Abstract: The valve has a pair of mutually rotatable ceramic valve bodies within the bonnet that cooperate to allow a flow of water in one relative position and to block a flow of water in a second relative position. One valve body is engaged by the valve stem to rotate therewith while the second valve body is held fixed within the bonnet via radial projections that fit into recesses in the bonnet. An elastomeric ring of square cross-section is squeezed against the non-rotatable valve body by a spiral retaining ring that is positioned in a circumferential groove in the bonnet.

Abstract: A headband adjustment structure includes a rotary adjusting assembly, a wearing unit having an adjustable accommodation space, a cable management module located between the wearing unit and the rotary adjusting assembly for carrying a cable, an adjustment gear set linkably coupled to the cable management module, and a driving rotation shaft set passing through the wearing unit and the cable management module, and linkably coupled to the wearing unit and the adjustment gear set, and coaxially connected to the rotary adjusting assembly. When the rotary adjusting assembly rotates the driving rotation shaft set, the driving rotation shaft set synchronously moves the wearing unit to adjust the adjustable accommodation space, and moves the cable management module through the adjustment gear set. The amount of the movement of the cable management module is different from that of the wearing unit.

Abstract: In a method of operating an apparatus for manufacturing or analyzing semiconductor wafers, sound in a process chamber of the apparatus during an operation of the apparatus is detected. An electrical signal corresponding to the detected sound is acquired by a signal processor. The acquired electrical signal is processed by the signal processor. An event during the operation of the apparatus is detected based on the processed electrical signal. The operation of the apparatus is controlled according to the detected event.

Abstract: A method for forming a photomask includes receiving a mask substrate including a protecting layer and a shielding layer formed thereon, removing portions of the shielding layer to form a patterned shielding layer, and providing a BSE detector to monitor the removing of the portions of the shielding layer. When a difference in BSE intensities obtained from the BSE detector is greater than approximately 30%, the removing of the portions of the shielding layer is stopped. The BSE intensity in following etching loops becomes stable.

Abstract: A semiconductor memory device includes: a column of segments, each segment including bit cells; a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; each of the bit cells being connected correspondingly between the LWB and LWB_bar lines; and a distributed write driving arrangement including a global write driver connected between the GWB line and the LWB line and between the GWB_bar line and the LWB_bar line; and a local write driver included in each segment, each local write driver being connected between the GWB line and the LWB line and between the GWB_bar line and the LWB_bar line; and wherein: the global write driver and each local write driver is connected between the GWB line and the LWB line and between the GWB_bar line and the LWB_bar line.

Abstract: A holding bracket includes a frame body, an elastic rib, a stopping block and a cover plate. The frame body is formed with a holding space for holding a loaded object such as a hard disk. One end of the elastic rib is connected to the frame body, and the other end is a free end. The stopping block is protrusively formed on one surface of the elastic rib facing away from the holding space, and is located at the free end. The cover plate is pivotally connected to one end of the frame body.

Abstract: A method and a system for reducing radiation damage from a mobile terminal are provided. The method includes the following steps: responsive to the mobile terminal being in a call answering state, switching a main transceiver path of the mobile terminal to an upper antenna; and responsive to a receiver of the mobile terminal is in a working state, reducing a radio frequency transmit power of the upper antenna of the mobile terminal. When determining that the user is in a call while being close to the mobile terminal and that the main transceiver path is switched to the upper antenna, the present disclosure reduces the radio frequency transmit power of the upper antenna, of the mobile terminal by a radio frequency chip, thereby reducing an SAR value so as to prevent the radiation of the mobile terminal from harming the user.

Abstract: An electronic device including a first body, a supporting member, a second body, and an input assembly is provided. The first body is provided with a front end and a rear end opposite to each other. One terminal end of the supporting member is pivotally connected to the rear end of the first body. The second body is pivotally connected to the other terminal end of the supporting member. The input assembly is rotatably connected to the second body and is suitable for being carried by the first body. When a lower edge of the second body is located at the front end of the first body, the input assembly protrudes out from the front end of the first body.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. The second semiconductor structure further includes a second bonding layer including second bonding contacts. At least one second bonding contact is in contact with a respective second interconnect. At least another second bonding contact is separated from the second interconnects. The semiconductor device further includes a bonding interface between the first and second bonding layers.

