Abstract: A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.

Abstract: An intelligent window allowing ventilation has an outer frame, a sliding frame, an upper locking rod, a lower locking rod, a driving module, a power supply module, and a switch assembly. The sliding frame is slidably mounted in the outer frame. The switch assembly controls the driving module to selectively drive the upper locking rod and the lower locking rod to two locking positions respectively, two ventilation positions respectively or two unlocking positions respectively. Since no handle is needed, an appearance of the intelligent window is neat and scenery outside the intelligent window would not be sheltered. In addition, by actuating the switch module to electrically drive the upper locking rod and the lower locking rod, a user is able to switch the intelligent window to a locked state, a ventilation state or a unlocked state. It is labor-saving and simple in operation.

Abstract: A solid-liquid separation device includes a kettle body, a piston, a stirrer, a separation plate having filtration pores, and a filtration mesh. The kettle body is hollow along an axial direction to form a chamber body. The separation plate is fitly installed in the chamber body, and divides the chamber body into a washing chamber and a draining chamber. The piston and the stirrer are fitly disposed in the washing chamber. The filtration mesh is attached on a side of the separation plate to cover the filtration pores. The kettle body is further provided with a feed inlet, a water inlet, a material outlet, and a liquid outlet. The feed inlet and material outlet are communicated with the washing chamber, and the water inlet and the liquid outlet are communicated with the draining chamber. The method includes the following steps: feeding, solid-liquid separation, washing, and material discharge.

Abstract: A video is received. One or more subtitles are determined for the video. Whether a word found in a background of the video is similar to a word found in the one or more subtitles is determined. Responsive to determining the word found in the background of the video is similar to the word found in the one or more subtitles, one or more updated subtitles are generated. The one or more updated subtitles include the word found in the background of the video and remove the word found in the one or more subtitles that is similar. A metric for the one or more updated subtitles is calculated. Whether the metric is larger than a threshold is determined. Responsive to determining the metric is larger than the threshold, the video is updated to include the one or more updated subtitles.

Abstract: This invention relates to the field of contaminated plastic waste decomposition. More specifically, the invention comprises methods and systems to decompose contaminated plastic waste and transform it into value-added products.

Abstract: The disclosure provides a smart liquor cabinet and a management method for the liquor cabinet. In the management method, a voice command is received and an intent of the voice command is determined. If the intent of the voice command is related to a remaining space of the liquor cabinet, then the remaining space with no liquor in the liquor cabinet is determined. If the intent of the voice command is related to an inventory situation of the liquor cabinet, then the inventory situation of stored liquor in the liquor cabinet is determined. The response of the intent is outputted. The response is related to the remaining space or the inventory situation. In this way, the liquor and space in the liquor cabinet may be counted easily and quickly.

Abstract: A portable electronic device includes a host, a sliding base, a base plate, a display and a sliding rotating element. The sliding base is disposed on the host and has at least one guiding portion and at least one sliding slot connected to the guiding portion. The base plate is disposed on the sliding base. The display is pivoted on the base plate. The sliding rotating element is fixed to the base plate and is rotatably and slidably connected to the sliding base, and the display and the base plate are configured to rotate or slide on the sliding base along with the sliding rotating element.

Abstract: Sacrificial pillars for a semiconductor device assembly, and associated methods and systems are disclosed. In one embodiment, a region of a semiconductor die may be identified to include sacrificial pillars that are not connected to bond pads of the semiconductor die, in addition to live conductive pillars connected to the bond pads. The region with the sacrificial pillars, when disposed in proximity to the live conductive pillars, may prevent an areal density of the live conductive pillars from experiencing an abrupt change that may result in intolerable variations in heights of the live conductive pillars. As such, the sacrificial pillars may improve a coplanarity of the live conductive pillars by reducing variations in the heights of the live conductive pillars. Thereafter, the sacrificial pillars may be removed from the semiconductor die.

Abstract: A radiative heat collective bonder or gangbonder for packaging a semiconductor die stack is provided. The bonder generally includes a shroud positioned at least partially around the die stack and a radiative heat source positioned inward of the shroud and configured to emit a radiative heat flux in a direction away from the shroud. The bonder may further include a bondhead configured to contact the backside of the topmost die in the die stack and optionally include another bondhead configured to contact a substrate beneath the die stack. The radiative heat source may be configured to direct the radiative heat flux to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack. One or both of the bondheads may be configured to concurrently direct a conductive heat flux into the die stack.

