Patents by Inventor Wenchao Wang

Wenchao Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9284211
    Abstract: Methods provide for post processing at least one flexible glass sheet with the step of providing the glass sheet with an initial shape. The method then further includes the step of flexing the glass sheet into a secondary shape from the initial shape. The method then further includes the step of post processing the glass sheet while biasing the glass sheet into the secondary shape. The method then still further includes the step of releasing the glass sheet to at least partially return to the initial shape.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: March 15, 2016
    Assignee: CORNING INCORPORATED
    Inventors: Jianqiang Gu, Jean-Marc Martin Gerard Jouanno, William Brashear Mattingly, III, Wenchao Wang, Yoshiki Yamashita, Rui Zhang
  • Patent number: 9266768
    Abstract: The present disclosure relates to high purity nickel molds for use in forming three dimensional glass substrates, along with methods of making three dimensional glass substrates. The mold compositions minimize imperfections in the formed glass substrates providing optical quality shaped glass articles for use in electronics applications.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: February 23, 2016
    Assignee: Corning Incorporated
    Inventors: Kristen Marie Horn, David Myron Lineman, Kevin Thomas Morris, Wenchao Wang
  • Publication number: 20150360993
    Abstract: A mold for shaping glass can be made by a method that includes providing a mold body having a shaping surface comprising at least about 90% nickel and modifying the composition of the shaping surface of the mold body by exposing the shaping surface to an oxidizing heat treatment. The oxidizing heat treatment may include a ramping heat treatment, a fixed heat treatment, or both the ramping heat treatment and the fixed heat treatment. The ramping heat treatment may include increasing a heating temperature at a rate from about 20° C./hour to about 500° C./hour to a temperature from about 700° C. to about 1000° C. The fixed heat treatment may include holding the heating temperature from about 700° C. to about 1000° C. for a holding time of at least about 5 minutes.
    Type: Application
    Filed: August 26, 2015
    Publication date: December 17, 2015
    Inventors: Kristen Marie Horn, David Myron Lineman, Kevin Thomas Morris, Wenchao Wang, Kim E. Womer
  • Publication number: 20150333964
    Abstract: A method for identifying an application scenario of a terminal device, where the method includes analyzing an application program running on a terminal device by means of compilation to obtain characteristic data of the application program; and determining, from a scenario characteristic data set according to the characteristic data of the application program, application scenario information corresponding to the characteristic data of the application program, where the scenario characteristic data set includes a correspondence between multiple types of application scenario information and characteristic data of multiple application programs. Because characteristic data of an application program is more likely to be unique in describing a corresponding application scenario, application scenario information corresponding to the characteristic data of the application program is relatively accurate.
    Type: Application
    Filed: July 30, 2015
    Publication date: November 19, 2015
    Inventors: Wenchao Wang, Yaocang Jia, Jing Zhu
  • Patent number: 9145323
    Abstract: A mold for shaping glass can be made by a method that includes providing a mold body having a shaping surface comprising at least about 90% nickel and modifying the composition of the shaping surface of the mold body by exposing the shaping surface to an oxidizing heat treatment. The oxidizing heat treatment may include a ramping heat treatment, a fixed heat treatment, or both the ramping heat treatment and the fixed heat treatment. The ramping heat treatment may include increasing a heating temperature at a rate from about 20° C./hour to about 500° C./hour to a temperature from about 700° C. to about 1000° C. The fixed heat treatment may include holding the heating temperature from about 700° C. to about 1000° C. for a holding time of at least about 5 minutes.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: September 29, 2015
    Assignee: Corning Incorporated
    Inventors: Kristen Marie Horn, David Myron Lineman, Kevin Thomas Morris, Wenchao Wang, Kim E Womer
  • Publication number: 20150041435
    Abstract: Methods provide for post processing at least one flexible glass sheet with the step of providing the glass sheet with an initial shape. The method then further includes the step of flexing the glass sheet into a secondary shape from the initial shape. The method then further includes the step of post processing the glass sheet while biasing the glass sheet into the secondary shape. The method then still further includes the step of releasing the glass sheet to at least partially return to the initial shape.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 12, 2015
    Inventors: Jianqiang Gu, Jean-Marc Martin Gerard Jouanno, William Brashear Mattingly, III, Wenchao Wang, Yoshiki Yamashita, Rui Zhang
  • Patent number: 8899470
    Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: December 2, 2014
    Assignee: Corning Incorporated
    Inventors: David M. Lineman, Wenchao Wang, Randy D. Ziegenhagen
  • Publication number: 20140331718
    Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.
