Patents by Inventor Wenhao Li

Wenhao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964920
    Abstract: Various embodiments disclosed relate to a method of forming a composite including a carbon composite structure. The method includes disposing a precursor composition on a substrate. The composition includes a porogen component, a carbon component, and a catalyst component. The method further includes irradiating the precursor composition to form the carbon composite structure.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: April 23, 2024
    Assignee: University of Massachusetts
    Inventors: James J. Watkins, Dong-Po Song, Wenhao Li
  • Publication number: 20240094330
    Abstract: A method and an apparatus for detecting a relative location between devices is disclosed. The detection method includes: obtaining a first target audio signal obtained by a first microphone of a device B; determining a first audio segment and a second audio segment based on a first target moment and the first target audio signal, where the first target moment is a moment determined in the first target audio signal based on a target amplitude; separately searching for the first audio segment and the second audio segment to obtain a first arrival moment and a second arrival moment; and determining a relative location between a device A and the device B based on the first arrival moment and the second arrival moment.
    Type: Application
    Filed: January 24, 2022
    Publication date: March 21, 2024
    Inventors: Qiang Xu, Chenhe Li, Yanshan He, Wenhao Wu, Shuai Wang, Hongxing Peng, Shiming Li
  • Publication number: 20240094881
    Abstract: An electronic device such as a voice-controlled speaker may have an array of strain gauges and light-emitting diodes. The light-emitting diodes may be configured to display dynamically adjustable button icons overlapping the strain gauges. Force measurements from the strain gauges may be used to adjust speaker output and other device operations.
    Type: Application
    Filed: July 18, 2023
    Publication date: March 21, 2024
    Inventors: Zhengyu Li, Ming Gao, Wenhao Wang, Yuanzhen Fan
  • Patent number: 11932965
    Abstract: Disclosed in the present invention is a nonlinear optical crystal. The chemical formula of the nonlinear optical crystal is MHgGeSe4, M being selected from Ba or Sr. The nonlinear optical crystal has no symmetrical center, belongs to an orthorhombic crystal system, and has a space group Ama2. The nonlinear optical crystal is an infrared nonlinear optical crystal, and has the advantages of great nonlinear optical effect, wide light transmitting band, high hardness, good mechanical properties, breakage resistance, deliquescence resistance, easiness in processing and preserving, etc. Also disclosed in the present invention are a method for preparing the nonlinear optical crystal and application thereof.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: March 19, 2024
    Assignee: TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY OF THE CHINESE ACADEMY OF SCIENCES
    Inventors: Jiyong Yao, Yangwu Guo, Zhuang Li, Wenhao Xing, Xiaoyu Luo
  • Patent number: 11936183
    Abstract: An energy Internet system, an energy routing conversion device, and an energy control method, relating to a field of energy information. An alternating-current (AC) side energy routing conversion device of the energy Internet system includes a plurality of first route ports, and a direct-current (DC) side energy routing conversion device includes a plurality of second route ports, where each second route port is connected to a corresponding first route port by means of a corresponding DC busbar. A plurality of energy devices are connected to a DC busbar by means of corresponding first AC/DC converters or first DC converters. The AC side energy routing conversion device and the DC side energy routing conversion device collect energy information of the energy devices and adjust energy of the energy devices on a basis of energy balance constraint conditions.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: March 19, 2024
    Assignee: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
    Inventors: Mingzhu Dong, Zhigang Zhao, Meng Huang, Xuefen Zhang, Shugong Nan, Shiyong Jiang, Meng Li, Wenqiang Tang, Peng Ren, Wu Wen, Lingjun Wang, Xiao Luo, Wenhao Wu, Jianjun Huang, Weijin Li, Yunhong Zeng, Bei Chen
  • Patent number: 11927098
    Abstract: A method and apparatus for controlling stratum deformation in a shield construction process, a non-volatile storage medium, and a processor are disclosed. The method includes: monitoring settlement characteristic parameters in a shield construction process; predicting a settlement proportion according to the settlement characteristic parameters, the settlement proportion being a ratio between a predicted settlement value and a corresponding settlement threshold; and determining construction parameters in the shield construction process according to the settlement proportion.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: March 12, 2024
    Assignees: CHINA RAILWAY 14TH BUREAU GROUP CO., LTD., CHINA RAILWAY SIYUAN SURVEY AND DESIGN GROUP CO., LTD.
