Patents by Inventor Wen Wen

Wen Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7869017
    Abstract: One embodiment of the invention provides an test apparatus having a plurality of combinations of object distances and being used for testing an optical device. The test apparatus comprises at least one reflector, at least one first target module and at least one second target module. The first target module is for forming a first patterned light beam being shed on the optical device. The second target module is for forming a second patterned light beam being reflected by the reflector and then shed on the optical device. The third target module is for forming a quasi-parallel third patterned light beam being shed on the optical device. The distance between the first target module and the optical device is smaller than the distance between the second target module and the optical device.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: January 11, 2011
    Assignee: UMA Technology Inc.
    Inventors: Chang Yuan Lee, Wen Wen Teng
  • Publication number: 20100289006
    Abstract: Novel blue organic compound is provided. Using the blue organic compound, an organic electroluminescent device is provided, which achieved a blue emission with high efficiency, saturated color and long device lifetime. The novel blue organic compound is represented by the following general formula (1). wherein R1, R2, R3, and R4 represent a substituted or unsubstituted aryl group from 6 to 20 carbon atoms, in which R1, R2, R3, and R4 may be identical with or different from each other, or R1-R2 and R3-R4 may be bridged to 5 to 7-membered carbocyclic ring. R5 to R16 represent hydrogen or a substituted or unsubstituted alkyl or aryl group from 1 to 10 carbon atoms. Besides, R1-R5, R2-R6, R3-R15, R4-R16, R5-R7, R6-R8, R9-R11, R10-R12, R13-R15 and R14-R16 may be bridged to a carbocyclic ring from 3 to 10 carbon atoms.
    Type: Application
    Filed: July 11, 2007
    Publication date: November 18, 2010
    Inventors: Chin-Hsin Chen, Yao-Shan Wu, Meng-Huan Ho, Shih-Wen Wen
  • Publication number: 20100191714
    Abstract: A method and system for updating searches on an online auction site are described. In one embodiment, a database of auction postings is automatically searched based upon at least one search criteria to produce at least one new search result. The at least one new search result is compared with at least one previous search result. In addition, an e-mail notification of the result of the comparison is sent to a user notifying a user of the comparison.
    Type: Application
    Filed: March 31, 2010
    Publication date: July 29, 2010
    Inventors: Wen Wen, Patricia Ng
  • Publication number: 20100165329
    Abstract: One embodiment of the invention provides a lens-testing apparatus being used for testing a lens device. The lens-testing apparatus comprises a light module, at least one first and second image sensors, and at least one image sensor module. The light module generates a patterned light beam passing the lens device. The first and second image sensors receive first and second portions of the patterned light beam; the first image sensor is disposed between the second image sensor and the lens device. The image sensor module receives a substantially parallel third portion of the patterned light beam, and comprises a third image sensor and a collimator. The third portion of the patterned light beam is focused onto the third image sensor by the collimator; the distance between the first image sensor and the lens device is smaller than the distance between the second image sensor and the lens device.
    Type: Application
    Filed: August 14, 2009
    Publication date: July 1, 2010
    Inventors: Chang Yuan LEE, Wen Wen Teng, Chungying Kuo
  • Publication number: 20100141962
    Abstract: One embodiment of the invention provides an test apparatus having a plurality of combinations of object distances and being used for testing an optical device. The test apparatus comprises at least one reflector, at least one first target module and at least one second target module. The first target module is for forming a first patterned light beam being shed on the optical device. The second target module is for forming a second patterned light beam being reflected by the reflector and then shed on the optical device. The third target module is for forming a quasi-parallel third patterned light beam being shed on the optical device. The distance between the first target module and the optical device is smaller than the distance between the second target module and the optical device.
    Type: Application
    Filed: August 14, 2009
    Publication date: June 10, 2010
    Inventors: Chang Yuan LEE, Wen Wen Teng
  • Publication number: 20100141632
    Abstract: A liquid crystal display includes a liquid crystal panel switchable between normal mode for displaying images and standby mode, a control circuit coupled to the liquid crystal panel controlling the liquid crystal panel mode according to video signals transmitted thereto, and a power board providing a power voltage to the control circuit. When the liquid crystal panel is in a standby mode, the control circuit outputs a corresponding feedback signal to interrupt power voltage supply from the power board to the control circuit.
