Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.

Abstract: A resistive memory device includes a dielectric layer, a via connection structure, a stacked structure, and an insulating structure. The via connection structure is disposed in the dielectric layer. The stacked structure is disposed on the via connection structure and the dielectric layer. The insulating structure penetrates through the stacked structure in a vertical direction and divides the stacked structure into a first memory cell unit and a second memory cell unit. The first memory cell unit includes a first bottom electrode, and the second memory cell unit includes a second bottom electrode separated from the first bottom electrode by the insulating structure. The via connection structure is electrically connected with the first bottom electrode and the second bottom electrode.

Abstract: A RRAM device includes a bottom electrode, a resistive material layer, atop electrode, a hard mask and high work function sidewall parts. The bottom electrode, the resistive material layer, the top electrode and the hard mask are sequentially stacked on a substrate. The high work function sidewall parts cover sidewalls of the top electrode and sidewalls of the hard mask, thereby constituting a RRAM cell. A method of forming the RRAM device is also provided.

Abstract: A resistive random access memory (RRAM) structure includes a RRAM cell, spacers and a dielectric layer. The RRAM cell is disposed on a substrate. The spacers are disposed beside the RRAM cell, wherein widths of top surfaces of the spacers are larger than or equal to widths of bottom surfaces of the spacers. The dielectric layer blanketly covers the substrate and sandwiches the RRAM cell, wherein the spacers are located in the dielectric layer. A method for forming the resistive random access memory (RRAM) structure is also provided.

Abstract: An Ethernet communication circuit includes: an Ethernet cable connector for communicating data with other devices through an Ethernet cable; an Ethernet transformer coupled with the Ethernet cable connector and arranged to operably process signals transmitted from the Ethernet cable connector; an Ethernet physical layer circuit coupled with the Ethernet transformer and arranged to operably conduct physical layer operations on the signals transmitted from the Ethernet transformer; and a plurality of coupling capacitors respectively arranged between a portion of signal pins of the Ethernet physical layer circuit and the Ethernet transformer.

Abstract: A smart light control system includes a light source device and a controller. The light source device has a plurality of transparent parts and a plurality of sensors, and the sensors are separately disposed beside a light source, and the sensors correspond to the transparent parts in terms of position, wherein a channel is formed for light to pass through between each sensor and its corresponding transparent part, and in addition, the controller is connected with the sensors The sensors send sensed signals to the controller according to the brightness of light beams, and the brightness of the light source is adaptively adjusted by the controller so as to achieve the purpose of improving the control efficiency and safety of the light source through the smart control.

Abstract: A smart light control system includes a light source device and a controller. The light source device has a plurality of transparent parts and a plurality of sensors, and the sensors are separately disposed beside a light source, and the sensors correspond to the transparent parts in terms of position, wherein a channel is formed for light to pass through between each sensor and its corresponding transparent part, and in addition, the controller is connected with the sensors The sensors send sensed signals to the controller according to the brightness of light beams, and the brightness of the light source is adaptively adjusted by the controller so as to achieve the purpose of improving the control efficiency and safety of the light source through the smart control.

Abstract: A method of manipulating droplet in a programmable EWOD microelectrode array comprising multiple microelectrodes, comprising: constructing a bottom plate with multiple microelectrodes on a top surface of a substrate covered by a dielectric layer; the microelectrode coupled to at least one grounding elements of a grounding mechanism, a hydrophobic layer on the top of the dielectric layer and the grounding elements; manipulating the multiple microelectrodes to configure a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes, comprising: a first configured-electrode with multiple microelectrodes arranged in array, and at least one second adjacent configured-electrode adjacent to the first configured-electrode, the droplet disposed on the top of the first configured-electrode and overlapped with a portion of the second adjacent-configured-electrode; and manipulating one or more droplets among multiple configured-electrodes by sequentially activating and de-

Abstract: Disclosed herein is a device A device of the microelectrode array architecture, comprising: (a) a bottom plate comprising an array of multiple microelectrodes disposed on a top surface of a substrate covered by a dielectric layer; wherein each of the microelectrode is coupled to at least one grounding elements of a grounding mechanism, wherein a hydrophobic layer is disposed on the top of the dielectric layer and the grounding elements to make hydrophobic surfaces with the droplets; (b) a field programmability mechanism for programming a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes; and, (c) a system management unit, comprising: (i) a droplet manipulation unit; and (ii) a system control unit.

