Abstract: Electroplating composition and method. In one embodiment, the composition comprises an electrolyte solution and an amine-based copolymer comprising monomer units of ethylene oxide and propylene oxide, with the propylene oxide present in a quantity of at least about 70 wt %. The method comprises electroplating a metal onto a substrate from the electroplating composition of the invention.

Abstract: A method of forming a semiconductor device comprising: forming a gate dielectric layer over a channel region; forming a gate electrode on the gate dielectric layer; forming source/drain regions substantially aligned with respective edges of the gate electrode with the channel region therebetween; forming a thin metal layer on the source/drain regions; forming a metal alloy layer on the thin metal layer; and transforming the thin metal layer into a low resistance metal silicide.

Abstract: A conductive polymer between two metallic layers acts a glue layer, a barrier layer or an activation seed layer. The conductive polymer layer is employed to encapsulate a copper interconnection structure to prevent copper diffusion into any overlying layers and improve adhesive characteristics between the copper and any overlying layers.

Abstract: Methods and apparatuses for electrochemically depositing a metal layer onto a substrate. An electrochemical deposition apparatus comprises a substrate holder assembly including a substrate chuck and a relatively soft cathode contact ring. The cathode contact ring comprises an inner portion and an outer portion, wherein the inner portion directly contacts the substrate. An anode is disposed in an electrolyte container. A power supply connects the substrate holder assembly and the anode.

Abstract: A copper filled semiconductor feature and method of forming the same having improved bulk properties the method including providing a semiconductor process wafer having a process surface including an opening for forming a semiconductor feature; depositing at least one metal dopant containing layer over the opening to form a thermally diffusive relationship to a subsequently deposited copper layer; depositing said copper layer to substantially fill the opening; and, thermally treating the semiconductor process wafer for a time period sufficient to distribute at least a portion of the metal dopants to collect along at least a portion of the periphery of said copper layer including a portion of said copper layer grain boundaries.

Abstract: An improvement in a copper damascene process is disclosed. The improvement comprises the step of projecting an electron beam on to a chemical mechanically polished material surface having copper filled etched trenches at a known angle of incidence with respect to the material surface for a known period of time, the electron beam having a beamwidth substantially covering the material surface and a known intensity.

Abstract: A planar monopole antenna is provided. The planar monopole antenna comprises a ground plate, a radiating metal plate, and a multi-branch feeding metal plate. The multi-branch feeding metal plate is formed between the ground plate and the radiating metal plate, and has a single feeding point thereon. The radiating metal plate and the multi-branch feeding metal plate together can also be fabricated from a single metal plate by using a line-cutting or stamping technique, or formed on a same dielectric substrate by using a printing or etching technique. Thus, the planar monopole antenna is easy to construct at a low cost.

Abstract: The top surfaces of conductive features are treated with a treatment solution before forming a passivation layer over the conductive features. The treatment solution includes a cleaning solution and a chemical grafting precursor. The treatment solution may also include a leveling and wetting agent to improve coverage uniformity of the chemical grafting precursor. The method results in a uniform passivation layer formed over conductive features across a surface of a workpiece.

Abstract: The present invention relates to a pointing device with multidirectional window viewing function. The pointing device with multidirectional window viewing function comprises a multidirectional roller, which moves in at least three directions and triggers actuating signals corresponding to each direction, including an oblique direction; and a controller, which receives the actuating signal and produces its corresponding source packet, which is received by a receiving terminal. By manipulating the multidirectional roller, a user is able to view and move the text in the window in multiple directions corresponding to the movement of the roller.

Abstract: A blade server system with a management bus and method for managing the same. The blade server system includes a connection board and a management module. The connection board is used for modular interconnection, including communication paths for conducting signals including a management bus signal group and a first bus signal group. The management module is used for management of the blade server system using signals including the management bus signal group and the first bus signal group. If a module is detected, the management module selects the detected module through the management bus and acquires module configuration information of the detected module through the first bus signal group. Distribution of power from a power source to the blade server system is determined according to system configuration information including the module configuration information of the module so that the power source is prevented from being overloaded.

Abstract: A system and method for providing a passivation structure for semiconductor devices is provided. In an embodiment, the passivation structure comprises a first barrier layer and a second barrier layer, wherein the second barrier layer may comprise a material, such as cobalt and/or nickel, that is less pure than the first barrier layer. In another embodiment, a single gradient barrier layer is formed. In this embodiment the single gradient barrier layer exhibits a greater pure conductive material, such as cobalt and/or nickel, nearer the conductive line than near the surface.