    Type: Application
    Filed: November 17, 2009
    Publication date: June 10, 2010
    Applicants: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD., INNOLUX DISPLAY CORP.
    Inventors: Wen-Wen LI, Shih-Wei CHEN, Ying-Xiang CHENG
  • Patent number: 7720833
    Abstract: A method and system for updating searches on an online auction site are described. In one embodiment, a database of auction postings is automatically searched based upon at least one search criteria to produce at least one new search result. The at least one new search result is compared with at least one previous search result. In addition, an e-mail notification of the result of the comparison is sent to a user notifying a user of the comparison.
    Type: Grant
    Filed: March 29, 2000
    Date of Patent: May 18, 2010
    Assignee: eBay Inc.
    Inventors: Wen Wen, Patricia Ng
  • Publication number: 20080129483
    Abstract: The evolutionary vehicle LED lighting apparatus is essentially formed of a power supply circuit for supplying the power to the apparatus, a microcomputer detecting and control unit, and a LED driving circuit installed at the output side of the power source. Upon detecting the power is on, the hardware built in the microcomputer detecting and control unit works to actuate the LED driving circuit so as to evolutionarily turn on the LEDS outwardly until, I all the LEDS are lit. Upon detecting the power is shut out, the microcomputer detecting and control unit actuates the LED driving circuit to turn off the LEDS in the reverse manner as they have been turned on thereby achieving the legibility and alarming effect of the vehicle lights rhythmically including both the brake light and the directional lights, also the operation method of this apparatus is disclosed.
    Type: Application
    Filed: November 30, 2006
    Publication date: June 5, 2008
    Inventor: Chia-Wen Wen
  • Publication number: 20080038587
    Abstract: The claimed invention relates to compounds of the formula (I): wherein X, Y, Ar1, Ar2, Ar3 and Ar4 are as defined in the specification. The claimed invention also relates to the preparation processes of the said compounds and their uses in the organic electroluminescent device.
    Type: Application
    Filed: June 28, 2007
    Publication date: February 14, 2008
    Applicant: E-RAY OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shih-Wen Wen, Yao-Shan Wu, Huang-Ming Kau
  • Publication number: 20070271535
    Abstract: The present invention discloses a method for crosstalk elimination in high-performance processors. The method, based on the combination of a deassembler and an assembler, eliminates crosstalk with fewer extra wires. The method of the present invention includes the steps of: deassembling a first piece of data to a plurality of data segments; conducting a parallel crosstalk check on the data segments to form a second piece of data that is crosstalk-free; and restoring the first piece of data based on the second piece of data. The present invention also discloses a bus architecture performing the method for crosstalk elimination, which includes a deassembler, a transmission bus and an assembler.
    Type: Application
    Filed: May 16, 2006
    Publication date: November 22, 2007
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Ting Ting Hwang, Wen Wen Hsieh
  • Publication number: 20060104079
    Abstract: The present invention provides an illuminating device that casts light in various directions and can be hung on an instrument. The illuminating device includes a bundle of at least one plastic optical fiber and at least one fastener. In use, the bundle is hung on the instrument because of the fastener. The bundle is connected with a light source at an end and can be directed in various directions at an opposite end because of the flexibility of the bundle in order to provide an optimal illuminative effect.
    Type: Application
    Filed: November 15, 2004
    Publication date: May 18, 2006
    Inventors: Chien-Shun Chen, Wen-Wen Lin
  • Patent number: 6967400
    Abstract: An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance. The spacer has at least two columns fixedly connected between the substrate and the cover.
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: November 22, 2005
    Inventor: Wen-Wen Chiu
  • Patent number: 6798053
    Abstract: An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: September 28, 2004
    Inventor: Wen-Wen Chiu
  • Publication number: 20040183169
    Abstract: An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance. The spacer has at least two columns fixedly connected between the substrate and the cover.