Abstract: A surgical kit comprising a suture retriever comprising a handle element coupling with an extending element, wherein the extending element is coupled with a hook portion; wherein the hook portion comprises a spiral structure and a suture collector comprising suture collecting elements forming one or more slits configured to receive a suture from the suture retriever and a base coupling both sides of the suture collecting elements.

Abstract: The system relates to filed-programmable lab-on-chip (FPLOC) microfluidic operations, fabrications, and programming based on Microelectrode Array Architecture are disclosed herein. The FPLOC device by employing the microelectrode array architecture may include the following: (a) a bottom plate comprising an array of multiple microelectrodes disposed on a top surface of a substrate covered by a dielectric layer; wherein each of the microelectrode is coupled to at least one grounding elements of a grounding mechanism, wherein a hydrophobic layer is disposed on the top of the dielectric layer and the grounding elements to make hydrophobic surfaces with the droplets; (b) a field programmability mechanism for programming a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes; and, (c) a FPLOC functional block, comprising: (i) I/O ports; (ii) a sample preparation unit; (iii) a droplet manipulation unit; (iv) a detection unit; and (iv) a system control unit.

Abstract: A mounting device for a light emitting diode (LED) includes an LED and a conductor connecting to the LED. The LED includes two electrode leads bending outward and each electrode lead has a distal end. A protrusion is formed from the bottom surface of the distal end. The conductor has two electrode boards. A mounting leadframe is formed and protrudes from the surface of each electrode board and corresponds to one of the electrode leads, and a mounting hole is formed in each electrode board at a position corresponding to one of the protrusions. In addition, the distal end of each electrode lead is inserted respectively into the corresponding mounting leadframe, and each protrusion engages the corresponding mounting hole. With the insertion of the LED into the conductor and the engagements between protrusions and mounting holes, the LED is securely and stably mounted on the conductor.

Abstract: The system relates to filed-programmable lab-on-chip (FPLOC) microfluidic operations, fabrications, and programming based on Microelectrode Array Architecture are disclosed herein. The FPLOC device by employing the microelectrode array architecture may include the following: (a) a bottom plate comprising an array of multiple microelectrodes disposed on a top surface of a substrate covered by a dielectric layer; wherein each of the microelectrode is coupled to at least one grounding elements of a grounding mechanism, wherein a hydrophobic layer is disposed on the top of the dielectric layer and the grounding elements to make hydrophobic surfaces with the droplets; (b) a field programmability mechanism for programming a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes; and, (c) a FPLOC functional block, comprising: (i) I/O ports; (ii) a sample preparation unit; (iii) a droplet manipulation unit; (iv) a detection unit; and (iv) a system control unit.

Abstract: Disclosed herein is a device A device of the microelectrode array architecture, comprising: (a) a bottom plate comprising an array of multiple microelectrodes disposed on a top surface of a substrate covered by a dielectric layer; wherein each of the microelectrode is coupled to at least one grounding elements of a grounding mechanism, wherein a hydrophobic layer is disposed on the top of the dielectric layer and the grounding elements to make hydrophobic surfaces with the droplets; (b) a field programmability mechanism for programming a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes; and, (c) a system management unit, comprising: (i) a droplet manipulation unit; and (ii) a system control unit.

Abstract: A method of manipulating droplet in a programmable EWOD microelectrode array comprising multiple microelectrodes, comprising: constructing a bottom plate with multiple microelectrodes on a top surface of a substrate covered by a dielectric layer; the microelectrode coupled to at least one grounding elements of a grounding mechanism, a hydrophobic layer on the top of the dielectric layer and the grounding elements; manipulating the multiple microelectrodes to configure a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes, comprising: a first configured-electrode with multiple microelectrodes arranged in array, and at least one second adjacent configured-electrode adjacent to the first configured-electrode, the droplet disposed on the top of the first configured-electrode and overlapped with a portion of the second adjacent-configured-electrode; and manipulating one or more droplets among multiple configured-electrodes by sequentially activating and de-

Abstract: The present invention relates to a height-adjustable chair, mainly comprising a first post, a second post, a lock clamp, a seat and a seatback. The first post is of a section of sleeve tube with a tripod mount for the chair to stand on the ground. The second post is also a section of sleeve tube permissible to rise and lower in the first post with a pivot brace and a plurality of support rods for holding the seat and the seatback of the chair. The second post is permitted to slide in and out freely in the first post. A quick-action lock clamp is fixed between the first post and second post, convenient for the operator to easily press the lock wrench for rising or lower the second post within the first post and adjust the height of the chair as it suits his gesture.