Abstract: Herein provided are systems and methods for operating an aircraft engine during inclement weather. At least one image of a location substantially in line with a heading of the aircraft is acquired. Based on the at least one image, an inclement weather condition in the location is detected. An alert mode of the engine is triggered upon detecting the inclement weather condition. Responsive to the alert mode being triggered, at least one predetermined performance parameter of the engine is monitored. Upon detecting a change in the at least one predetermined performance parameter beyond a predetermined threshold, at least one operating condition of the engine is altered.

Abstract: A virtual object operating system and a virtual object operating method are provided. The virtual object operating method includes the following steps. Multiple images are obtained. A motion of an operating object in the images is determined. The operating object is existed in a real environment. A motion of a virtual object interacted with the operating object according to the motion of the operating object is determined. The virtual object is existed in a virtual environment. Accordingly, the motion of the operating object can be tracked without motion sensor on operating body portion of a user.

Abstract: A head mounted display system includes a scanning unit and a processing unit. The scanning unit is configured to scan a real object in a real environment so as to generate a scanning result. The processing unit is coupled to the scanning unit. The processing unit is configured to identify the real object according to the scanning result of the scanning unit, determine at least one predetermined interactive characteristic according to an identification result of the processing unit, create a virtual object in a virtual environment corresponding to the real object in the real environment according to the scanning result of the scanning unit, and assign the at least one predetermined interactive characteristic to the virtual object in the virtual environment. Therefore, the present disclosure allows a user to manipulate the virtual object in different ways more naturally, which effectively improves the user's interactive experience.

Abstract: A method comprises following steps. A first mandrel is formed over a target layer over a substrate, wherein the first mandrel comprises a mandrel island and a first mandrel strip, the mandrel island comprises a first sidewall and a second sidewall perpendicular to the first sidewall, and the first mandrel strip extends from the first sidewall of the mandrel island. A first spacer is formed along the first and second sidewalls of the mandrel island and a sidewall of the first mandrel strip. The first mandrel is removed from the target layer. The target layer is patterned when the first spacer remains over the target layer.

Abstract: A method of manufacturing a mask includes depositing an end-point layer over a light transmitting substrate, depositing a phase shifter over the end-point layer, depositing a hard mask layer over the phase shifter, and removing a portion of the hard mask layer and a first portion of the phase shifter to expose a portion of the end-point layer. The end-point layer and the light transmitting substrate are transparent to a predetermined wavelength.

Abstract: A system includes an inspection device and an image processing unit. The inspection device is configured to scan a wafer to generate an inspected image. The image processing unit is configured to receive the inspected image, and is configured to analyze the inspected image by using at least one deep learning algorithm in order to determine whether there is any defect image shown in a region of interest in the inspected image. When there is at least one defect image shown in the region of interest in the inspected image, the inspection device is further configured to magnify the region of interest in the inspected image to generate a magnified inspected image for identification of defects.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. At least one first interconnect is a first dummy interconnect. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. At least one second interconnect is a second dummy interconnect. The second semiconductor structure further includes a second bonding layer including second bonding contacts. Each second interconnect is in contact with a respective second bonding contact. The semiconductor device further includes a bonding interface between the first and second bonding layers.

Abstract: A seal for sealing a combustor heat shield against an interior surface of a combustor shell, the seal comprising: a first sealing surface on the interior surface of the combustor shell; and a second sealing surface on a rail on an edge of a heat shield, wherein each of the first and second sealing surfaces include first and second projections defining a non-linear leakage path between the projections.

Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.

Abstract: A method for real-time cloud container communications routing is provided. The method monitors network traffic to a first network resource located within a first region. Based on monitoring the network traffic, the method determines a second region associated with at least a portion of the network traffic. The method generates a resource backup of the first network reference. The resource backup represents a current state of the first network resource. The method transfers the resource backup to a second network resource associated with the second region and redirects at least a portion of the network traffic to the second network resource.

Abstract: A planting method of grass-white clover grassland includes the follows steps: (1) plowing and broadcasting Vicia villosa from July to August in a first year, applying a first base fertilizer, harvesting the Vicia villosa from December of the first year to March of a second year; (2) plowing and drilling corn from April to May of the second year, applying a second base fertilizer, weeding in a stage of 5 leaves of the corn, topdressing in a stage of 7-9 true leaves of the corn, and harvesting the corn in September of the second year; (3) plowing and drilling a grass from September to October of the second year, and applying a third base fertilizer; (4) not plowing but broadcasting white clover from May to June of a third year, applying a fourth base fertilizer, completing the planting.