Abstract: The present invention provides a baby stroller frame linked folding device. A linked folding joint is provided on the upper end of a rear leg frame and is pivotally connected with a front leg frame and a handlebar frame. The handlebar frame comprises a lower handlebar frame that is pivotally connected to the linked folding joint, a handlebar folding clutch joint configured on the upper end of the lower handlebar frame, and an upper handlebar frame pivotally connected to the handlebar folding clutch joint.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. At least one first interconnect is a first dummy interconnect. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. At least one second interconnect is a second dummy interconnect. The second semiconductor structure further includes a second bonding layer including second bonding contacts. Each second interconnect is in contact with a respective second bonding contact. The semiconductor device further includes a bonding interface between the first and second bonding layers.

Abstract: A camera module aligning method includes the following steps. Firstly, a reference chart having plural chart characteristic points is provided. Then, a camera module is used to shoot the reference chart, and an installation position and an installation posture of the camera module are acquired according to an internal parameter matrix and an external parameter matrix. When the camera module shoots the reference chart and an image is formed on an imaging plane of the camera module, a relationship between at least one image characteristic point of the image and the corresponding chart characteristic point complies with a standard relationship. The standard relationship is defined by the internal parameter matrix and the external parameter matrix.

Abstract: A bumped solder pad and methods for adding bumps to a solder pad are provided. A substrate is provided having metal layer formed thereon and a solder pad formed from a portion of the metal layer. A surface treatment is applied to the solder pad. The surface treatment is patterned. The surface treatment is etched to produce at least one bump on the solder pad.

Abstract: A disposable eggshell eco-friendly material and manufacturing method are disclosed.

Abstract: Methods for improving profiles of channel regions in semiconductor devices and semiconductor devices formed by the same are disclosed. In an embodiment, a method includes forming a semiconductor fin over a semiconductor substrate, the semiconductor fin including germanium, a germanium concentration of a first portion of the semiconductor fin being greater than a germanium concentration of a second portion of the semiconductor fin, a first distance between the first portion and a major surface of the semiconductor substrate being less than a second distance between the second portion and the major surface of the semiconductor substrate; and trimming the semiconductor fin, the first portion of the semiconductor fin being trimmed at a greater rate than the second portion of the semiconductor fin.

Abstract: A clothing pattern making management system, applicable to a server and used and used for allowing users to connect and manage a plurality of clothing pattern making data via a network, at least includes a database and a login and authority management module, a search and viewing module, a connection and upload module, a management and download module. Through the data connection to a business system, the system is able to facilitate the users to perform data upload and management in order to achieve proper preservation and management of large quantity of pattern drawings for various styles of clothes and for all stages, and to achieve the effects of learning exchange and passing on of techniques.

Abstract: This invention relates to the field of plastic waste decomposition. More specifically, the invention comprises products obtained from the decomposition of plastic waste.

Abstract: The present invention is related to a pair of underpants for patients with bedsores. The underpants include an underpants body and a patch. The underpants body includes a front half portion, a rear half portion opposite to the front half portion, and a crotch portion corresponding to the genital of the patient with bedsores and connected to the front half portion and the rear half portion to form a lumbar opening and two leg openings. The patch includes a fabric layer, an absorbent layer and a waterproof layer. The absorbent layer attaches to the fabric layer, while the waterproof layer attaches to the absorbent layer. The waterproof layer is adapted to attach to an inside surface of the underpants body so that the fabric layer may contact with the bedsore parts of the patient and thus absorb the moisture of the bedsores.

Abstract: In one aspect, the disclosure relates to CO2-free and/or low-CO2 methods of co-producing hydrogen and solid forms of carbon via natural gas decomposition using microwave radiation. The methods are efficient, self-sustaining, and environmentally benign. In a further aspect, the disclosure relates to recyclable and recoverable catalysts useful for enhancing the disclosed methods, wherein the catalysts are supported by solid forms of carbon. Methods for recycling the catalysts are also disclosed. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.