also includes a first conducting pad being electrically coupled to the first gate structure. The test structure also includes a second conducting pad being electrically coupled to the second gate structure.Type: GrantFiled: September 16, 2008Date of Patent: April 24, 2012Assignee: Semiconductor Manufacturing International (Shanghai) CorporationInventors: Wen Shi, Wei Wei Ruan
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Patent number: 8133005Abstract: A blower includes a housing and a plurality of impellers. The impellers are disposed in the housing, and a mutual air-gathering passage is formed between the impellers and the housing. Compared to the prior art, the mutual air-gathering passage of the blower of the present invention can collect the airflow and stabilize the airflow. Thus, the air pressure at the air outlet is increased, and the overall airflow performance is improved.Type: GrantFiled: April 27, 2006Date of Patent: March 13, 2012Assignee: Delta Electronics, Inc.Inventors: Wei-Chun Hsu, Shun-Chen Chang, Wen-Shi Huang
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Patent number: 8057168Abstract: A fan includes an impeller and a housing. The housing includes a base portion and a sidewall portion disposed around and connected with the base portion. A plurality of first recesses are disposed at a connection between the base portion and the sidewall portion, and a rib is disposed between every two adjacent first recesses. The impeller includes a hub having a base portion and a wall portion disposed around and connected with the base portion, and a plurality of blades disposed on a circumference of an outer wall of the wall portion. A plurality of third recesses are disposed at a connection between the base portion of the hub and the wall portion, and a rib is disposed between every two adjacent third recesses. The recesses can prevent the impeller and the housing from the defects and shape deformation caused by injection molding during manufacturing processes, and enhance the structural strength.Type: GrantFiled: March 1, 2006Date of Patent: November 15, 2011Assignee: Delta Electronics, Inc.Inventors: Wei Chun Hsu, Shun Chen Chang, Wen Shi Huang
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Patent number: 8029236Abstract: A heat dissipation fan includes a housing, a first rotor, a second rotor, a base and a plurality of static blades. The first rotor has a shaft and a plurality of rotor blades. The second rotor is coupled to the first rotor and has a plurality of rotor blades. The base is disposed in the housing for supporting the first and second rotors. The static blades are disposed between the housing and the base, wherein a rear portion of each static blade extends along an axial line of the heat dissipation fan for improving the working efficiency of the second rotor.Type: GrantFiled: February 22, 2007Date of Patent: October 4, 2011Assignee: Delta Electronics, Inc.Inventors: Shun-Chen Chang, Chia-Ming Hsu, Tsung-Yu Lei, Chin-Sheng Liu, Peng-Chu Tao, Chia-Ching Lin, Shih-Wei Huang, Ching-Chuang Mai, Wen-Shi Huang, Hsiou-Chen Chang
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Patent number: 8029237Abstract: A centrifugal fan. The centrifugal fan has at least one air inlet and one air outlet, and at least one set of rotor blades. A sidewall extends downward from an inner margin of the air inlet to define an air-gathering chamber in the housing of the centrifugal fan for increasing airflow pressure and heat dissipating efficiency.Type: GrantFiled: August 13, 2007Date of Patent: October 4, 2011Assignee: Delta Electronics, Inc.Inventors: Shun-Chen Chang, Wen-Shi Huang
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Publication number: 20110217785Abstract: A method of forming a bioelectronic device including a protein on an electrically conductive substrate, by electro-depositing aminopolysaccharide chitosan on the substrate while applying a cathodic voltage to the substrate, to form an aminopolysaccharide chitosan film thereon, applying an anodic voltage to the substrate in the presence of NaCl to activate the aminopolysaccharide chitosan film so that it is reactive with protein. The method also optionally includes reacting the aminopolysaccharide film, after activation thereof, with the protein, so that the protein assembles on and is coupled to the substrate, thereby forming a bioelectronic device. The protein can include single or multiple protein species, and including biosensing proteins. Additional methods include biosensing of electrochemically active compounds either present in a sample or generated during a biological recognition event and devices useful in such methods.Type: ApplicationFiled: October 2, 2009Publication date: September 8, 2011Applicant: UNIVERSITY OF MARYLAND, COLLEGE PARKInventors: Yi Liu, Xiao-Wen Shi, Gregory F. Payne, W. Lee Meyer
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Publication number: 20110195860Abstract: Biofunctionalized fibers including a fiber platform and a histidine-tagged protein and, optionally, an antibody. Chitosan is a fiber useful as the fiber platform. The fiber platform may be treated with nickel or may be directly linked to the histidine-tagged protein e.g., histidine-tagged streptococcal IgG-binding protein, protein G, protein G3T, GFP or RFP. The resulting biofunctionalized fibers can be assembled into protein fiber assemblies by a variety of biofabrication methods. The fiber assemblies, e.g., in the form of woven fabrics, are useful for (i) antigen capture; (ii) immunoanalysis, and/or (iii) multiplexed analysis. In one fabrication, each fiber of a fiber assembly presents a specific antibody, and mixing and matching of fibers, for example by weaving of fabrics from various antibody-presenting fibers, allows for multiple antigens to be captured simultaneously for multiplexed analysis.Type: ApplicationFiled: April 7, 2009Publication date: August 11, 2011Applicant: UNIVERSITY OF MARYLAND, COLLEGE PARKInventors: Xiao-Wen Shi, Hsuan-Chen Wu, Gregory F. Payne, William E. Bentley
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Patent number: 7988407Abstract: An axial fan is provided. The axial fan includes a base, a rotor, a guide and a plurality of blades. The guide connects to a guide tube to provide airflow. Each blade has a passive part and an active part, wherein the passive part is driven by the airflow from the guide to rotate the active part synchronously. The axial fan increases air quantity and decreases air pressure to provide efficient heat dissipation.Type: GrantFiled: March 31, 2006Date of Patent: August 2, 2011Assignee: Delta Electronics Inc.Inventors: Wei-Chun Hsu, Shun-Chen Chang, Wen-Shi Huang
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Patent number: 7959413Abstract: A fan includes an impeller and a motor. The impeller includes a hub and a plurality of blades. The hub has a top portion, a connection portion, and at least one airflow-guiding portion. The top portion is connected to the connection portion. The blades are disposed around the connection portion. The motor is disposed corresponding to the impeller and used to drive the impeller to rotate. The airflow-guiding portion is disposed between two adjacent blades.Type: GrantFiled: January 19, 2007Date of Patent: June 14, 2011Assignee: Delta Electronics, Inc.Inventors: Shihhua Ho, Shihying Huang, Tsung Yu Lei, Chung-kai Lan, Huan-Chi Chen, Wen-Shi Huang