Abstract: A method to identify feature points associated with the heart valve movement, heart contraction or cardiac hemodynamics is revealed. The mechanocardiography (MCG) is a technology that makes use of vibrational waveforms acquired using at least one gravity sensor attached on one of the four heart valve auscultation sites on the body surface. The data of the electrocardiography (ECG) is recorded simultaneously with the MCG. The feature points are identified by comparing P, R and T points of synchronized ECG with the MCG spectrum. By the time sequences and amplitudes of the feature points, the method provides additional clinical information of cardiac cycle abnormalities for diagnosis.

Abstract: A function module with built-in heat dissipation device. The function module includes a first circuit board, a second circuit board, a first height-compensation heat spreader, a second height-compensation heat spreader, and a heat dissipation fin. The first circuit board has a first surface, a first and second device. The second circuit board has a second surface facing the first surface, a third device, and a fourth device. The first height-compensation heat spreader has a first face, contacting the first and second devices simultaneously, and a third face, opposite to the first face. The second height-compensation heat spreader has a second face, contacting the third and fourth devices simultaneously, and a fourth face, opposite to the second face. The heat dissipation fin is disposed between the first circuit board and the second circuit board.

Abstract: A low profile, vehicle mounted, in-motion tracking, satellite antenna includes a pair of antenna assemblies mounted in parallel on a rotatable platform. Each antenna assembly includes two subreflectors with a plastic matching element. The outputs of the two antenna assemblies are coupled with a single phase shifter. The combined outputs are retransmitted to a receiver inside the vehicle. The satellite antenna also includes a receiver for receiving channel selection data and/or for providing two-way communication with equipment inside the vehicle. The antennae, transmitter and receiver are self-powered by a storage device which is charged by a wind driven generator. A retractable radome lowers to a lower profile when the antenna is not in use.

Abstract: A front side bus module is disclosed. The front side bus module includes a high density interconnection substrate and a plurality of high speed devices, wherein the high speed devices are disposed on the high density interconnection substrate and electrically connected therethrough.

Abstract: A portable computer and system controlling method thereof. The portable computer includes a heat dissipating module, a microphone, a spectrum analysis module, and a controlling module. The heat dissipating module has a fan module. The fan module has a corresponding system acoustic level. The microphone collects surrounding noises, acoustically isolated from the fan module. The spectrum analysis module is connected to the microphone, analyzing the surrounding noises collected from the microphone to obtain a surrounding acoustic level. The controlling module has a predetermined temperature of the element, connected to the heat dissipating module and the spectrum analysis module, respectively. The predetermined temperature of the element substitutes for the maximum temperature, and the surrounding acoustic level substitutes for the maximum system acoustic level.

Abstract: A portable computer and system controlling method thereof. The portable computer includes a heat dissipating module, a microphone, a spectrum analysis module, and a controlling module. The heat dissipating module has a fan module. The fan module has a corresponding system acoustic level. The microphone collects surrounding noises, acoustically isolated from the fan module. The spectrum analysis module is connected to the microphone, analyzing the surrounding noises collected from the microphone to obtain a surrounding acoustic level. The controlling module has a predetermined temperature of the element, connected to the heat dissipating module and the spectrum analysis module, respectively. The predetermined temperature of the element substitutes for the maximum temperature, and the surrounding acoustic level substitutes for the maximum system acoustic level.

Abstract: A function module with built-in heat dissipation device. The function module includes a first circuit board, a second circuit board, a first height-compensation heat spreader, a second height-compensation heat spreader, and a heat dissipation fin. The first circuit board has a first surface, a first and second device. The second circuit board has a second surface facing the first surface, a third device, and a fourth device. The first height-compensation heat spreader has a first face, contacting the first and second devices simultaneously, and a third face, opposite to the first face. The second height-compensation heat spreader has a second face, contacting the third and fourth devices simultaneously, and a fourth face, opposite to the second face. The heat dissipation fin is disposed between the first circuit board and the second circuit board.

Abstract: A function module with a built-in heat dissipation fin. The function module includes a first circuit board, a second circuit board, and a heat dissipation fin. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The heat dissipation fin is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.

Abstract: A function module with a built-in plate-type heat dissipation device. The function module includes a first circuit board, a second circuit board, and a plate-type heat dissipation device. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The plate-type heat dissipation device is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.

Abstract: A function module and its manufacturing method. The function module includes a circuit board, a first device, a second device, a planarization member, and a plate-type heat dissipation device. The circuit board includes a surface. The first device is disposed on the surface. The second device is disposed on the surface, and the height of the second device is higher than the height of the first device. The planarization member, including a flat surface, is disposed on the surface in a manner such that the planarization member surrounds the first device and the second device. The height of the flat surface is not less than the height of the second device. The plate-type heat dissipation device is disposed on the flat surface.