    Inventors: Jian Chen, Mingqing Xiao, Chengzhen Wang, Xiuting Su, Shuchen Li, Feng Xue, Xiudong Li, Yankun Wu, Wenhao Sun
  • Patent number: 11930626
    Abstract: An inverter and a heat radiation structure thereof are provided. The heat radiation structure of the inverter includes a heat radiator for radiating heat from a heating element of the inverter, and a heat radiation fan for air-cooling the heat radiator. The heat radiator includes multiple heat radiation fins able to be air-cooled. The number of the heat radiator is at least two, and two adjacent heat radiators are a first heat radiator and a second heat radiator respectively. The heat radiation fan is provided between the first heat radiator and the second heat radiator, and the heat radiation fan is located on the tops of the heat radiation fins. In the heat radiation structure of the inverter, the heat radiation fan is capable of cooling the first heat radiator and the second heat radiator at the same time.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: March 12, 2024
    Assignee: Sungrow Power Supply Co., Ltd.
    Inventors: Renbin Yu, Jie Zhou, Peng Chen, Wenhao Li
  • Publication number: 20240057789
    Abstract: A child carrier includes: a seat portion; a buckle movably provided on the seat portion; a backrest portion connected to the seat portion and extending upward, the backrest portion having a plurality of adjustment holes formed therein from bottom to top; and a shoulder strap having a fixed end and a free end, the fixed end being fixed on a rear side of the backrest portion, the free end passing through one of the plurality of adjustment holes and being removably connected to the seat portion.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 22, 2024
    Inventors: Bo WU, Meifeng FAN, Wenhao LI
  • Publication number: 20240061194
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include an interconnect die in a first layer surrounded by a dielectric material; a processor integrated circuit (processor IC) and an integrated circuit (IC) in a second layer, the second layer on the first layer, wherein the interconnect die is electrically coupled to the processor IC and the IC by first interconnects having a pitch of less than 10 microns between adjacent first interconnects; a photonic integrated circuit (PIC) and a substrate in a third layer, the third layer on the second layer, wherein the PIC has an active surface, and wherein the active surface of the PIC is coupled to the IC by second interconnects having a pitch of less than 10 microns between adjacent second interconnects; and a fiber connector optically coupled to the active surface of the PIC.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Adel A. Elsherbini, David Hui, Haris Khan Niazi, Wenhao Li, Bhaskar Jyoti Krishnatreya, Henning Braunisch, Shawna M. Liff, Jiraporn Seangatith, Johanna M. Swan, Krishna Vasanth Valavala, Xavier Francois Brun, Feras Eid
  • Publication number: 20240063142
    Abstract: Multi-die packages including IC die crack mitigation features. Prior to the bonding of IC dies to a host substrate, the IC dies may be shaped, for example with a corner radius or chamfer. After bonding the shaped IC dies, a fill comprising at least one inorganic material may be deposited over the IC dies, for example to backfill a space between adjacent IC dies. With the benefit of a greater IC die sidewall slope and/or smoother surface topology associated with the shaping process, occurrences of stress cracking within the fill and concomitant damage to the IC dies may be reduced. Prior to depositing a fill, a barrier layer may be deposited over the IC die to prevent cracks that might form in the fill material from propagating into the IC die.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Adel Elsherbini, Wenhao Li, Bhaskar Jyoti Krishnatreya, Tushar Talukdar, Botao Zhang, Yi Shi, Haris Khan Niazi, Feras Eid, Nagatoshi Tsunoda, Xavier Brun, Mohammad Enamul Kabir, Omkar Karhade, Shawna Liff, Jiraporn Seangatith
  • Publication number: 20240063066
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die having a surface; a template structure having a first surface and an opposing second surface, wherein the first surface of the template structure is coupled to the surface of the first die, and wherein the template structure includes a cavity at the first surface and a through-template opening extending from a top surface of the cavity to the second surface of the template structure; and a second die within the cavity of the template structure and electrically coupled to the surface of the first die by interconnects having a pitch of less than 10 microns between adjacent interconnects.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Omkar G. Karhade, Tomita Yoshihiro, Adel A. Elsherbini, Bhaskar Jyoti Krishnatreya, Tushar Talukdar, Haris Khan Niazi, Yi Shi, Batao Zhang, Wenhao Li, Feras Eid