Abstract: An ultra-wideband (UWB) antenna is provided. It comprises a dielectric substrate, a ground plate, a metal plate, and a transmission line. The ground plate formed on the dielectric substrate has a first slot thereon. The metal plate formed on the dielectric substrate has a feed-point and a second slot thereon. The total length of the second slot is about a half-wavelength at the desired notched frequency for the UWB antenna. By embedding the second slot of a suitable length on the metal plate resided in the first slot, a band notched characteristic is achieved for the antenna in the 5 GHz band, thereby overcoming the problem of signal interference with the UWB operations. The disclosed antenna and the circuitry for the antenna system are easily integrated. With the simple structure, the fabrication cost for the antenna is also reduced.

Abstract: A method of forming an integrated circuit interconnect structure is presented. A first conductive line is formed over a semiconductor substrate. A conductive cap layer is formed on the first conductive line to improve device reliability. An etch stop layer (ESL) is formed on the conductive cap layer. An inter-level dielectric (IMD) is formed on the ESL. A via opening and a trench are formed in the ESL, IMD, and conductive cap layer. A recess is formed in the first conductive line. The recess can be formed by over etching when the first dielectric is etched, or by a separate process such as argon sputtering. A second conductive line is formed filling the trench, opening and recess.

Abstract: An impedance matching means according to the present invention is used with an antenna and is realized by a parasitic element (3) for tuning an impedance of the antenna. The antenna comprises a grounding plate (2), an radiating body (1) arranged on the grounding plate (2) and a transmission line (4) coupled to said radiating body (1) and grounding plate (2). The parasitic element (3) formed of a narrow metal sheet and configured as a bridge shape is arranged on the grounding plate (2). The parasitic element (3) has a first and a second ends (311, 321), both of which are electrically connected to the grounding plate (2). The arrangement of the parasitic element (3) results in a change of the impedance of the antenna, so the impedance matching between the antenna and the transmission line (4) can be achieved.

Abstract: This invention is in the field of recombinant Plasmodium falciparum polypeptides and relates to recombinant or synthetic antigen compositions which comprise p42 antigens, and more specifically to methods and compositions for the expression of Plasmodium falciparum polypeptides in transgenic plants.

Abstract: An omnidirectional ultra-wideband monopole antenna, with the characteristics of simple structure, easy fabrication and low cost, mainly comprises a ground plane, a U-shaped radiating member above the ground plane and a feeding member for feeding signals to the radiating member. The radiating member further comprises a first sub-radiating member parallel to the ground plane, with a first side edge and a corresponding second side edge, a second sub-radiating member connected to the first side edge and perpendicular to the first sub-radiating member, forming a first angle therebetween, and a third sub-radiating member connected to the second side edge to form a second angle. The second sub-radiating member and the third sub-radiating member are extended in the same upright direction above the ground plane. The antenna can provide good omnidirectional radiation patterns for frequencies across a very wide operating bandwidth.

Abstract: A method of controlling surge current in fan modules is applied in a blade server. The blade server includes a fan module having a first fan motor, a second fan motor, a first resistor/capacitor (RC) circuit and a second RC circuit. The blade server generates a control signal for controlling the first and the second fan motors. The first RC circuit receives and delays the control signal for a period of first time to output a first delay control signal for driving the first fan motor. The second RC circuit receives and delays the control signal for a period of second time to output a second delay control signal for driving the second fan motor. The first time is different from the second time and thus the first surge current in the first fan motor and the second surge current in the second fan motor are generated at different time.

Abstract: Sensor constructs for detecting the presence of an analyte in a sample comprise a molecular scaffold, a pair of labels which interact via Förster resonance energy transfer, and at least one molecular recognition domain. When the analyte is bound by the molecular recognition domain, the Förster resonance energy interaction between the pair of labels is disrupted, resulting in a changed optical signal.

Abstract: An all terrain vehicle glove compartment provided below the seat of the vehicle to increase usable space includes an extension deck extending from the base of the compartment towards the rear or along the direction of the width of body of the vehicle to define a chamber for accommodating a battery; two positioning ribs extending from the bottom of the extension deck to secure the battery in position; and a lid fastened to the extension deck to fend off water and dust, and to serve as an access for replacing or providing service to the battery.

Abstract: An antenna assembly (1) includes a substrate having a first surface (11) and a second surface (12) opposite to the first surface, a dual-band dipole antenna (5) having a symmetrical structure and arranged on the first surface, a feed cable (4) arranged on the first surface for feeding the dipole antenna, and a parasitic element (8) arranged on the second surface. The parasitic element has a pair of symmetrical first and second parasitic sections. The first parasitic section includes a first, a second and a third patches (61-63), and the second parasitic section includes a first, a second and a third pieces (71-73). The first, the second and the third patches are separated from each other. The first, the second and the third pieces are separated from each other. The parasitic element can increase the gain of the dipole antenna through coupling with the dipole antenna.