Patents by Inventor Wen Yen

Wen Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250046522
    Abstract: A miniaturized capacitor having built-in conductive leads includes a substrate, a main capacitor body, a plurality of conductive members and a plurality of conductive leads. The main capacitor body, disposed on the substrate, includes a capacitor unit and a packaging structure wrapping the capacitor unit. Each of the plurality of conductive members penetrates through the substrate, each of the plurality of conductive leads penetrates through the packaging structure, and the capacitor unit is connected with the plurality of conductive members via the plurality of conductive leads.
    Type: Application
    Filed: October 2, 2023
    Publication date: February 6, 2025
    Inventors: WEN-YEN HUANG, LI-KUN LU
  • Publication number: 20250029420
    Abstract: An electronic device includes an insulating substrate, an insulating layer, a first connecting element and a second connecting element. The insulating substrate includes a first via hole and a second via hole. The light-emitting unit is disposed on the insulating substrate. The insulating layer is disposed on the insulating substrate, wherein the light-emitting unit is not overlapped with the insulating layer. The first connecting element is electrically connected to and overlapped with the light-emitting unit, wherein the first connecting element is disposed in the first via hole of the insulating substrate. The second connecting element is electrically connected to and overlapped with the light-emitting unit, wherein the second connecting element is disposed in the second via hole of the insulating substrate.
    Type: Application
    Filed: October 8, 2024
    Publication date: January 23, 2025
    Applicant: Innolux Corporation
    Inventors: Chandra Lius, Kuan-Feng Lee, Tsung-Han Tsai, Chung-Wen Yen, Chiu-Lien Yang
  • Publication number: 20250020833
    Abstract: There is provided a lens including a first curved surface and a second curved surface. The first curved surface and the second curved surface have different focal distances and are arranged interlacedly along a radial direction of the lens.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 16, 2025
    Inventors: HUI-HSUAN CHEN, YEN-HUNG WANG, WEN-YEN SU
  • Patent number: 12194667
    Abstract: The present invention discloses a high temperature resistant outer layer covering aerogel composite material with low dielectric, high heat insulation and high fireproof characteristics and preparation method thereof. The method comprises steps of: (1) mixing hydrolysis, (2) condensation and dispersion, (3) structure molding, (4) atmospheric pressure drying, (5) outer layer covering, (6) curing molding and (7) surface treatment. In this technology, a trace amount of water-dispersible high temperature resistant glue is added to the aerogel sol in the step of condensation and dispersion, which is injected into the fiber-containing preformed structure, and dried at high temperature and atmospheric to prepare aerogel preformed materials. And then, the aerogel preformed materials are wrapped by a high temperature resistant material and cured to prepare the aerogel composite material with low dielectric, high heat insulation and high fireproof properties.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: January 14, 2025
    Assignee: Taiwan Aerogel Technology Material Co., Ltd.
    Inventors: Jean-Hong Chen, Cheng-Shu Chiang, Ya-Chi Ko, Chi-Hung Lo, Wen-Yen Hsu
  • Publication number: 20250015158
    Abstract: A method for fabricating semiconductor device includes the steps of first providing a substrate having a first region and a second region, forming a first bottom barrier metal (BBM) layer on the first region and the second region, forming a first work function metal (WFM) layer on the first BBM layer on the first region and the second region, and then forming a diffusion barrier layer on the first WFM layer.
    Type: Application
    Filed: September 18, 2024
    Publication date: January 9, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Fan Li, Wen-Yen Huang, Shih-Min Chou, Zhen Wu, Nien-Ting Ho, Chih-Chiang Wu, Ti-Bin Chen
  • Patent number: 12189442
    Abstract: A method for detecting heat dissipation is provided, including the following steps: sensing a core temperature of a heat emitting component of an electronic device; sensing current power of the heat emitting component when the core temperature is greater than or equal to a warning temperature; and transmitting an assembling check prompt and activating a thermal control circuit (TCC) when the current power is less than thermal design power (TDP) of the heat emitting component. An electronic device is further provided, to execute the method for detecting heat dissipation.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: January 7, 2025
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Kun-Hsin Chiang, Yu-Chieh Chang, Tang-Hui Liao, Wei-Hsian Chang, Wen-Yen Hsieh, Chih-Wei Kuo, Ming-Yi Huang, Ching-Chan Chu, Shun-Po Chang
  • Patent number: 12181726
    Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: December 31, 2024
    Assignee: LANTO ELECTRONIC LIMITED
    Inventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
  • Patent number: 12180067
    Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: December 31, 2024
    Assignee: InvenSense, Inc.
    Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
  • Publication number: 20240427746
    Abstract: A testing system for sensor data of a monitoring system including a server and multiple sensors is disclosed. The server includes a data pre-process module, a value classifying-computing module, and a value comparing module. The data pre-process module performs a data cleaning procedure to sensor data of the multiple sensors to generate multiple cleaned data. The value classifying-computing module computes a difference-value combination of multiple cleaned data of every two sensors in a designated order-direction. The value comparing module subtracts a measuring-accuracy value from every difference-value of each difference-value combination to obtain multiple second difference-value combinations, computes a first feature value of each second difference-value combination, and records a label to two sensors corresponding to one of the second difference-value combinations when a p-value corresponding to the first feature value of the second difference-value combination is determined to be less than a threshold.
    Type: Application
    Filed: November 2, 2023
    Publication date: December 26, 2024
    Inventors: Tse-Wen CHANG, Jewel TSAI, Te-Mei TU, Wen-Yen CHENG
  • Publication number: 20240422182
    Abstract: A method and an appliance for anomaly inspection based on correlations of packets are disclosed. The appliance (1) includes a processing unit (13), a first communication channel (C1), and a second communication channel (C2), wherein the first communication channel (C1) transmits a first packet under a first communication protocol (16) and the second communication channel (C2) transmits a second packet under a second communication protocol (17). The processing unit (13) performs a field breakdown procedure to the first packet and the second packet to respectively obtain multiple packet fields of the two packets, matching relevant fields of the two packets based on a correlation database (15) and computing the correlation of the relevant fields. Therefore, an alarm is made when the correlation of the relevant fields is different from an expected correlation type.
    Type: Application
    Filed: June 14, 2023
    Publication date: December 19, 2024
    Inventors: Wen-Yen TSAI, Hung-Sheng HUANG
  • Publication number: 20240411189
    Abstract: A circuit substrate with multiple voltage input ports. A substrate has an active area and a peripheral area surrounding the active area. A signal transmitting structure is disposed on the active area and the peripheral area. A conductive structure is disposed on the peripheral area, and is electrically connected to the signal transmitting structure. The conductive structure includes first conductive wiring, second conductive wiring, and converging wiring. At the first end of the converging wiring, the converging wiring receives a first signal from the first conductive wiring, and receives a second signal from the second conductive wiring. The converging wiring outputs a third signal to the signal transmitting structure through its second end. The third signal is a common voltage.
    Type: Application
    Filed: May 2, 2024
    Publication date: December 12, 2024
    Inventors: Mei-Hsiu PAN, Chung-Wen YEN, Shing-Fei CHEN
  • Patent number: 12161844
    Abstract: A support structure for a medicament container is disclosed that is arranged to accommodate an elongated plunger rod, where the support structure has at least one flexible element arranged to be moved in contact with, and to exert a force, on a distal end surface of the medicament container, wherein the at least one flexible element is provided with a contact member arranged to contact an outer surface of the plunger rod and to be moved out of contact with the plunger rod when moved in contact with the medicament container.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: December 10, 2024
    Assignee: SHL Medical AG
    Inventors: Wen-Yen Lee, Hsueh-Yi Chen
  • Patent number: 12164118
    Abstract: There is provided a lens including a first curved surface and a second curved surface. The first curved surface and the second curved surface have different focal distances and are arranged interlacedly along a radial direction of the lens.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: December 10, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Hui-Hsuan Chen, Yen-Hung Wang, Wen-Yen Su
  • Publication number: 20240395871
    Abstract: In an embodiment, a device includes: a gate structure on a channel region of a substrate; a gate mask on the gate structure, the gate mask including a first dielectric material and an impurity, a concentration of the impurity in the gate mask decreasing in a direction extending from an upper region of the gate mask to a lower region of the gate mask; a gate spacer on sidewalls of the gate mask and the gate structure, the gate spacer including the first dielectric material and the impurity, a concentration of the impurity in the gate spacer decreasing in a direction extending from an upper region of the gate spacer to a lower region of the gate spacer; and a source/drain region adjoining the gate spacer and the channel region.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Wei-Ting Chien, Wen-Yen Chen, Li-Ting Wang, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang
  • Patent number: 12154949
    Abstract: In an embodiment, a device includes: a gate structure on a channel region of a substrate; a gate mask on the gate structure, the gate mask including a first dielectric material and an impurity, a concentration of the impurity in the gate mask decreasing in a direction extending from an upper region of the gate mask to a lower region of the gate mask; a gate spacer on sidewalls of the gate mask and the gate structure, the gate spacer including the first dielectric material and the impurity, a concentration of the impurity in the gate spacer decreasing in a direction extending from an upper region of the gate spacer to a lower region of the gate spacer; and a source/drain region adjoining the gate spacer and the channel region.
