HEAT DISSIPATING DEVICE
A heat dissipating device applied to a heat generating element includes a cooling device, a vapor chamber and a heat pipe, and the vapor chamber is attached to the heat generating element, and the heat pipe is thermally coupled to the cooling device and communicated with the vapor chamber, and the heat pipe has at least one flexible portion. The heat pipe may be bent or deformed at any angle or in any direction through the flexible portion, so that the heat pipe can be installed and aligned and the height difference can be adjusted with respect to the cooling device, the vapor chamber and the heat generating element in a better way. In the meantime, the heat dissipating device has a shock absorbing capability.
The technical field generally relates to heat dissipating devices, more particularly to a heat dissipating device applied to an electronic product such as a computer or a flat PC.
BACKGROUND OF THE INVENTIONAs the computing speed of computer processors such as central processing units (CPU) increases constantly, the heat generated by the processors also becomes increasingly higher, and the conventional heat dissipating device composed of a heat sink and a fan no longer meets the using requirement of the present processors, and thus related manufacturers combine a heat pipe with the aforementioned heat sink to overcome the heat dissipation problem of the present processors.
In general, a conventional heat pipe comprises a metal tube, a capillary structure and a working fluid, wherein the metal tube has a sealed cavity, and the capillary structure is installed around the inner wall of the metal tube, and the working fluid is filled into the sealed cavity of the metal tube to form a heat pipe structure.
To take the limited using space of the surrounding environment and the thermal transmission at several positions or points of a heat pipe, most heat pipes are bent into an L-shape or a U-shape in practical applications. However, the bent portion of the heat pipe may cause the capillary structure to peel or fall off from the inner wall of the metal tube, so that the thermal transmission performance of the heat pipe is lowered significantly. In addition, the bent portion of the heat pipe can be bent once successfully, and if it is necessary to bend the bent portion of the heat pipe for a second time, the metal tube may be cracked easily and scrapped.
In view of the aforementioned problems of the prior art, the discloser of this disclosure based on years of experience in the related industry to conduct extensive researches and experiments, and finally provided a feasible solution to overcome the problems of the prior art.
SUMMARY OF THE INVENTIONIt is a primary objective of this disclosure to provide a heat dissipating device, comprising: a heat pipe having a flexible portion and capable of bending and deforming at any angle or in any direction through the flexible portion when the heat pipe is passed and fixed to a cooling device and a vapor chamber, so that the heat pipe can be installed and aligned or the height difference can be adjusted with respect to the cooling device, the vapor chamber, and the heat generating element in a better way. In the meantime, the heat dissipating device has an excellent shock absorbing capability.
To achieve the aforementioned and other objectives, this disclosure provides a heat dissipating device applied to a heat generating element and comprising: a cooling device; a vapor chamber attached to the heat generating element; and a heat pipe thermally attached to the cooling device and communicated with the vapor chamber and having at least one flexible portion.
This disclosure further has the following effects. The flexible portion includes a wrinkled ring or a spiral ring installed with an interval apart from the flexible portion, and the flexible portion contains a flexible capillary tissue therein, so that the flexible portion will not be hardened after it has been bent for several times, and the capillary tissue on the inner wall will not be peeled or fallen off easily, and the heat pipe can maintain its original structural integrity.
The technical contents of this disclosure will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and figures disclosed herein are to be considered illustrative rather than restrictive.
With reference to
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Further, the vapor chamber 3 has two joints 31 and contains a chamber 32 and a capillary member 33, wherein the capillary member 33 is a sintered powder, a metal mesh, a fiber member, a trench, or any combination of the above. The capillary member 33 is covered onto one or more side surfaces of the chamber 32.
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In addition, both ends of the heat pipe 4 are coupled to the two joints 31 respectively, and the interior of the heat pipe 4 and the chamber 32 are communicated with each other, and the capillary structure 43 and the capillary member 33 are attached, so that the heat pipe 4 and the vapor chamber 3 can be communicated with each other to exchange heat. In
In addition, a working fluid is filled into the heat pipe 4, and the working fluid includes pure water, ammonia water, methanol, acetone, heptane, or any mixture of the above, and the change of gas and liquid phases of the working fluid is used as a heat transmission mechanism.
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In addition, the circuit board 100 has different electronic components with height differences installed thereon. Since a conventional heat pipe needs to comply with electronic components of different height, it is common that the heat pipe is not attached onto the heat generating element closely. On the other hand, the flexible portion 41 of this disclosure can be adjusted and bent in up, down, left, and right directions, so that the heat pipe 4 can bypass a higher electronic component or closely attach the heat generating element 200 by means of the flexible portion 41.
In addition, the flexible portion 41 includes a wrinkled ring 411 installed with an interval apart from the flexible portion 41, and the flexible portion 41 contains a flexible capillary tissue 412, so that the flexible portion 41 will not be hardened after it has been bent for several times, and the capillary tissues on the inner wall will not be peeled or fallen off easily, so that the heat pipe 4 can maintain its original structural integrity.
