Abstract: A medication concentration detecting device includes a medicine container, a three-way pipe, a light emitting member, a first light receiver and a processor. The medicine container has a chamber configured for accommodating nebulized medicine. The three-way pipe has a passageway connected to the chamber for the nebulized medicine to flow along the passageway. The light emitting member is disposed on the three-way pipe and configured for emitting a light beam toward the passageway. The first light receiver is disposed on the three-way pipe and configured for receiving the light beam and outputting a luminous flux signal. The processor is connected to the first light receiver and configured for calculating a luminous flux reference value according to the luminous flux signal. The luminous flux reference value is used for determining whether outputs a low nebulized medicine concentration warning.

Abstract: A gate driving circuit includes a plurality of shift registers arranged to output the gate driving signals in sequence. The shift registers are divided into groups arranged in sequence, wherein the driving signal from a first one of a N+1th group of shift registers is next to the driving signal from a first one of a Nth group of shift registers; and at least one first compensation circuit connected to the last one of the Nth group of shift registers and the first one of the N+1th group of shift registers, wherein the first compensation circuit provides a first control signal to enable the last one of the Nth group of shift registers to perform signal holding, and provides a second control signal to enable the first one of the N+1th group of shift registers to perform pre-charging, wherein N is an integer greater than zero.

Abstract: A touch display device at least including a gate driver is provided. The gate driver at least includes a pull-up control circuit, a pull-down control circuit and a pull-up output circuit. The pull-up control circuit sets the voltage level of a first node to a first voltage level. The pull-down control circuit is configured to set the voltage level of the first node to a second voltage level and includes a first transistor receiving an operation voltage. The second voltage level is lower than the first voltage level. The pull-up output circuit generates a scan signal according to the voltage level of the first node. During a first display period and a second display period, the operation voltage is equal to a first gate voltage. During a touch-sensing period, the operation voltage is equal to a second gate voltage that is lower than the first gate voltage.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a chitosan; a dicarboxylic acid, wherein the dicarboxylic acid is selected from the group consisting of propanedioic acid and 2-hydroxypropanedioic acid; a source of iron ions; a colloidal silica abrasive with a positive surface charge; and, optionally pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) and some of the titanium (Ti) is polished away from the substrate with a removal selectivity for the tungsten (W) relative to the titanium (Ti).

Abstract: A process for chemical mechanical polishing a substrate containing titanium nitride and titanium is provided comprising: providing a polishing composition, containing, as initial components: water; an oxidizing agent; a linear polyalkylenimine polymer; a colloidal silica abrasive with a positive surface charge; a carboxylic acid; a source of ferric ions; and, optionally pH adjusting agent; wherein the polishing composition has a pH of 1 to 4; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein at least some of the titanium nitride and at least some of the titanium is polished away with a selectivity between titanium nitride and titanium.

Abstract: A method of displaying frame rate includes the following steps. First, a quantity of image display units of a display is detected. Then, a plurality of refresh rate images are provided according to the quantity of image display units and by using an on-screen display manipulation function. A refresh rate of the display is calculated, to provide refresh rate data. One of the refresh rate images corresponding to the refresh rate data is determined, and is displayed on the display.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; an allylamine additive; a carboxylic acid; a source of iron ions; a colloidal silica abrasive with a positive surface charge; and, optionally pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein the tungsten (W) is selectively polished away from the substrate relative to the titanium (Ti).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a polyglycol or polyglycol derivative; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: The present invention provides substantially nonionic brush polymers having pendant polyether groups, preferably poly(alkylene glycol) groups, which polymers are useful as synthetic polymer substitutes for cellulose ethers in mortars and hydraulic binders. The brush polymers are preferably crosslinked, such as with ethylene glycol di(meth)acrylates.

Abstract: A motor control system includes an electric motor and inverter. The electric motor includes a stator, rotor, and winding structure. The stator includes an iron core with a plurality of slots formed therein along a radial direction of the stator. The winding structure has a plurality of hairpin wires with pins disposed in the slots. The winding structure is configured to provide a plurality of phase windings and each phase winding includes a plurality of motor windings. The inverter includes a switching controller configured to control the turning-on and turning-off of the motor windings of each phase winding of the winding structure. When the electric motor operates in a high-speed mode, the switching controller controls the turning-on and turning-off of the motor windings of each phase winding such that a number of the phase windings turned-on is 1/3 less than a number of all the phase windings.