  • Publication number: 20240063089
    Abstract: Microelectronic devices, assemblies, and systems include a multichip composite device having one or more integrated circuit dies bonded to a base die and an inorganic dielectric material adjacent the integrated circuit dies and over the base die. The multichip composite device includes a dummy die, dummy vias, or integrated fluidic cooling channels laterally adjacent the integrated circuit dies to conduct heat from the base die.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Adel Elsherbini, Wenhao Li, Bhaskar Jyoti Krishnatreya, Debendra Mallik, Krishna Vasanth Valavala, Lei Jiang, Yoshihiro Tomita, Omkar Karhade, Haris Khan Niazi, Tushar Talukdar, Mohammad Enamul Kabir, Xavier Brun, Feras Eid
  • Publication number: 20240063143
    Abstract: Techniques and mechanisms to mitigate warping of a composite chiplet. In an embodiment, multiple via structures each extend through an insulator material in one of multiple levels of a composite chiplet. The insulator material extends around an integrated circuit (IC) component in the level. For a given one of the multiple via structures, a respective annular structure extends around the via structure to mitigate a compressive (or tensile) stress due to expansion (or contraction) of the via structure. In another embodiment, the composite chiplet additionally or alternatively comprises a structural support layer on the multiple levels, wherein the structural support layer has formed therein or thereon dummy via structures or a warpage compensation film.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Adel Elsherbini, Lance C. Hibbeler, Omkar Karhade, Chytra Pawashe, Kimin Jun, Feras Eid, Shawna Liff, Mohammad Enamul Kabir, Bhaskar Jyoti Krishnatreya, Tushar Talukdar, Wenhao Li
  • Publication number: 20240063091
    Abstract: Microelectronic devices, assemblies, and systems include a multichip composite device having one or more chiplets bonded to a base die and an inorganic dielectric material adjacent the chiplets and over the base die. The multichip composite device is coupled to a structural member that is made of or includes a heat conducting material, or has integrated fluidic cooling channels to conduct heat from the chiplets and the base die.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Adel Elsherbini, Feras Eid, Scot Kellar, Yoshihiro Tomita, Rajiv Mongia, Kimin Jun, Shawna Liff, Wenhao Li, Johanna Swan, Bhaskar Jyoti Krishnatreya, Debendra Mallik, Krishna Vasanth Valavala, Lei Jiang, Xavier Brun, Mohammad Enamul Kabir, Haris Khan Niazi, Jiraporn Seangatith, Thomas Sounart
  • Patent number: 11860057
    Abstract: A heterodyne one-dimensional grating measuring device and measuring method thereof, including a light source, a reading head, a photoelectric receiving module, and a signal processing system. The light source is configured to generate two linearly polarized lights having characteristics of overlapping, polarization orthogonal, and fixed frequency difference. The reading head is configured to receive two beams of polarized lights and be respectively incident on a surface of a moving measuring grating to generate a +1-order diffracted light and a ?1-order diffracted light. The photoelectric receiving module is configured to receive the +1-order diffracted light and the ?1-order diffracted light to form two paths of beat frequency signals. The signal processing system is configured to perform differential calculation on the two paths of the beat frequency signals to realize a displacement measurement of single diffraction of the measuring grating for four-fold optical subdivision.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: January 2, 2024
    Assignee: CHANGCHUN INSTITUTE OF OPTICS, FINE MECHANICS AND PHYSICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Wenhao Li, Zhaowu Liu, Wei Wang, Hongzhu Yu, Rigalantu Ji, Xuefeng Yao
  • Publication number: 20230413878
    Abstract: The present invention relates to a composition comprising a surfactant system comprising lecithin and a diterpene glycoside and/or a glucosylated diterpene glycoside, a non-polar phase comprising a flavor oil, and a polar phase. The invention further relates to a method for the preparation of the inventive composition, as well as to the use of the inventive composition for the preparation of a flavored beverage or personal care product. Moreover, the invention concerns a beverage or personal care product comprising the inventive composition.