    Type: Application
    Filed: July 28, 2014
    Publication date: November 13, 2014
    Inventors: David Myron Lineman, Wenchao Wang, Randy Dean Ziegenhagen
  • Publication number: 20140202211
    Abstract: A mold for shaping glass can be made by a method that includes providing a mold body having a shaping surface comprising at least about 90% nickel and modifying the composition of the shaping surface of the mold body by exposing the shaping surface to an oxidizing heat treatment. The oxidizing heat treatment may include a ramping heat treatment, a fixed heat treatment, or both the ramping heat treatment and the fixed heat treatment. The ramping heat treatment may include increasing a heating temperature at a rate from about 20° C./hour to about 500° C./hour to a temperature from about 700° C. to about 1000° C. The fixed heat treatment may include holding the heating temperature from about 700° C. to about 1000° C. for a holding time of at least about 5 minutes.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 24, 2014
    Applicant: CORNING INCORPORATED
    Inventors: Kristen Marie Horn, David Myron Lineman, Kevin Thomas Morris, Wenchao Wang, Kim E. Womer
  • Publication number: 20140206523
    Abstract: The present disclosure relates to high purity nickel molds for use in forming three dimensional glass substrates, along with methods of making three dimensional glass substrates. The mold compositions minimize imperfections in the formed glass substrates providing optical quality shaped glass articles for use in electronics applications.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 24, 2014
    Applicant: CORNING INCORPORATED
    Inventors: Kristen Marie Horn, David Myron Lineman, Kevin Thomas Morris, Wenchao Wang
  • Publication number: 20140026622
    Abstract: Methods and apparatus for convective heat treatment of thin glass sheets (17) are provided. The glass sheets (17) are held in a fixture (9) which has a processing volume (19) which has an open top and an open bottom. A bottom support system (15) supports the bottom edges of the glass sheets (17) without blocking a substantial portion of the processing volume's open bottom. A side support system (13) holds the vertical edge regions of the glass sheets during the convective heat treatment, thus reducing vibration and distortion (warp) of the sheets as a result of the heat treatment. The side support system (13) can include vertical members (33) having arms (37) that can include lips (73) for engaging the major surfaces of the glass sheets (17).
    Type: Application
    Filed: April 17, 2012
    Publication date: January 30, 2014
    Applicant: Corning Incorporated
    Inventor: Wenchao Wang
  • Patent number: 8067883
    Abstract: A hermetically sealed device comprising a spacing unit and a resistive heating element desirably having a closed-loop structure and process for hermetically sealing a device by using such heating element and spacing unit. The frit can form multiple closed-loops to prevent crack propagation. The heating element can be advantageously made of a metal such as Invar® and/or Kovar®. The invention enables hermetic frit sealing with low residual stress in the seal for large-area displays. The invention is particularly advantageous for hermetic sealing of OLED display devices having a large area, such as those above 10 inches (25 cm).
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: November 29, 2011
    Assignee: Corning Incorporated
    Inventor: Wenchao Wang
  • Patent number: 8025276
    Abstract: A mandrel 1 includes a top support 10, a first edge support 20, a bottom support 30, and a second edge support 40. The top support and first edge support make-up a first support section. The bottom support and second edge support make-up a second support section. The first support section and the second support section are disposed relative to one another so as to form an outer circumference. A jack 50 is coupled to the first and second support sections and is configured to move the first and second support sections relative to one another so as to adjust the outer circumference of the mandrel. A locking element 60 removably is coupled to the first and second support sections to selectively prevent relative movement between the first and second support sections.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: September 27, 2011
    Assignee: Corning Incorporated
    Inventors: Dale Madard Fisher, Jr., Elizabeth Mary Sturdevant, Wenchao Wang
  • Publication number: 20100038836
    Abstract: A mandrel 1 includes a top support 10, a first edge support 20, a bottom support 30, and a second edge support 40. The top support and first edge support make-up a first support section. The bottom support and second edge support make-up a second support section. The first support section and the second support section are disposed relative to one another so as to form an outer circumference. A jack 50 is coupled to the first and second support sections and is configured to move the first and second support sections relative to one another so as to adjust the outer circumference of the mandrel. A locking element 60 removably is coupled to the first and second support sections to selectively prevent relative movement between the first and second support sections.
    Type: Application
    Filed: March 27, 2009
    Publication date: February 18, 2010
    Inventors: Dale Madard Fisher, JR., Elizabeth Mary Sturdevant, Wenchao Wang
  • Publication number: 20090218320
    Abstract: An frit-sealed device comprising a resistive heating element having an electrically-closed-loop structure and process for frit-sealing a device by using such heating element. The element can be advantageously made of a metal such as Invar® and/or Kovar®. The invention enables hermetic frit sealing with low residual stress in the seal. The invention is particularly advantageous for hermetic sealing of OLED display devices.
    Type: Application
    Filed: February 29, 2008
    Publication date: September 3, 2009
    Inventor: Wenchao Wang
  • Publication number: 20090218932
    Abstract: A hermetically sealed device comprising a spacing unit and a resistive heating element desirably having a closed-loop structure and process for hermetically sealing a device by using such heating element and spacing unit. The frit can form multiple closed-loops to prevent crack propagation. The heating element can be advantageously made of a metal such as Invar® and/or Kovar®. The invention enables hermetic frit sealing with low residual stress in the seal for large-area displays. The invention is particularly advantageous for hermetic sealing of OLED display devices having a large area, such as those above 10 inches (25 cm).
    Type: Application
    Filed: February 29, 2008
    Publication date: September 3, 2009
    Inventor: Wenchao Wang
  • Publication number: 20090142608
    Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.
    Type: Application
    Filed: April 1, 2008
    Publication date: June 4, 2009
    Inventors: David M. Lineman, Wenchao Wang, Randy D. Ziegenhagen
  • Publication number: 20080290138
    Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising attaching an anchor material to at least a portion of one surface of the metal component, and then applying the ceramic material to at least a portion of the one surface of the metal component, such that after the ceramic material solidifies, the anchor material is substantially embedded in at least a portion of the ceramic material, thereby forming a mechanical bond between the metal component and the ceramic material via the anchor material. Also disclosed is an article comprising a metal component and a ceramic material mechanically bonded thereto through an anchor material attached to at least a portion of the metal component.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Inventors: David Myron Lineman, Wenchao Wang