Abstract: A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a thiolalkoxy compound; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a polyglycol or polyglycol derivative; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A solar cell device and a method of fabricating the same are described. The method of fabricating a solar cell includes forming a photovoltaic substructure including a substrate, back contact, absorber and buffer, forming a transparent cover separate from the photovoltaic substructure including a transparent layer and a plasmonic nanostructured layer in contact with the transparent layer, and adhering the transparent cover on top of the photovoltaic substructure. The plasmonic nanostructured layer can include metal nanoparticles.

Abstract: The present invention provides compositions useful as a replacement for cellulose ether in cement, plaster or mortar compositions comprising i) nonionic or substantially nonionic vinyl or acrylic brush polymers having pendant or side chain polyether groups, and having a relative weight average molecular weight of from 140,000 to 50,000,000 g/mole, and ii) aromatic cofactors containing one or more phenolic groups, such as catechol tannins, phenolic resins, polyphenolics, and napthhols or, in combination, one or more aromatic groups with at least one sulfur acid group, such as naphthalene sulfonate aldehyde condensate polymers, poly(styrene-co-styrene sulfonate) copolymers, and lignin sulfonates, preferably branched cofactors, including phenolic resins, aldehyde condensate polymers and lignin sulfonates. The compositions may comprise a dry powder blend of i) and ii), one dry powder of both i) and ii), or an aqueous mixture.

Abstract: A device includes a through substrate via (TSV) extending through a device substrate. The TSV includes a first conductive material having a sidewall, a protruding end of the TSV protruding from a second side of the device substrate. A liner covers the sidewall of the first conductive material from a below the top surface of the protruding end of the TSV to an opposite end of the TSV. A passivation layer is disposed over the second side of the device substrate and over a portion of the liner disposed on the protruding end of the TSV, the passivation layer having a stair-step surface extending away from the TSV. A conductive interface layer is disposed over the passivation layer, the sidewall of the first conductive material, and the top surface of the protruding end of the TSV. A second conductive material is disposed over the first conductive material.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a dihydroxy bis-sulfide; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A projection lens and a projection apparatus are provided. The projection lens has a screen side and an image side. The projection lens includes a first lens group, a second lens group, and a third lens group. The first lens group disposed between the screen side and the image side includes a first, a second, and a third lenses arranged sequentially from the screen side to the image side. The second lens group disposed between the first lens group and the image side includes a fourth, a fifth, a sixth, a seventh, an eighth, a ninth, and a tenth lenses arranged sequentially from the screen side to the image side. The third lens group disposed between the second lens group and the image side includes an eleventh and a twelfth lenses, and a distance between the twelfth lens and the light valve is a constant.

Abstract: A power supply module coupled with a primary winding of a power conversion module, the power supply module includes a plurality of power-controlling modules, a plurality of second switches, and a microprocessor. Each power-controlling module includes an auxiliary winding and a first switch electrically connected in series, and each auxiliary winding is magnetic coupled with the primary winding. Each second switch is electrically connected to one of the power-controlling units. The microprocessor is electrically connected to the first switches of the power-controlling modules and the second switches. The microprocessor places at least one first switch and one of the second switches in a conducting state to make the first switch in the conducting state and the second switch in the conducting state electrically connect in series and output an electric power to power the power conversion module.

Abstract: A linear slide includes: a rail; a slide block, which is mounted on the rail and is movable relative to the rail; a plurality of rolling elements, which are arranged between the rail and the slide block; two end caps, which are respectively mounted to two ends of the slide block, the end caps each comprising a mounting trough formed therein to correspond to and face the rail, the mounting trough having a wall; and two dust protection plates, each of which is arranged in each of the mounting troughs, each of the dust protection plates comprising a main body and two elastic sections projecting from two opposite sides of the main body such that one of the elastic sections is in contact engagement with the wall and the other one of the elastic sections is engageable with a surface of the rail.