Patents by Inventor Wen Yen
Wen Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11955664Abstract: A battery module includes an insulating base, a pair of electrodes and multiple battery packs. Each electrode is installed to the insulating base and has a bridge portion and a wire connecting part exposed from the insulating base, and a pair of lugs is extended smoothly from each battery pack, and an end of at least a part of the lugs is attached to each bridge portion correspondingly. Therefore, the lug is not being twisted or deformed easily, and the battery module may have good conductive efficiency, long service life, and convenience of changing the battery pack.Type: GrantFiled: March 17, 2022Date of Patent: April 9, 2024Assignee: AMITA TECHNOLOGIES INC.Inventors: Chueh-Yu Ko, Hou-Chi Chen, Chia-Wen Yen, Ming-Hsiao Tsai
-
Patent number: 11955553Abstract: Embodiments disclosed herein relate to using an implantation process and a melting anneal process performed on a nanosecond scale to achieve a high surface concentration (surface pile up) dopant profile and a retrograde dopant profile simultaneously. In an embodiment, a method includes forming a source/drain structure in an active area on a substrate, the source/drain structure including a first region comprising germanium, implanting a first dopant into the first region of the source/drain structure to form an amorphous region in at least the first region of the source/drain structure, implanting a second dopant into the amorphous region containing the first dopant, and heating the source/drain structure to liquidize and convert at least the amorphous region into a crystalline region, the crystalline region containing the first dopant and the second dopant.Type: GrantFiled: February 24, 2023Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Su-Hao Liu, Kuo-Ju Chen, Wen-Yen Chen, Ying-Lang Wang, Liang-Yin Chen, Li-Ting Wang, Huicheng Chang
-
Publication number: 20240111116Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.Type: ApplicationFiled: December 7, 2023Publication date: April 4, 2024Applicant: Lanto Electronic LimitedInventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
-
Publication number: 20240103244Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.Type: ApplicationFiled: December 7, 2023Publication date: March 28, 2024Applicant: Lanto Electronic LimitedInventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
-
Patent number: 11939432Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.Type: GrantFiled: April 23, 2021Date of Patent: March 26, 2024Assignee: PROVIEW-MBD BIOTECH CO., LTD.Inventors: Yu-Chia Chang, Yunn-Kuen Chang, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai, Shuian-Yin Lin, Nai-Sheng Hsu, Tzu-Yu Lin
-
Patent number: 11939431Abstract: The present invention relates to a composition comprising an amino acid-modified polymer, a carboxypolysaccharide, and may further include a metal ion for anti-adhesion and vector application. More specifically, the invention relates to a thermosensitive composition having enhanced mechanical and improved water-erosion resistant properties for efficiently preventing tissue adhesions and can serve as a vector with bio-compatible, bio-degradable/absorbable, and in-vivo sustainable properties.Type: GrantFiled: April 23, 2021Date of Patent: March 26, 2024Assignee: PROVIEW-MBD BIOTECH CO., LTD.Inventors: Yu-Chia Chang, Yunn-Kuen Chang, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai, Shuian-Yin Lin, Nai-Sheng Hsu, Tzu-Yu Lin
-
Publication number: 20240088225Abstract: A method includes forming a gate stack on a first portion of a semiconductor substrate, removing a second portion of the semiconductor substrate on a side of the gate stack to form a recess, growing a semiconductor region starting from the recess, implanting the semiconductor region with an impurity, and performing a melt anneal on the semiconductor region. At least a portion of the semiconductor region is molten during the melt anneal.Type: ApplicationFiled: November 14, 2023Publication date: March 14, 2024Inventors: Su-Hao Liu, Wen-Yen Chen, Li-Heng Chen, Li-Ting Wang, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Ying-Lang Wang
-
Publication number: 20240079278Abstract: A method includes forming a pad layer. The pad layer includes a first portion over a first part of a semiconductor substrate, and a second portion over a second part of the semiconductor substrate. The first portion has a first thickness, and the second portion has a second thickness smaller than the first thickness. The semiconductor substrate is then annealed to form a first oxide layer over the first part of the semiconductor substrate, and a second oxide layer over the second part of the semiconductor substrate. The pad layer, the first oxide layer, and the second oxide layer are removed. A semiconductor layer is epitaxially grown over and contacting the first part and the second part of the semiconductor substrate.Type: ApplicationFiled: January 6, 2023Publication date: March 7, 2024Inventors: Jhih-Yong Han, Wen-Yen Chen, Yi-Ting Wu, Tsai-Yu Huang, Huicheng Chang, Yee-Chia Yeo
-
Patent number: 11913733Abstract: The present disclosure provides a heat transferring device and a heat transferring component thereof. The heat transferring device includes a heat transferring component, a lower plate and a positioning component. The heat transferring component is in a shape of pouch and includes at least one input end and at least one output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on an exterior of the heat transferring component. An end of the positioning component is connected to the lower plate.Type: GrantFiled: June 10, 2021Date of Patent: February 27, 2024Assignee: ASIA PACIFIC FUEL CELL TECHNOLOGIES, LTD.Inventors: Wei-Pin Lo, Wen-Yen Huang, Chin-Hsien Cheng