In addition, the heat dissipating device 10 of this disclosure combines the powerful planar heat dispersion capability of the vapor chamber and the linear thermal expansion of the heat pipe and adopts the characteristics of the flexible portion 41 capable of absorbing vibrations effectively and adjusting positions easily to overcome the issues of mechanical vibration and assembly tolerance of the heat dissipating device 10.
With reference to
Specifically, one or more smooth sections 42 can be bent into one or more curved sections 421, and a part of the heat pipe 4 is bent into an L-shape or a U-shape through the curved section 421, and the curved section 441 matches with the flexible portion 41, so that the heat pipe 4 can be used in different circuit boards and electronic components with a height difference installed on a circuit board. Meanwhile, the heat pipe 4 can be attached to the heat generating element closely.
With reference to
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
Claims
1. A heat dissipating device, applied to a heat generating element, comprising:
- a cooling device;
- a plate-shaped vapor chamber, attached to the heat generating element; and
- a heat pipe, thermally attached to the cooling device and communicated with the plate-shaped vapor chamber, and having at least one flexible portion,
- wherein the plate-shaped vapor chamber has a hollow interior, and a width of the plate-shaped vapor chamber is larger than that of the heat pipe.
2. The heat dissipating device according to claim 1, wherein the flexible portion includes a wrinkled ring and at least one flexible capillary tissue selected from the group consisting a metal mesh and a fiber member.
3. The heat dissipating device according to claim 2, wherein the heat pipe has two smooth sections disposed at both ends of the flexible portion respectively, and the smooth section is covered by a capillary structure therein, and the flexible capillary tissue is disposed across and attached to the capillary structure, and the capillary structure is formed by one or more elements selected from the group consisting of a sintered powder, a metal mesh, a fiber member and a trench.
4. The heat dissipating device according to claim 3, wherein the heat pipe comprises at least two main-body tubes and at least one mid-section tube, and the two main-body tubes are passed to or sheathed on both ends of the mid-section tube respectively, and the flexible portion is formed on the mid-section tube, and each of the smooth sections is formed on each respective main-body tube.
5. The heat dissipating device according to claim 4, wherein each of the main-body tubes is fixed to the mid-section tube by soldering.
6. The heat dissipating device according to claim 3, wherein the flexible portion and the two smooth sections are integrally extended and formed.
7. The heat dissipating device according to claim 3, wherein at least one of the smooth sections is bent into at least one curved section, and a part of the heat pipe is bent into an L-shape or a U-shape through the curved section.
8. The heat dissipating device according to claim 3, wherein the plate-shaped vapor chamber has two joints and contains a chamber and a capillary member therein, and the capillary structure is covered onto at least one side surface of the chamber, and both ends of the heat pipe are fixed to the two joints respectively, and the interior of the heat pipe and the chamber are communicated with each other, and the capillary structure and the capillary member are attached with each other, and the capillary member is formed by one or more elements selected from the group consisting of a sintered powder, a metal mesh, a fiber member and a trench.
9. The heat dissipating device according to claim 1, wherein the flexible portion includes a spiral ring, and the spiral ring contains at least one flexible capillary tissue therein, and the flexible capillary tissue is formed by one or more elements selected from the group consisting of a metal mesh and a fiber member.
10. The heat dissipating device according to claim 9, wherein the heat pipe has two smooth sections disposed at both ends of the flexible portion respectively, and the interior of the smooth section is covered with a capillary structure, and the flexible capillary tissue is disposed across and attached to the capillary structure, and the capillary structure is formed by one or more elements selected from the group consisting of a sintered powder, a metal mesh, a fiber member, and a trench.
11. The heat dissipating device according to claim 10, wherein the heat pipe includes at least two main-body tubes and at least one mid-section tube, and the two main-body tubes are passed to or sheathed on both ends of the mid-section tube respectively, and the flexible portion is formed on the mid-section tube, and each of the smooth sections is formed on each respective main-body tube.
12. The heat dissipating device according to claim 11, wherein each of the main-body tubes and the mid-section tube are coupled to each other by soldering.
13. The heat dissipating device according to claim 10, wherein the flexible portion and the two smooth sections are integrally extended and formed.
14. The heat dissipating device according to claim 10, wherein at least one of the smooth sections is bent into at least one curved section, and a part of the heat pipe is bent into an L-shape or a U-shape through the curved section.
15. The heat dissipating device according to claim 10, wherein the plate-shaped vapor chamber has two joints and contains a chamber and a capillary member, and the capillary structure is covered onto at least one side surface of the chamber, and both ends of the heat pipe are coupled to the two joints respectively, and the interior of the heat pipe and the chamber are communicated with each other, and the capillary structure and the capillary member are attached to one another, and the capillary member includes one or more elements selected from the group consisting of a sintered powder, a metal mesh, a fiber member, and a trench.
16. The heat dissipating device according to claim 1, wherein the cooling device is a fin module or a water cooling device, and the fin module or the water cooling device has a passing portion, and the heat pipe is passed and coupled to the passing portion.
Type: Application
Filed: Jul 26, 2016
Publication Date: Feb 1, 2018
Inventors: Cheng-Tu WANG (NEW TAIPEI CITY), Shih-Ming WANG (NEW TAIPEI CITY), Wen-Wei TAI (NEW TAIPEI CITY)
Application Number: 15/219,898