    Type: Application
    Filed: December 14, 2021
    Publication date: December 28, 2023
    Applicant: Firmenich SA
    Inventors: Qiu-Min MA, Lei SHI, Wenhao LI
  • Publication number: 20230415807
    Abstract: A baby stroller and a lateral seat cover portion thereof are provided. The lateral seat cover portion of a baby stroller includes a fabric bag including an inner side fabric and an outer side fabric opposite to each other, a foldable plate wrapped in the fabric bag and located between the inner side fabric and the outer side fabric, and an auxiliary device. The foldable plate includes a first plate and a second plate pivotally connected, when a frame of the baby stroller in an unfolded state, the foldable plate is in an unfolded state. When the frame of the baby stroller is folded, the auxiliary device enables an outer side of the first plate and an outer side of the second plate to approach each other, thereby switching the foldable plate from the unfolded state to a folded state.
    Type: Application
    Filed: June 20, 2023
    Publication date: December 28, 2023
    Applicant: Wonderland Switzerland AG
    Inventors: Bo WU, Wenhao LI
  • Patent number: 11851692
    Abstract: Disclosed are an antimycin compound and a preparation method and use thereof. The preparation method comprises: fermenting a marine actinomycete (Streptomyces sp.4-7) with a preservation number CCTCCNO: M2020953 to obtain a fermented product and soaking and extracting the fermented product with ethyl acetate to obtain a crude extract; and carrying out separation and purification by normal-phase silica gel column chromatography, reversed-phase MPLC, and semi-preparative reversed-phase high-performance liquid chromatography. The invention has the advantages of resistance against Botrytis cinerea and Penicillium citrinum.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: December 26, 2023
    Assignee: NINGBO UNIVERSITY
    Inventors: Lijian Ding, Shan He, Wenhao Li, Weiyan Zhang, Yingying Wei
  • Patent number: 11856860
    Abstract: A liquid dispersion includes a matrix phase of polymerizable material and at least 10% by volume of solid conductive particles distributed throughout the matrix. The conductive particles may have an average particle size of less than approximately 100 nm, and the liquid dispersion may have a viscosity of less than approximately 100 Poise. Such a liquid dispersion may be printed or extruded and then cured to form a solid thin film. The content and distribution of conductive particles within the thin film may reach a percolation threshold such that the thin film may form a conductive layer. Polymer-based devices, such as nanovoided polymer (NVP)-based actuators may be formed by co-extrusion of a nanovoided polymer material between conductive polymer electrodes.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: December 26, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Spencer Allan Wells, Kenneth Diest, Wenhao Li, Sheng Ye, Renate Eva Klementine Landig, Andrew John Ouderkirk
  • Patent number: 11839314
    Abstract: A child carrier includes: a seat portion; a buckle movably provided on the seat portion; a backrest portion connected to the seat portion and extending upward, the backrest portion having a plurality of adjustment holes formed therein from bottom to top; and a shoulder strap having a fixed end and a free end, the fixed end being fixed on a rear side of the backrest portion, the free end passing through one of the plurality of adjustment holes and being removably connected to the seat portion.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: December 12, 2023
    Assignee: WONDERLAND SWITZERLAND AG
    Inventors: Bo Wu, Meifeng Fan, Wenhao Li