Patents by Inventor Wen-Yen Lin

Wen-Yen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating region
    Patent number: 6057179
    Abstract: A method and structure for packaging an integrated circuit with an encapsulant to be readily peeled away from a degating region is disclosed. By applying an additional processing operation before a solder mask is coated over the substrate or during a process for forming the solder mask, an adhesion between the solder mask and the encapsulant is altered to become weaker than the adhesion between the solder mask and the substrate so that the excess encapsulant can be easily peeled away from the degating region without damaging the substrate.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: May 2, 2000
    Assignee: Compeq Manufacturing Company Limited
    Inventors: Wen-Yen Lin, Ting-Chuan Lee