    Type: Grant
    Filed: May 15, 2023
    Date of Patent: November 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Ting Chien, Wen-Yen Chen, Li-Ting Wang, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang
  • Patent number: 12147121
    Abstract: A backlight module includes a light-emitting element, a quantum dot film, an optical film and a light adjusting element. The light-emitting element is adapted to emit a blue light. The quantum dot film is adapted to converting a first portion and a second portion of the blue light into a red light and a green light, respectively. The optical film is disposed on the quantum dot film. The light adjusting element is disposed between the optical film and the quantum dot film. The light adjusting element has a first surface and a second surface respectively facing the quantum dot film and the optical film. The first surface has multiple first optical microstructures. The first optical microstructures include multiple cones protruding toward the quantum dot film. Moreover, a display apparatus including the backlight module is also provided.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: November 19, 2024
    Assignees: Nano Precision (SuZhou) CO., LTD., Coretronic Corporation
    Inventors: Wen-Yen Chiu, Chao-Hung Weng, Ming-Dah Liu, Hsin-Wei Chen, Yue-Feng Yang
  • Patent number: 12148764
    Abstract: An electronic device includes a substrate, a first bus line, a second bus line, a plurality of driving units, a first signal line and a second signal line. The first bus line is disposed on the substrate and outputs a first signal. The second bus line is disposed on the substrate and outputs a second signal. The driving units are disposed between the first bus line and the second bus line, and include a first driving unit and a second driving unit which are adjacent to each other. The first signal line is electrically connected to the first bus line and transmits the first signal to the first driving unit and the second driving unit. The second signal line is electrically connected to the second bus line and transmits the second signal to at least one of the first driving unit and the second driving unit.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: November 19, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Hsi-Chia Wu, Mei-Hsiu Pan, Tzu-Yi Liu, Chung-Wen Yen
  • Publication number: 20240379407
    Abstract: A method includes forming a first protruding fin and a second protruding fin over a base structure, with a trench located between the first protruding fin and the second protruding fin, depositing a trench-filling material extending into the trench, and performing a laser reflow process on the trench-filling material. In the reflow process, the trench-filling material has a temperature higher than a first melting point of the trench-filling material, and lower than a second melting point of the first protruding fin and the second protruding fin. After the laser reflow process, the trench-filling material is solidified. The method further includes patterning the trench-filling material, with a remaining portion of the trench-filling material forming a part of a gate stack, and forming a source/drain region on a side of the gate stack.
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: Wen-Yen Chen, Li-Ting Wang, Wan-Chen Hsieh, Bo-Cyuan Lu, Tai-Chun Huang, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20240377263
    Abstract: A temperature measuring apparatus for measuring a temperature of a substrate is described. A light emitting source that emits light signals such as laser pulses are applied to the substrate. A detector on the other side of the light emitting source receives the reflected laser pulses. The detector further receives emission signals associated with temperature or energy density that is radiated from the surface of the substrate. The temperature measuring apparatus determines the temperature of the substrate during a thermal process using the received laser pulses and the emission signals. To improve the signal to noise ratio of the reflected laser pulses, a polarizer may be used to polarize the laser pulses to have a S polarization. The angle in which the polarized laser pulses are applied towards the substrate may also be controlled to enhance the signal to noise ratio at the detector's end.
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: Tz-Shian CHEN, Yi-Chao WANG, Wen-Yen CHEN, Li-Ting WANG, Huicheng CHANG, Yee-Chia YEO
  • Patent number: 12142070
    Abstract: An electronic device includes a first substrate, a second substrate, a light-impermeable layer, a light-emitting unit, and a photosensor. The second substrate is opposite to the first substrate. The light-impermeable layer is disposed between the first substrate and the second substrate and includes a first opening and a second opening. The light-emitting unit is disposed between the first substrate and the second substrate and overlapped with the first opening. The photosensor is disposed on the first substrate and overlapped with the second opening.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: November 12, 2024
    Assignee: Innolux Corporation
    Inventors: Chandra Lius, Kuan-Feng Lee, Tsung-Han Tsai, Chung-Wen Yen, Chiu-Lien Yang