    Type: Application
    Filed: January 27, 2004
    Publication date: September 23, 2004
    Inventor: Wen-Wen Chiu
  • Patent number: 6782612
    Abstract: The present invention is to provide a manufacturing process of an integrated circuit module comprising the following steps: (a) providing a circuit board, which has at least one module circuit pattern thereon, said circuit pattern having at least one chip assembly area and an electronic element assembly area; (b) mounting at least one substrate on said at least one chip assembly area; said substrate is provided thereon with at least one connecting circuit pattern which is electrically connected to the at least one module circuit pattern of said circuit board; (c) mounting at least one IC chip on said at least one substrate such that said IC chip is electrically connected to said connecting circuit pattern of the substrate.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: August 31, 2004
    Inventor: Wen-Wen Chiu
  • Patent number: 6729820
    Abstract: A blind rivet. The blind rivet includes a rivet, a stopper, and a shaft. The rivet includes a cylindrical body and a brim at one end of the cylindrical body. The stopper includes a first end, a second end, and a cone connected between the first end and the second end. The first end includes a braking structure, and the shaft includes a neck extended from one end of the shaft body and connected to the second end of the stopper.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: May 4, 2004
    Assignee: Sedate Trading Corporation
    Inventor: Wen Wen Kuo
  • Publication number: 20030218868
    Abstract: The present invention is to provide a multi-chip module including a substrate, at least a chip, a plurality of bonding wires, and a cover body. The substrate has a top surface, a bottom surface, and at least a receiving chamber recessed inward from the top surface toward the bottom surface of the substrate. The chip is fixedly received in the receiving chamber and provided with a plurality of bonding pads. Each of the bonding wires has one end electrically connected to one of the bonding pads of the chip and the other end substantially horizontally electrically connected to a conductive pattern of the substrate. The cover body is fixedly mounted on the top surface of the substrate for covering the receiving chamber and isolating the chip from the outside, whereby the cover body is extremely adjacently mounted on the top surface of the substrate to effectively reduce the overall thickness of the module.
    Type: Application
    Filed: May 24, 2002
    Publication date: November 27, 2003
    Inventor: Wen-Wen Chiu
  • Publication number: 20030131471
    Abstract: The present invention is to provide a manufacturing process of an integrated circuit module comprising the following steps: (a) providing a circuit board, which has at least one module circuit pattern thereon, said circuit pattern having at least one chip assembly area and an electronic element assembly area; (b) mounting at least one substrate on said at least one chip assembly area; said substrate is provided thereon with at least one connecting circuit pattern which is electrically connected to the at least one module circuit pattern of said circuit board; (c) mounting at least one IC chip on said at least one substrate such that said IC chip is electrically connected to said connecting circuit pattern of the substrate.
    Type: Application
    Filed: January 16, 2002
    Publication date: July 17, 2003
    Inventor: Wen-Wen Chiu
  • Patent number: 6556363
    Abstract: A lens module is fixed on a board body which is provided thereon with an imaging chip. The lens module comprises a seat body in which at least one lens is fixed for passage of rays of light from the outside of the seat body so as to form an image on the chip. An expandable tube is sandwiched between the seat body and the board body and is provided with a serpentine segment. A closed passage is formed between the lens and the chip. The expandable tube is provided thereon with a fixation member for limiting deformation of the serpentine segment of the expandable tube.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: April 29, 2003
    Inventor: Wen-Wen Chiu
  • Publication number: 20030011904
    Abstract: A lens module is fixed on a board body which is provided thereon with an imaging chip. The lens module comprises a seat body in which at least one lens is fixed for passage of rays of light from the outside of the seat body so as to form an image on the chip. An expandable tube is sandwiched between the seat body and the board body and is provided with a serpentine segment. A closed passage is formed between the lens and the chip. The expandable tube is provided thereon with a fixation member for limiting deformation of the serpentine segment of the expandable tube.
    Type: Application
    Filed: October 10, 2001
    Publication date: January 16, 2003
    Inventor: Wen-Wen Chiu