Patents by Inventor Wen-Wei TAI

Wen-Wei TAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180031329
    Abstract: A heat dissipating device applied to a heat generating element includes a cooling device, a vapor chamber and a heat pipe, and the vapor chamber is attached to the heat generating element, and the heat pipe is thermally coupled to the cooling device and communicated with the vapor chamber, and the heat pipe has at least one flexible portion. The heat pipe may be bent or deformed at any angle or in any direction through the flexible portion, so that the heat pipe can be installed and aligned and the height difference can be adjusted with respect to the cooling device, the vapor chamber and the heat generating element in a better way. In the meantime, the heat dissipating device has a shock absorbing capability.
    Type: Application
    Filed: July 26, 2016
    Publication date: February 1, 2018
    Inventors: Cheng-Tu WANG, Shih-Ming WANG, Wen-Wei TAI