-
Patent number: 11892762Abstract: A projection apparatus includes a casing, a projection lens, a first and a second light source modules, a first and a second thermal modules respectively thermally coupled to the first and the second light source modules, and a first and a second fans. The casing includes a bottom cover having a first air inlet corresponding to the projection lens, a front cover, a rear cover having a second air inlet, a first and a second side covers, which define an internal space divided into a first and a second areas. The first air inlet is connected to the internal space. A first air outlet of the first side cover and the second air inlet are connected to the first area. The first and the second light source modules, the first and the second thermal modules, and the first and the second fans are disposed in the first area.Type: GrantFiled: June 21, 2022Date of Patent: February 6, 2024Assignee: Coretronic CorporationInventors: Chun-Ting Lin, Wen-Yen Chung
-
Patent number: 11892562Abstract: A performing device of an impulse-like gesture recognition system executes an impulse-like gesture recognition method. A performing procedure of the impulse-like gesture recognition method includes steps of: receiving a sensing signal from a sensing unit; determining a prediction with at least one impulse-like label according to the sensing frames by a deep learning-based model; and classifying at least one gesture event according to the prediction. The gesture event is classified to determine the motion of the user. Since the at least one impulse-like label is used to label at least one detection score of the deep learning-based model, the detection score is non-decreasing, reaction time of the at least one gesture event for an incoming gesture is fast, rapid consecutive gestures are easily decomposed, and an expensive post-processing is not needed.Type: GrantFiled: October 30, 2020Date of Patent: February 6, 2024Assignee: KaiKuTek Inc.Inventors: Mike Chun-Hung Wang, Chun-Hsuan Kuo, Wen-jyi Hwang, Guan-Sian Wu, Chieh Wu, Wen-Yen Chou, Yu-Feng Wu, Fang Li, Wen-Yen Chang
-
Patent number: 11886105Abstract: The present disclosure provides a base assembly of voice coil motor and a voice coil motor. The base assembly includes a base body having a first elastic piece connecting area, a lower elastic piece disposed on the first elastic piece connecting area, and a first terminal disposed in the base body. The first terminal has: a first conductive part disposed in the base body; a first terminal connecting part disposed on one side of the first conductive part and extending toward a direction away from the first conductive part, wherein a part of the first terminal connecting part protrudes from the first elastic piece connecting area and is connected with the lower elastic piece; and an engaging part disposed on one side of the first terminal connecting part and extending toward a direction away from the first terminal connecting part.Type: GrantFiled: October 28, 2021Date of Patent: January 30, 2024Assignee: Lanto Electronic LimitedInventors: Wen-Yen Huang, Fu-Yuan Wu, Shang-Yu Hsu, Meng-Ting Lin, BingBing Ma, Jie Du, Yu-Cheng Lin
-
Patent number: 11885976Abstract: An optical module includes a first side and a second side, and includes a movable portion, a fixed portion, a driving portion, a position-sensing portion, and a circuit board. The movable portion includes a holder for holding an optical element with an optical axis. The fixed portion includes a base and a circuit component, wherein the circuit component has an external electrical connection portion, and the movable portion is movably connected to the fixed portion. The driving portion is configured to drive the movable portion to move relative to the fixed portion. The position-sensing portion includes a position-sensing element, and the position-sensing element is configured to sense the position of the movable portion relative to the fixed portion.Type: GrantFiled: July 25, 2019Date of Patent: January 30, 2024Assignee: TDK TAIWAN CORP.Inventors: Fu-Yuan Wu, Shang-Yu Hsu, Yu-Cheng Lin, Yung-Ping Yang, Wen-Yen Huang, Tsung-Han Wu, Yi-Chun Cheng, Chen-Chi Kuo, Chia-Hsiu Liu, Ichitai Moto, Sin-Jhong Song
-
Publication number: 20240009801Abstract: A method of conditioning a polishing pad includes conditioning the polishing pad using a conditioner. The method includes detecting a roughness of the polishing pad following the conditioning. The method further includes tracking a number of iterations of the conditioning of the polishing pad. The method further includes outputting a signal for replacing the polishing pad in response to the number of iterations reaching an iteration limit. The method further includes repeating the conditioning in response to the detected roughness of the polishing pad being outside of a threshold roughness range and the number of iterations failing to reach the iteration limit.Type: ApplicationFiled: July 25, 2023Publication date: January 11, 2024Inventor: Wen Yen KUNG
-