Abstract: A joint connector is provided to shorten the connection length of interface so as to improve the noises caused by the length. The joint connector has a plurality of slots and at least one electrical contact in each slot. When printed circuit boards are linked together, the corresponding electrical contacts of two printed circuit boards are bonded to each other to serve as a communication interface.

Abstract: A front side bus module is disclosed. The front side bus module includes a high density interconnection substrate and a plurality of high speed devices, wherein the high speed devices are disposed on the high density interconnection substrate and electrically connected therethrough.

Abstract: An improved GPS signal receiver (and corresponding method of operation) includes a plurality of antenna elements each receiving a plurality of GPS signals (e.g., GPS LI signals or GPS L2 signals). A plurality of mixers (which correspond to the array of antenna elements) and a combining node convert the GPS signals received at the antenna elements in a frequency-division-multiplexed (FDM) manner over FDM frequency bands logically assigned to the antenna elements to produce a composite signal representing such GPS signals. An analog-to-digital converter converts an analog signal derived from the composite signal (which may be an intermediate frequency signal or a baseband signal) into a digital word stream. Demultiplexing logic extracts GPS signal components in the digital word stream. The GPS signal components correspond to the FDM frequency bands logically assigned to the antenna elements.

Abstract: The present invention relates a printed circuit board having jumper lines, and a method for making the printed circuit board. An isolation layer made of a dielectric material is coated on the line layer of the printed circuit board, and multiple pads are formed in the isolation layer, thereby exposing part of the line layer without covered by the isolation layer. A high conductive material is coated on the isolation layer to connect the multiple pads, thereby forming a planar jumper layer that is connected to the line layer through the circular pads. Thus, the planar jumper layer may be made simultaneously during fabrication of the printed circuit board, without having to perform the wire-bonding work.

Abstract: The present invention relates a printed circuit board having jumper lines, and a method for making the printed circuit board. An isolation layer made of a dielectric material is coated on the line layer of the printed circuit board, and multiple pads are formed in the isolation layer, thereby exposing part of the line layer without covered by the isolation layer. A high conductive material is coated on the isolation layer to connect the multiple pads, thereby forming a planar jumper layer that is connected to the line layer through the circular pads. Thus, the planar jumper layer may be made simultaneously during fabrication of the printed circuit board, without having to perform the wire-bonding work.

Abstract: The present invention relates to a method of shortening a microwave circuit and a printed circuit board made by using the method. The effective dielectric constant of the dielectric material of the microwave circuit may be increased, thereby efficiently achieving the purpose of shortening the size of the microwave circuit, thereby increasing the usage of the area of the circuit board, and thereby reducing production of noise.

Abstract: A low profile, vehicle mounted, in-motion tracking, satellite antenna includes a pair of antenna assemblies mounted in parallel on a rotatable platform. Each antenna assembly includes two subreflectors with a plastic matching element. The outputs of the two antenna assemblies are coupled with a single phase shifter. The combined outputs are retransmitted to a receiver inside the vehicle. The satellite antenna also includes a receiver for receiving channel selection data and/or for providing two-way communication with equipment inside the vehicle. The antennae, transmitter and receiver are self-powered by a storage device which is charged by a wind driven generator. A retractable radome lowers to a lower profile when the antenna is not in use.

Abstract: A method for making a planar inductor is disclosed. The inductor is made by using a core with high magnetic flux. Outside the substrate, a layer of insulator and conductive foil is securely mounted. Thereafter, copper traces are formed on the insulator. Before the copper traces are formed, holes are defined and metalized to provide electrical connection between conductive foils on opposite sides of the core, which forms a planar inductance. Furthermore, if the copper traces are breaking up in a predetermined location, the planar inductance becomes a transformer.

Abstract: A method is disclosed for determining a side-etching distance to compensate for the width of a wire to be formed on a printed circuit board. The wire is formed on a test board by etching off the copper foil on the test board with a film having the pattern of the wire. The wire is measured to find its resistance. The side-etching distance is obtained based on the formula: W=[(&rgr;/t)×L]×(1/R)±&sgr;, where W is the width of the wire, &rgr; is the resistance coefficient of the copper foil, t is the thickness of the copper foil, L is the length of the wire, and &sgr; is the side-etching distance.

Abstract: A flat, built-in resistor and capacitor has a substrate (10) made of dielectric material; a copper layer (12) formed on each surface of the substrate (10) and having an etched image (30) formed in each of the copper layers (12); a dielectric material layer (40) printed onto the copper layer (12) and filling up the etched image; and a resistance layer (50) printed onto the copper layer (12) and the dielectric material layer (40).