Publication number: 20240004241Abstract: An electronic device includes a substrate, an organic layer, a first insulating layer, and a first spacer. The organic layer is disposed on the substrate and includes a first opening and a second opening. The first insulating layer includes a first portion in the first opening and a second portion connected to the first portion and on the organic layer. The first spacer is disposed on the substrate and overlaps the second portion. In a top view of the electronic device, the second portion between the first opening and the second opening has a first length, the first spacer has a second length, the organic layer between the first opening and the second opening has a third length. The first length is greater than or equal to the second length and less than or equal to the third length.Type: ApplicationFiled: September 20, 2023Publication date: January 4, 2024Inventors: Zong-Bai SHI, Hsiu-Tung LIN, Chung-Wen YEN, Wen-Bin HUNG, Yi-Pin JHAN
-
Publication number: 20230422418Abstract: An electronic device is provided, including a panel and a supporting sheet. The panel includes a foldable region with a folding axis. The supporting sheet is disposed under the panel, and includes a foldable portion and a first non-foldable portion. The foldable portion is overlapped with the foldable region. The first non-foldable portion is connected to the foldable portion, and includes a first part and a second part. The first part is located between the second part and the foldable portion. The first part has a first via, and the first part protrudes more in a first direction parallel to the folding axis with respect to the second part.Type: ApplicationFiled: May 12, 2023Publication date: December 28, 2023Inventors: Yuan-Lin WU, Mei-Chi HSU, Fu-Zhang KUO, Chung-Wen YEN
-
Publication number: 20230420563Abstract: A semiconductor device includes a field effect transistor disposed over a first main surface of a semiconductor substrate, a distributed Bragg reflector disposed over an opposing second main surface of the semiconductor substrate, and a conductive via disposed in the distributed Bragg reflector. The field effect transistor includes a gate structure and a source/drain region. The conductive via passes through the semiconductor substrate and is in direct electrical contact with the source/drain region. A metal silicide is formed in a portion of the source/drain region that is in contact with the conductive via, and thus can reduce contact resistance between the source/drain region and the conductive via. The source/drain region is laser annealed through an opening formed through the distributed Bragg reflector. The distributed Bragg reflector reduces or prevents thermal damage to other regions of the semiconductor device that are protected by the distributed Bragg reflector.Type: ApplicationFiled: June 24, 2022Publication date: December 28, 2023Inventors: Wen-Yen CHEN, Tsai-Yu HUANG, Yee-Chia YEO
-
Patent number: 11855146Abstract: A method includes forming a gate stack on a first portion of a semiconductor substrate, removing a second portion of the semiconductor substrate on a side of the gate stack to form a recess, growing a semiconductor region starting from the recess, implanting the semiconductor region with an impurity, and performing a melt anneal on the semiconductor region. At least a portion of the semiconductor region is molten during the melt anneal.Type: GrantFiled: January 17, 2022Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Su-Hao Liu, Wen-Yen Chen, Li-Heng Chen, Li-Ting Wang, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Ying-Lang Wang
-
Patent number: 11855506Abstract: The present disclosure provides a base assembly of voice coil motor and a voice coil motor. The base assembly includes a base body having an elastic piece connecting area with a protrusion; a lower elastic piece disposed on the elastic piece connecting area with a first connecting hole, a second connecting hole, and a first trench, the protrusion is exposed from the first connecting hole, and the first trench is disposed between the first connecting hole and the second connecting hole; a connecting piece; and a terminal having a conductive part and a terminal connecting part, wherein the conductive part is disposed in the base body, the terminal connecting part passes through the elastic piece connecting area and protrudes from the elastic piece connecting area, and a part of the terminal connecting part is exposed from the second connecting hole to be fixedly connected to the lower elastic piece.Type: GrantFiled: October 28, 2021Date of Patent: December 26, 2023Assignee: Lanto Electronic LimitedInventors: Wen-Yen Huang, Fu-Yuan Wu, Shang-Yu Hsu, Meng-Ting Lin, BingBing Ma, Jie Du, Yu-Cheng Lin
-
Patent number: 11841134Abstract: The light device with integrated scent atomization module includes a lighting module, a scent atomization module, and an airflow module. The lighting module includes a lighting element producing light, a socket element to a side of the lighting element, and a cap element to a side of the socket element. The scent atomization module is detachably joined to the socket element, and includes an atomizer, and a container adjacent to the atomizer. The airflow module is configured inside the lighting module. The composite lighting device can be mounted to an ordinary lamp socket and substituted for an ordinary light bulb. Through the scent atomization module's atomization of the essential oil stored in the container, scent is released outside of the composite lighting device to achieve air purification. The heat from the lighting element may also accelerate and make more fully the atomization of the scent atomization module.Type: GrantFiled: November 26, 2020Date of Patent: December 12, 2023Inventor: Yu-Wen Yen